IC GATE HEX NAND/NOR/INV 16-DIP

MC14572UBCPG

Manufacturer Part NumberMC14572UBCPG
DescriptionIC GATE HEX NAND/NOR/INV 16-DIP
ManufacturerON Semiconductor
Series4000B
MC14572UBCPG datasheets
 


Specifications of MC14572UBCPG

Logic TypeNAND/NOR GateNumber Of Circuits6
Number Of Inputs8Schmitt Trigger InputNo
Output TypeSingle-EndedCurrent - Output High, Low3.5mA, 8mA
Voltage - Supply3 V ~ 18 VOperating Temperature-55°C ~ 125°C
Mounting TypeThrough HolePackage / Case16-DIP (0.300", 7.62mm)
Circuit TypeLow-Power SchottkyCurrent, Supply30 μA
Function Type6-ChannelsLogic FunctionGate
Package TypePDIP-16Temperature, Operating, Range-55 to +125 °C
Voltage, Supply3 to 18 VDCLead Free Status / RoHS StatusLead free / RoHS Compliant
Other namesMC14572UBCPG
MC14572UBCPGOS
  
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MC14572UB
Hex Gate
The MC14572UB hex functional gate is constructed with MOS
P−channel and N−channel enhancement mode devices in a single
monolithic structure. These complementary MOS logic gates find
primary use where low power dissipation and/or high noise immunity
is desired. The chip contains four inverters, one NOR gate and one
NAND gate.
Features
Diode Protection on All Inputs
Single Supply Operation
Supply Voltage Range = 3.0 Vdc to 18 Vdc
NOR Input Pin Adjacent to V
Pin to Simplify Use As An Inverter
SS
NAND Input Pin Adjacent to V
DD
Inverter
NOR Output Pin Adjacent to Inverter Input Pin For OR Application
NAND Output Pin Adjacent to Inverter Input Pin For AND
Application
Capable of Driving Two Low−Power TTL Loads or One Low−Power
Schottky TTL Load over the Rated Temperature Range
Pb−Free Packages are Available*
MAXIMUM RATINGS
(Voltages Referenced to V
Parameter
DC Supply Voltage Range
Input or Output Voltage Range
(DC or Transient)
Input or Output Current (DC or Transient)
per Pin
Power Dissipation, per Package (Note 1)
Ambient Temperature Range
Storage Temperature Range
Lead Temperature (8−Second Soldering)
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. Temperature Derating: Plastic “P and D/DW”
Packages: – 7.0 mW/_C From 65_C To 125_C
This device contains protection circuitry to guard against damage due to high
static voltages or electric fields. However, precautions must be taken to avoid
applications of any voltage higher than maximum rated voltages to this
high−impedance circuit. For proper operation, V
v (V
) v V
to the range V
or V
.
SS
in
out
DD
Unused inputs must always be tied to an appropriate logic voltage level
(e.g., either V
or V
). Unused outputs must be left open.
SS
DD
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
© Semiconductor Components Industries, LLC, 2006
June, 2006 − Rev. 6
Pin to Simplify Use As An
)
SS
Symbol
Value
Unit
V
−0.5 to +18.0
V
DD
V
, V
−0.5 to V
V
in
out
DD
+ 0.5
±10
I
, I
mA
in
out
P
500
mW
D
°C
T
−55 to +125
A
°C
T
−65 to +150
stg
°C
T
260
L
and V
should be constrained
in
out
1
http://onsemi.com
MARKING
DIAGRAMS
16
PDIP−16
MC14572UBCP
P SUFFIX
AWLYYWWG
CASE 648
1
1
16
SOIC−16
14572UBG
D SUFFIX
AWLYWW
CASE 751B
1
1
16
SOEIAJ−16
MC14572UB
F SUFFIX
ALYWG
CASE 966
1
1
A
= Assembly Location
WL, L
= Wafer Lot
YY, Y
= Year
WW, W = Work Week
G
= Pb−Free Package
ORDERING INFORMATION
Device
Package
Shipping
MC14572UBCP
PDIP−16
25 Units / Rail
MC14572UBCPG
PDIP−16
25 Units / Rail
(Pb−Free)
MC14572UBD
SOIC−16
48 Units / Rail
MC14572UBDG
SOIC−16
48 Units / Rail
(Pb−Free)
MC14572UBDR2
SOIC−16
2500/Tape & Reel
MC14572UBDR2G
SOIC−16
2500/Tape & Reel
(Pb−Free)
MC14572UBF
SOEIAJ−16
50 Units / Rail
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
Publication Order Number:
MC14572UB/D

MC14572UBCPG Summary of contents

  • Page 1

    ... Wafer Lot YY Year WW Work Week G = Pb−Free Package ORDERING INFORMATION Device Package Shipping MC14572UBCP PDIP−16 25 Units / Rail MC14572UBCPG PDIP−16 25 Units / Rail (Pb−Free) MC14572UBD SOIC−16 48 Units / Rail MC14572UBDG SOIC−16 48 Units / Rail (Pb−Free) MC14572UBDR2 SOIC−16 2500/Tape & Reel MC14572UBDR2G SOIC− ...

  • Page 2

    MC14572UB PIN ASSIGNMENT OUT OUT OUT B F OUT OUT ...

  • Page 3

    ELECTRICAL CHARACTERISTICS Î Î Î Î Î ...

  • Page 4

    SWITCHING CHARACTERISTICS Î Î Î Î Î ...

  • Page 5

    0.25 (0.010) M −A− −B− −T− SEATING PLANE 0.25 (0.010 MC14572UB PACKAGE DIMENSIONS ...

  • Page 6

    ... Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada Fax: 303− ...