MC14572UBCPG ON Semiconductor, MC14572UBCPG Datasheet - Page 6

IC GATE HEX NAND/NOR/INV 16-DIP

MC14572UBCPG

Manufacturer Part Number
MC14572UBCPG
Description
IC GATE HEX NAND/NOR/INV 16-DIP
Manufacturer
ON Semiconductor
Series
4000Br
Datasheets

Specifications of MC14572UBCPG

Logic Type
NAND/NOR Gate
Number Of Circuits
6
Number Of Inputs
8
Schmitt Trigger Input
No
Output Type
Single-Ended
Current - Output High, Low
3.5mA, 8mA
Voltage - Supply
3 V ~ 18 V
Operating Temperature
-55°C ~ 125°C
Mounting Type
Through Hole
Package / Case
16-DIP (0.300", 7.62mm)
Circuit Type
Low-Power Schottky
Current, Supply
30 μA
Function Type
6-Channels
Logic Function
Gate
Package Type
PDIP-16
Temperature, Operating, Range
-55 to +125 °C
Voltage, Supply
3 to 18 VDC
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
MC14572UBCPG
MC14572UBCPGOS
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to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
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“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary time. All operating
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e
16
1
0.13 (0.005)
Z
b
D
M
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
9
8
A
E
0.10 (0.004)
A
H
1
E
VIEW P
N. American Technical Support: 800−282−9855 Toll Free
Europe, Middle East and Africa Technical Support:
Japan Customer Focus Center
PACKAGE DIMENSIONS
USA/Canada
Phone: 421 33 790 2910
Phone: 81−3−5773−3850
M
_
L
http://onsemi.com
E
MC14572UB
CASE 966−01
SOEIAJ−16
ISSUE A
L
DETAIL P
6
Q
1
c
NOTES:
1.
2.
3.
4.
5.
Y14.5M, 1982.
MOLD FLASH OR PROTRUSIONS AND ARE
MEASURED AT THE PARTING LINE. MOLD FLASH
OR PROTRUSIONS SHALL NOT EXCEED 0.15
(0.006) PER SIDE.
REFERENCE ONLY.
INCLUDE DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.08 (0.003)
TOTAL IN EXCESS OF THE LEAD WIDTH
DIMENSION AT MAXIMUM MATERIAL CONDITION.
DAMBAR CANNOT BE LOCATED ON THE LOWER
RADIUS OR THE FOOT. MINIMUM SPACE
BETWEEN PROTRUSIONS AND ADJACENT LEAD
TO BE 0.46 ( 0.018).
H
DIM
A
M
A
b
c
D
E
e
L
L
Q
Z
ON Semiconductor Website: www.onsemi.com
Order Literature: http://www.onsemi.com/orderlit
For additional information, please contact your local
Sales Representative
E
1
E
DIMENSIONING AND TOLERANCING PER ANSI
CONTROLLING DIMENSION: MILLIMETER.
DIMENSIONS D AND E DO NOT INCLUDE
TERMINAL NUMBERS ARE SHOWN FOR
THE LEAD WIDTH DIMENSION (b) DOES NOT
1
MILLIMETERS
MIN
0.05
0.35
0.10
9.90
5.10
7.40
0.50
0.70
1.10
−−−
−−−
0
1.27 BSC
_
10.50
MAX
10
2.05
0.20
0.50
0.20
5.45
8.20
0.85
1.50
0.90
0.78
_
0.002
0.014
0.007
0.390
0.201
0.291
0.020
0.043
0.028
MIN
−−−
−−−
0
0.050 BSC
INCHES
_
MC14572UB/D
0.081
0.008
0.020
0.413
0.215
0.323
0.033
0.059
0.035
0.031
MAX
0.011
10
_

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