MT47H32M16HR25EITGTR Micron Semiconductor Products, MT47H32M16HR25EITGTR Datasheet

MT47H32M16HR25EITGTR

Manufacturer Part Number

MT47H32M16HR25EITGTR

Description

BGA

Manufacturer

Micron Semiconductor Products

Datasheet

1.MT47H32M16HW-25EG.pdf (133 pages)

Specifications of MT47H32M16HR25EITGTR

Date_code

11+

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Download datasheet (3Mb)

DDR2 SDRAM

MT47H128M4 – 32 Meg x 4 x 4 banks

MT47H64M8 – 16 Meg x 8 x 4 banks

MT47H32M16 – 8 Meg x 16 x 4 banks

Features

• V

• JEDEC-standard 1.8V I/O (SSTL_18-compatible)

• Differential data strobe (DQS, DQS#) option

• 4n-bit prefetch architecture

• Duplicate output strobe (RDQS) option for x8

• DLL to align DQ and DQS transitions with CK

• 4 internal banks for concurrent operation

• Programmable CAS latency (CL)

• Posted CAS additive latency (AL)

• WRITE latency = READ latency - 1

• Selectable burst lengths: 4 or 8

• Adjustable data-output drive strength

• 64ms, 8192-cycle refresh

• On-die termination (ODT)

• Industrial temperature (IT) option

• Automotive temperature (AT) option

• RoHS-compliant

• Supports JEDEC clock jitter specification

PDF: 09005aef82f1e6e2

512MbDDR2.pdf - Rev. T 2/12 EN

= 1.8V ±0.1V, V

Products and specifications discussed herein are subject to change by Micron without notice.

DDQ

= 1.8V ±0.1V

Options

• Configuration

• FBGA package (Pb-free) – x16

• FBGA package (Pb-free) – x4, x8

• FBGA package (lead solder) – x16

• FBGA package (lead solder) – x4, x8

• Timing – cycle time

• Self refresh

• Operating temperature

• Revision

– 128 Meg x 4 (32 Meg x 4 x 4 banks)

– 64 Meg x 8 (16 Meg x 8 x 4 banks)

– 32 Meg x 16 (8 Meg x 16 x 4 banks)

– 84-ball FBGA (8mm x 12.5mm) Rev. F, G

– 60-ball FBGA (8mm x 10mm) Rev. F, G

– 84-ball FBGA (8mm x 12.5mm) Rev. F, G

– 60-ball FBGA (8mm x 10mm) Rev. F, G

– 1.875ns @ CL = 7 (DDR2-1066)

– 2.5ns @ CL = 5 (DDR2-800)

– 2.5ns @ CL = 6 (DDR2-800)

– 3.0ns @ CL = 4 (DDR2-667)

– 3.0ns @ CL = 5 (DDR2-667)

– 3.75ns @ CL = 4 (DDR2-533)

– Standard

– Low-power

– Commercial (0°C ≤ T

– Industrial (–40°C ≤ T

– Automotive (–40°C ≤ T

Note:

–40°C ≤ T

Micron Technology, Inc. reserves the right to change products or specifications without notice.

512Mb: x4, x8, x16 DDR2 SDRAM

1. Not all options listed can be combined to

define an offered product. Use the Part

Catalog Search on

product offerings and availability.

≤ +85°C)

≤ +95°C;

≤ +85°C)

, T

www.micron.com

≤ +105°C)

Features

Marking

for

128M4

32M16

-187E

64M8

None

:F/:G

-25E

-37E

-3E

-25

-3

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