LPC2364FB100 PHILIPS [NXP Semiconductors], LPC2364FB100 Datasheet
LPC2364FB100
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LPC2364FB100 Summary of contents
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LPC2364/66/68 Single-chip 16-bit/32-bit microcontrollers 512 kB flash with ISP/IAP, Ethernet, USB 2.0, CAN, and 10-bit ADC/DAC Rev. 01 — 22 September 2006 1. General description The LPC2364/66/68 microcontrollers are based on a 16-bit/32-bit ARM7TDMI-S CPU with real-time emulation ...
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Philips Semiconductors Ethernet MAC with associated DMA controller. These functions reside on an independent AHB bus. USB 2.0 Full-Speed Device with on-chip PHY and associated DMA controller. Four UARTs with fractional baud rate generation, one with modem control I/O, one ...
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... LPC2366FBD100 LPC2368FBD100 4.1 Ordering options Table 2. Ordering options Type number Flash (kB) Local Ether. bus buff LPC2364FB100 128 8 16 LPC2366FB100 256 32 16 LPC2368FB100 512 32 16 LPC2364_66_68_1 Preliminary data sheet SRAM (kB) Ethernet USB ...
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Philips Semiconductors 5. Block diagram LPC2364/66/68 P0, P1, P2, 8/32 kB P3, P4 SRAM HIGH SPEED GP I/O CONTROLLERS 70 PINS TOTAL AHB2 ETHERNET 16 kB RMII(8) MAC WITH SRAM DMA EINT3 to EINT0 EXTERNAL INTERRUPTS P0 × ...
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Philips Semiconductors 6. Pinning information 6.1 Pinning Fig 2. LPC2364/66/68 pinning 6.2 Pin description Table 3. Pin description Symbol Pin Type location P0.0 to P0.31 I/O P0.0/RD1/ 46 I/O TXD3/SDA1 I O I/O P0.1/TD1/ 47 I/O RXD3/SCL1 O I I/O ...
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Philips Semiconductors Table 3. Pin description …continued Symbol Pin Type location P0.5/ 80 I/O I2SRX_WS/ I/O TD2/CAP2 P0.6/ 79 I/O I2SRX_SDA/ I/O SSEL1/MAT2.0 I/O O P0.7/ 78 I/O I2STX_CLK/ I/O SCK1/MAT2.1 I/O O P0.8/ 77 I/O I2STX_WS/ I/O ...
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Philips Semiconductors Table 3. Pin description …continued Symbol Pin Type location P0.17/CTS1/ 61 I/O MISO0/MISO I I/O I/O P0.18/DCD1/ 60 I/O MOSI0/MOSI I I/O I/O P0.19/DSR1/ 59 I/O MCICLK/SDA1 I O I/O P0.20/DTR1/ 58 I/O MCICMD/SCL1 O I I/O P0.21/RI1/ ...
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Philips Semiconductors Table 3. Pin description …continued Symbol Pin Type location P0.26/AD0.3/ 6 I/O AOUT/RXD3 P0.27/SDA0 25 I/O I/O P0.28/SCL0 24 I/O I/O P0.29/U1D+ 29 I/O I/O P0.30/U1D− 30 I/O I/O P1.0 to P1.31 I/O P1.0/ 95 ...
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Philips Semiconductors Table 3. Pin description …continued Symbol Pin Type location P1.19/CAP1.1 33 I/O I P1.20/PWM1.2/ 34 I/O SCK0 O I/O P1.21/PWM1.3/ 35 I/O SSEL0 O I/O P1.22/MAT1.0 36 I/O O P1.23/PWM1.4/ 37 I/O MISO0 O I/O P1.24/PWM1.5/ 38 I/O ...
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Philips Semiconductors Table 3. Pin description …continued Symbol Pin Type location P2.0/PWM1.1/ 75 I/O TXD1/ O TRACECLK O O P2.1/PWM1.2/ 74 I/O RXD1/ O PIPESTAT0 O O P2.2/PWM1.3/ 73 I/O CTS1/ O PIPESTAT1 I O P2.3/PWM1.4/ 70 I/O DCD1/ O ...
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Philips Semiconductors Table 3. Pin description …continued Symbol Pin Type location P2.9/ 64 I/O U1CONNECT/ O RXD2/ EXTIN0 I I P2.10/EINT0 53 I/O I P2.11/EINT1/ 52 I/O MCIDAT1/ I I2STX_CLK O I/O P2.12/EINT2/ 51 I/O MCIDAT2/ I I2STX_WS O I/O ...
