K4T1G164QE-HCF7

Manufacturer Part NumberK4T1G164QE-HCF7
ManufacturerSamsung
K4T1G164QE-HCF7 datasheet
 

Specifications of K4T1G164QE-HCF7

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K4T1G044QE
K4T1G084QE
K4T1G164QE
3.3 x16 package pinout (Top View) : 84ball FBGA Package
1
V
A
DD
B
DQ14
V
C
DDQ
D
DQ12
V
E
DD
F
DQ6
V
G
DDQ
H
DQ4
V
J
DDL
K
L
BA2
M
V
N
SS
P
V
R
DD
Note : V
and V
are power and ground for the DLL. It is recommended that they be isolated on the device from V
DDL
SSDL
V
, V
, and V
DDQ
SS
SSQ
Ball Locations (x16)
Populated ball
Ball not populated
Top view
(See the balls through package)
2
3
4
5
6
7
V
V
NC
SS
SSQ
V
UDM
UDQS
SSQ
V
V
DQ9
DDQ
DDQ
V
DQ11
DQ10
SSQ
V
V
NC
SS
SSQ
V
LDM
LDQS
SSQ
V
V
DQ1
DDQ
DDQ
V
DQ3
DQ2
SSQ
V
V
V
REF
SS
SSDL
CKE
WE
RAS
BA0
BA1
CAS
A10/AP
A1
A2
A3
A5
A6
A7
A9
A11
A12
NC
NC
.
1
2
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
7 of 45
DDR2 SDRAM
8
9
V
UDQS
DDQ
V
DQ15
SSQ
V
DQ8
DDQ
V
DQ13
SSQ
V
LDQS
DDQ
V
DQ7
SSQ
V
DQ0
DDQ
V
DQ5
SSQ
V
CK
DD
CK
ODT
CS
V
A0
DD
A4
V
A8
SS
NC
3
4
5
6
7
8
9
Rev. 1.1 December 2008
,
DD