HEF4047BP,652 NXP Semiconductors, HEF4047BP,652 Datasheet - Page 10

• Manufacturer Part Number: HEF4047BP,652
• Description: IC MONO/ASTBL MULTVIBRTR 14-DIP
• Manufacturer: NXP Semiconductors
• Series: 4000Br

Specifications of HEF4047BP,652

• Logic Type: Astable, Monostable
• Package / Case: 14-DIP (0.300", 7.62mm)
• Independent Circuits: 1
• Schmitt Trigger Input: No
• Propagation Delay: 50ns
• Voltage - Supply: 4.5 V ~ 15.5 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Through Hole
• Elements Per Chip: 1
• Logic Family: HEF4000
• Input Bias Current (max): 0.08 mA
• Propagation Delay Time: 320 ns, 130 ns, 100 ns
• High Level Output Current: - 3.6 mA
• Low Level Output Current: 3.6 mA
• Supply Voltage (max): 15 V
• Supply Voltage (min): 3 V
• Maximum Power Dissipation: 750 mW
• Maximum Operating Temperature: + 85 C
• Minimum Operating Temperature: - 40 C
• Mounting Style: Through Hole
• Operating Supply Voltage: 3.3 V, 5 V, 9 V, 12 V
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Current - Output High, Low: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 568-3106-5; 933324240652; HEF4047BPN

Philips Semiconductors
January 1995
SSOP16: plastic shrink small outline package; 16 leads; body width 5.3 mm
Package information
DIMENSIONS (mm are the original dimensions)
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
UNIT
mm
VERSION
OUTLINE
SOT338-1
max.
2.0
A
0.21
0.05
A
1
16
Z
1
y
1.80
1.65
A
2
IEC
e
pin 1 index
0.25
A
3
D
0.38
0.25
b
p
MO-150AC
0.20
0.09
JEDEC
c
b
p
8
9
REFERENCES
D
6.4
6.0
0
(1)
w
M
E
5.4
5.2
(1)
c
scale
EIAJ
2.5
0.65
10
e
H
7.9
7.6
A
E
2
A
5 mm
1.25
1
L
1.03
0.63
L
E
H
p
E
detail X
0.9
0.7
Q
L
L
p
PROJECTION
Q
EUROPEAN
0.2
v
(A )
Package outlines
3
A
0.13
w
A
0.1
X
y
v
ISSUE DATE
M
94-01-14
95-02-04
A
1.00
0.55
Z
(1)
SOT338-1
8
0
o
o