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Philips Semiconductors Table 3. Pin description …continued Symbol Pin Type location TDI 2 I TMS 3 I TRST 4 I TCK 5 I RTCK 100 I/O RSTOUT 14 O RESET RTCX1 16 ...
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Philips Semiconductors The LPC2364/66/68 implements two AHB buses in order to allow the Ethernet block to operate without interference caused by other system activity. The primary AHB, referred to as AHB1, includes the Vectored Interrupt Controller, and General Purpose DMA ...
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Philips Semiconductors 7.2 On-chip flash programming memory The LPC2364/66/68 incorporate a 128 kB, 256 kB, and 512 kB flash memory system respectively. This memory may be used for both code and data storage. Programming of the flash memory may be ...
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Philips Semiconductors 4.0 GB 3.75 GB 3.5 GB 3.0 GB 2.0 GB 1.0 GB 0.0 GB Fig 3. LPC2364/66/68 memory map 7.5 Interrupt controller The ARM processor core has two interrupt inputs called Interrupt Request (IRQ) and Fast Interrupt Request ...
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Philips Semiconductors FIQs have the highest priority. If more than one request is assigned to FIQ, the VIC ORs the requests to produce the FIQ signal to the ARM processor. The fastest possible FIQ latency is achieved when only one ...
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Philips Semiconductors • Single DMA and burst DMA request signals. Each peripheral connected to the GPDMA can assert either a burst DMA request or a single DMA request. The DMA burst size is set by programming the GPDMA. • Memory-to-memory, ...
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Philips Semiconductors Additionally, any pin on PORT0 and PORT2 (total of 42 pins) providing a digital function can be programmed to generate an interrupt on a rising edge, a falling edge, or both. The edge detection is asynchronous ...
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Philips Semiconductors • Enhanced Ethernet features: – Receive filtering. – Multicast and broadcast frame support for both transmit and receive. – Optional automatic FCS insertion (CRC) for transmit. – Selectable automatic transmit frame padding. – Over-length frame support for both ...
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Philips Semiconductors • Allows dynamic switching between CPU-controlled and DMA modes. • Double buffer implementation for Bulk and Isochronous endpoints. 7.11 CAN controller and acceptance filters The Controller Area Network (CAN serial communications protocol which efficiently supports distributed ...
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Philips Semiconductors 7.13 10-bit DAC The DAC allows the LPC2364/66/68 to generate a variable analog output. The maximum output value of the DAC is V 7.13.1 Features • 10-bit DAC • Resistor string architecture • Buffered output • Power-down mode ...
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Philips Semiconductors 7.16 SSP serial I/O controller The LPC2364/66/68 each contain two SSP controllers. The SSP is a Synchronous Serial Port (SSP) controller capable of operation on a SPI, 4-wire SSI, or Microwire bus. It can interact with multiple masters ...
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Philips Semiconductors 2 The I C-bus implemented in LPC2364/66/68 supports bit rates up to 400 kbit/s (Fast 2 I C-bus). 7.18.1 Features • standard I • and I devices connected to the ...
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Philips Semiconductors 7.20 General purpose 32-bit timers/external event counters The LPC2364/66/68 include four 32-bit Timer/Counters. The Timer/Counter is designed to count cycles of the system derived clock or an externally-supplied clock. It can optionally generate interrupts or perform other actions ...
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Philips Semiconductors With double edge controlled PWM outputs, specific match registers control the rising and falling edge of the output. This allows both positive going PWM pulses (when the rising edge occurs prior to the falling edge), and negative going ...
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Philips Semiconductors • Selectable time period from (T multiples of T • The Watchdog clock (WDCLK) source can be selected from the RTC clock, the Internal RC oscillator (IRC), or the APB peripheral clock. This gives a wide range of ...
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Philips Semiconductors 7.24.1.1 Internal RC oscillator The Internal RC oscillator (IRC) may be used as the clock source for the watchdog timer, and/or as the clock that drives the PLL and subsequently the CPU. The nominal IRC frequency is 4 ...
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Philips Semiconductors whenever any of the aforementioned functions are turned off for any reason. Since the oscillator and other functions are turned off during Power-down mode, any wake-up of the processor from Power-down mode makes use of the wake-up Timer. ...
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Philips Semiconductors On the wake-up of sleep mode, if the IRC was used before entering sleep mode, the code execution and peripherals activities will resume after 4 cycles expire. If the main external oscillator was used, the code execution will ...
