K4T1G164QE-HCF7

Manufacturer Part NumberK4T1G164QE-HCF7
ManufacturerSamsung
K4T1G164QE-HCF7 datasheet
 

Specifications of K4T1G164QE-HCF7

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K4T1G044QE
K4T1G084QE
K4T1G164QE
3.0 Package Pinout/Mechanical Dimension & Addressing
3.1 x4 package pinout (Top View) : 60ball FBGA Package
1
V
A
DD
B
NC
V
C
DDQ
D
NC
V
E
DDL
F
G
BA2
H
V
J
SS
K
V
L
DD
Note : V
and V
are power and ground for the DLL. It is recommended that they be isolated on the device from V
DDL
SSDL
, V
, and V
.
DQ
SS
SSQ
Ball Locations (x4)
Populated ball
Ball not populated
Top view
(See the balls through package)
2
3
4
5
6
7
V
V
NC
SS
SSQ
V
DM
DQS
SSQ
V
V
DQ1
DDQ
DDQ
V
DQ3
DQ2
SSQ
V
V
V
REF
SS
SSDL
CKE
WE
RAS
BA0
BA1
CAS
A10/AP
A1
A2
A3
A5
A6
A7
A9
A11
A12
NC
NC
1
2
A
B
C
D
E
F
G
H
J
K
L
5 of 45
DDR2 SDRAM
8
9
V
DQS
DDQ
V
NC
SSQ
V
DQ0
DDQ
V
NC
SSQ
V
CK
DD
CK
ODT0
CS
V
A0
DD
A4
V
A8
SS
A13
DD
3
4
5
6
7
8
9
Rev. 1.1 December 2008
,V
D-