MC14049UBDTEL ON Semiconductor, MC14049UBDTEL Datasheet

MC14049UBDTEL

Manufacturer Part Number

MC14049UBDTEL

Description

IC INVERTER HEX 1-INPUT 16TSSOP

Manufacturer

ON Semiconductor

Series

4000Br

Datasheet

1.MC14049UBCPG.pdf (8 pages)

Specifications of MC14049UBDTEL

Logic Type

Inverter

Number Of Inputs

Number Of Circuits

Current - Output High, Low

3.75mA, 24mA

Voltage - Supply

3 V ~ 18 V

Operating Temperature

-55°C ~ 125°C

Mounting Type

Surface Mount

Package / Case

16-TSSOP

Lead Free Status / RoHS Status

Contains lead / RoHS non-compliant

Available stocks

Company

Part Number

Manufacturer

Quantity

Price

Company:

Meier Automation Equipment Co., Limited

Part Number:

MC14049UBDTELG

Manufacturer:

ON/安森美

Quantity:

20 000

Current page: 1 of 8
Download datasheet (111Kb)

MC14049UB

Hex Buffers

P−channel and N−channel enhancement mode devices in a single

monolithic structure. This complementary MOS device finds primary

use where low power dissipation and/or high noise immunity is

desired. This device provides logic−level conversion using only one

supply voltage, V

Loads can be driven when the device is used as CMOS−to−TTL/DTL

converters (V

13 and 16 are not connected internally on this device; consequently

connections to these terminals will not affect circuit operation.

Features

1. Temperature Derating: All Packages: See Figure 4.

static voltages or electric fields referenced to the V

must be taken to avoid applications of any voltage higher than the maximum rated

voltages to this high−impedance circuit. For proper operation, the ranges V

either V

MAXIMUM RATINGS

December, 2004 − Rev. 6

Symbol

Maximum ratings are those values beyond which device damage can occur.

Maximum ratings applied to the device are individual stress limit values (not

normal operating conditions) and are not valid simultaneously. If these limits

are exceeded, device functional operation is not implied, damage may occur

and reliability may be affected.

The MC14049UB hex inverter/buffer is constructed with MOS

This device contains circuitry to protect the inputs against damage due to high

Unused inputs must always be tied to an appropriate logic voltage level (e.g.,

High Source and Sink Currents

High−to−Low Level Converter

Supply Voltage Range = 3.0 V to 18 V

Meets JEDEC UB Specifications

Improved ESD Protection on All Inputs

Pb−Free Packages are Available*

Semiconductor Components Industries, LLC, 2004

v 18 V and V

out

stg

supply voltage for logic−level conversions. Two TTL/DTL

can exceed V

or V

DC Supply Voltage Range

Input Voltage Range

Output Voltage Range

Input Current

Output Current

Power Dissipation, per Package (Note 1)

Ambient Temperature Range

Storage Temperature Range

Lead Temperature (8−Second Soldering)

(DC or Transient)

(DC or Transient) per Pin

Plastic

SOIC

). Unused outputs must be left open.

= 5.0 V, V

v V

. The input−signal high level (V

out

(Voltages Referenced to V

Parameter

v V

v 0.4 V, I

are recommended.

3.2 mA). Note that pins

pin, only. Extra precautions

)

−0.5 to +18.0

−55 to +125

−65 to +150

−0.5 to V

Value

+0.5

+45

825

740

260

) can exceed the

Unit

See detailed ordering and shipping information in the package

dimensions section on page 3 of this data sheet.

*For additional information on our Pb−Free strategy

and soldering details, please download the

ON Semiconductor Soldering and Mounting

Techniques Reference Manual, SOLDERRM/D.

ORDERING INFORMATION

WL, L

YY, Y

WW, W

http://onsemi.com

CASE 751B

SOEIAJ−16

CASE 948F

TSSOP−16

DT SUFFIX

CASE 648

CASE 966

P SUFFIX

D SUFFIX

F SUFFIX

PDIP−16

SOIC−16

= Assembly Location

= Wafer Lot

= Year

= Work Week

Publication Order Number:

MC14049UBCP

DIAGRAMS

MC14049UB

MARKING

MC14049UB/D

AWLYYWW

AWLYWW

14049U

ALYW

049U

Related parts for MC14049UBDTEL

MC14049UBDTEL Summary of contents

Page 1

... C See detailed ordering and shipping information in the package dimensions section on page 3 of this data sheet. 260 C *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. pin, only. Extra precautions http://onsemi.com ...

Page 2

OUT 2 15 OUT OUT OUT B E OUT OUT ...

Page 3

... MC14049UBD MC14049UBDG MC14049UBDR2 MC14049UBDR2G MC14049UBDT MC14049UBDTEL MC14049UBDTR2 MC14049UBF MC14049UBFEL 7. For ordering information on the EIAJ version of the SOIC packages, please contact your local ON Semiconductor representative. †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. *This package is inherently Pb− ...

Page 4

− 5.0 Vdc GS −10 − Vdc −30 GS − Vdc GS MAXIMUM CURRENT LEVEL ...

Page 5

0.25 (0.010) M −A− −B− −T− SEATING PLANE 0.25 (0.010 MC14049UB PACKAGE DIMENSIONS ...

Page 6

K 16X REF 0.10 (0.004) 0.15 (0.006 L PIN 1 IDENT. 1 0.15 (0.006 −V− C 0.10 (0.004) SEATING −T− PLANE D MC14049UB PACKAGE DIMENSIONS TSSOP−16 DT SUFFIX PLASTIC TSSOP ...

Page 7

VIEW 0.10 (0.004) 0.13 (0.005) M MC14049UB PACKAGE DIMENSIONS SOEIAJ−16 F SUFFIX PLASTIC EIAJ SOIC PACKAGE CASE 966−01 ISSUE ...

Page 8

... Fax: 480−829−7709 or 800−344−3867 Toll Free USA/Canada Email: orderlit@onsemi.com MC14049UB N. American Technical Support: 800−282−9855 Toll Free USA/Canada Japan: ON Semiconductor, Japan Customer Focus Center 2−9−1 Kamimeguro, Meguro−ku, Tokyo, Japan 153−0051 Phone: 81−3−5773−3850 http://onsemi.com 8 ON Semiconductor Website: http://onsemi ...

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