FMU34R Sanken Electric Co., Ltd., FMU34R Datasheet - Page 109

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FMU34R

Manufacturer Part Number
FMU34R
Description
TO-247
Manufacturer
Sanken Electric Co., Ltd.
Datasheet

Specifications of FMU34R

Date_code
09+
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2
Application Notes
3
4
5
Ordinary Diodes
In a capacitor-input type rectifier circuit, inrush current
flows when the power supply is switched on. The peak
value of this inrush current shall be set less than peak
forward surge current I
but set the minimum pulse width to 1 msec). The value
of I
inrush current is repeated within a short period of time,
the derating has to be taken into account.
Mounting
Lead forming
Temperature rise
When forming leads, hold the lead wire on the main
body’s side so as to prevent stress from being applied
to the main body.
Temperature measurement
Inrush current
To mount a frame-type diode on a heatsink, use its
screwhole. Do not fix its resin body as the silicon chip
may get broken.
For an axial type diode, measure the temperature of the
lead wire on the main body side. The thermocouple to
be used must be as thin as possible (approximately
A diode’s temperature increases due to losses from
forward current, reverse current and reverse recovery
time.
In normal use, losses are mainly attributable to forward
current and voltage. However, in high frequency
circuits such as switching power supplies, losses due to
reverse recovery time also occurs. Moreover, in diodes
having large reverse currents like Schottky barrier
diodes losses due to reverse current cannot be disre-
garded.
Forward loss tends to decrease at high temperatures.
However, reverse loss tends to increase at high tem-
peratures. Therefore, it is necessary to consider the
ambient temperature when verifying operation.
0.125).
Bend
Bend
FSM
is guaranteed for a single shot only. If the
Fixed
Fixed
FSM
(I
2
t can also be obtained
Axial type
Frame type
Contact us if there is any unclear point.
6
Soldering (flow, reflow)
REFERENCE
300
280
260
240
220
200
180
160
Peak value current
Limit of the peak value current must be set to 10 times
of the average current (I o or I
If the peak value increases. the diode’s forward loss
also increases. In this case, check the temperature rise.
usage environment is prone to creeping discharge.
ii) To prevent the build-up of large thermal stress,
iii) When using a soldering iron, make use of the
Surface Mount Diodes
i) Use rosin based flux. Never use acidic fluxes.
(SFP
Carefully study the mounting method when the
0
preheat within 1 to 2 minutes at 150ºC and solder
within the usable range shown below.
following references:
Temperature of soldering Iron Tip:
Soldering time: less than 10 seconds
10
- 5
20
: Copper foil land for
/ 6
mounting SFP series
diodes.
2.0
30
4.0 to 4.2
Time (sec)
)
40
2.0
F (AV)
less than 300ºC
(Power of the soldering
iron: 30W or less)
The soldering tip must
be as thin as possible.
50
) under normal use.
60
(Unit: mm)
70
80
107

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