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Philips Semiconductors 7.25 System control 7.25.1 Reset Reset has four sources on the LPC2364/66/68: the RESET pin, the Watchdog Reset, Power On Reset (POR) and the Brown Out Detection circuit (BOD). The RESET pin is a Schmitt trigger input pin. ...
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Philips Semiconductors In summary, bus masters with access to AHB1 are the ARM7 itself, the USB block, the General Purpose DMA function, and the Ethernet block (via the bus bridge from AHB2). Bus masters with access to AHB2 are the ...
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Philips Semiconductors were executed. Instruction trace is significantly compressed by only broadcasting branch addresses as well as a set of status signals that indicate the pipeline status on a cycle by cycle basis. Trace information generation can be controlled by ...
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Philips Semiconductors 8. Limiting values Table 4. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter V supply voltage (core and external rail analog 3.3 V pad supply voltage DDA V input voltage ...
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Philips Semiconductors 9. Static characteristics Table 5. Static characteristics − ° ° +85 C for commercial applications, unless otherwise specified. amb Symbol Parameter V supply voltage DD(3V3) V analog 3.3 V pad supply DDA voltage ...
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Philips Semiconductors Table 5. Static characteristics …continued − ° ° +85 C for commercial applications, unless otherwise specified. amb Symbol Parameter I Core active mode DCDC(3V3)( supply current act) I Core Power-down DCDC(3V3)( mode supply ...
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Philips Semiconductors Table 5. Static characteristics …continued − ° ° +85 C for commercial applications, unless otherwise specified. amb Symbol Parameter V differential input DI sensitivity V differential common CM mode voltage range V single-ended ...
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Philips Semiconductors Table 6. ADC static characteristics − ° 2 3 +85 DDA amb Symbol Parameter E gain error G E absolute error T R voltage source interface vsi resistance ...
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Philips Semiconductors 1023 1022 1021 1020 1019 1018 7 code out offset error E O (1) Example of an actual transfer curve. (2) The ideal transfer curve. (3) Differential linearity ...
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Philips Semiconductors ADx.y SAMPLE Fig 5. Suggested ADC interface - LPC2364/66/68 AD0.y pin LPC2364_66_68_1 Preliminary data sheet LPC2364/2366/2368 LPC2364/66/ ADx Rev. 01 — 22 September 2006 Fast communication chip R vsi V ...
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Philips Semiconductors 10. Dynamic characteristics Table 7. Dynamic characteristics of USB pins (full-speed) Ω pF 1 Symbol Parameter t rise time r t fall time f t differential ...
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Philips Semiconductors 10.1 Timing V − 0 0.2V 0.2V DD 0.45 V Fig 6. External clock timing t PERIOD crossover point differential data lines differential data Fig 7. Differential data-to-EOP transition skew and EOP ...
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Philips Semiconductors 11. Application information 11.1 Suggested USB interface solutions LPC23XX Fig 8. LPC2364/66/68 USB interface on a self-powered device LPC23XX Fig 9. LPC2364/66/68 USB interface on a bus-powered device LPC2364_66_68_1 Preliminary data sheet LPC2364/2366/2368 V DD UP_LED CONNECT soft-connect ...
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Philips Semiconductors 12. Package outline LQFP100: plastic low profile quad flat package; 100 leads; body 1 pin 1 index 100 DIMENSIONS (mm are the ...
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Philips Semiconductors 13. Abbreviations Table 9. Acronym ADC AHB AMBA APB BOD CPU DAC DCC DMA ETM FIFO GPIO JTAG PHY PLL POR PWM RAM SPI SRAM SSP UART USB LPC2364_66_68_1 Preliminary data sheet Abbreviations Description Analog-to-Digital Converter Advanced High-performance ...
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Philips Semiconductors 14. Revision history Table 10. Revision history Document ID Release date LPC2364_66_68_1 20060922 LPC2364_66_68_1 Preliminary data sheet LPC2364/2366/2368 Data sheet status Change notice Preliminary data sheet - Rev. 01 — 22 September 2006 Fast communication chip Supersedes - ...
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Philips Semiconductors 15. Legal information 15.1 Data sheet status [1][2] Document status Product status Objective [short] data sheet Development Preliminary [short] data sheet Qualification Product [short] data sheet Production [1] Please consult the most recently issued document before initiating or ...
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Philips Semiconductors 17. Contents 1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features . . . . . . . . ...
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Philips Semiconductors 17 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47 LPC2364/2366/2368 Fast communication chip Please ...