24C01SC-S MicrochipTechnology, 24C01SC-S Datasheet
24C01SC-S
Related parts for 24C01SC-S
24C01SC-S Summary of contents
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... Electrically Erasable PROMs with bondpad positions optimized for smart card applications. The devices are organized as a sin- gle block of 128 x 8-bit or 256 x 8-bit memory with a two-wire serial interface. The 24C01SC and 24C02SC also have page-write capability for bytes of data trademark of Philips Corporation ...
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... ELECTRICAL CHARACTERISTICS Maximum Ratings* V ........................................................................ 7.0V CC All inputs and outputs w.r.t. V ...... -0. Storage temperature ...........................-65˚C to +150˚C Ambient temp. with power applied.......-65˚C to +125˚C ESD protection on all pads *Notice: Stresses above those listed under “Maximum ratings” may cause permanent damage to the device. This is a stress rat- ...
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... DAT SU DAT STA T AA Preliminary 24C01SC/02SC Remarks (Note 1) (Note 1) After this period the first clock pulse is generated Only relevant for repeated START condition (Note 2) (Note 2) Time the bus must be free before a new transmission can start (Note 1), CB 100 pF (Note 3) ...
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... START and STOP conditions, while the 24C01SC/02SC works as slave. Both master and slave can operate as transmitter or receiver, but the master device determines which mode is activated. ...
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... Page Write The write control byte, word address, and the first data byte are transmitted to the 24C01SC/02SC in the same way byte write. But instead of generating a stop condition, the master transmits up to eight data bytes to the 24C01SC/02SC, which are temporarily stored in ...
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... To perform this type of read operation, first the word address must be set. This is done by sending the word address to the 24C01SC/02SC as part of a write operation. After the word address is sent, the master generates a start con- dition following the acknowledge. This terminates the write operation, but not before the internal address pointer is set ...
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... Noise Protection The 24C01SC/02SC employs a V threshold detector CC circuit which disables the internal erase/write logic if the V is below 1.5 volts at nominal conditions. CC The SCL and SDA inputs have Schmitt trigger and filter circuits which suppress noise spikes to assure proper device operation even on a noisy bus. ...
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... This pad is used for test purposes and should not be bonded out. It will be pulled to V through an internal SS resistor. DS21170A-page 8 9.0 DIE CHARACTERISTICS Figure 9-1 shows the die layout of the 24C01SC/02SC, including bondpad positions. Table 9-1 shows the actual coordinates of the bondpad midpoints with respect to the center of the die. FIGURE 9-1: DIE LAYOUT DIP V ...
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... NOTES: 1996 Microchip Technology Inc. 24C01SC/02SC Preliminary DS21170A-page 9 ...
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... NOTES: DS21170A-page 10 Preliminary 1996 Microchip Technology Inc. ...
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... Product Identification System To order or to obtain information (e.g., on pricing or delivery), please use the listed part numbers, and refer to the factory or the listed sales offices. 24C01SC/02SC — 1996 Microchip Technology Inc. Die Thickness Blank = 11 mils mils Other die thicknesses available, please consult factory ...
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W ORLDWIDE AMERICAS Corporate Office Microchip Technology Inc. 2355 West Chandler Blvd. Chandler, AZ 85224-6199 Tel: 602 786-7200 Fax: 602 786-7277 Technical Support: 602 786-7627 Web: http://www.microchip.com/ Atlanta Microchip Technology Inc. 500 Sugar Mill Road, Suite 200B Atlanta, GA 30350 ...