K4T1G164QE-HCF7

Manufacturer Part NumberK4T1G164QE-HCF7
ManufacturerSamsung
K4T1G164QE-HCF7 datasheet
 


Specifications of K4T1G164QE-HCF7

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K4T1G044QE
K4T1G084QE
K4T1G164QE
(Datum A)
(Datum B)
84-∅0.45 Solder ball
(Post reflow 0.50 ± 0.05)
0.2 M A B
3.5 FBGA Package Dimension (x16)
7.50 ± 0.10
0.80 x 8 = 6. 40
3.20
0.80
1.60
9
8
7
6
5
4
3
2
1
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
(0.95)
MOLDING AREA
(1.90)
7.50 ± 0.10
#A1
9 of 45
DDR2 SDRAM
A
# A1 INDEX MARK
B
0.35±0.05
1.10±0.10
Rev. 1.1 December 2008