74HC166D,652 NXP Semiconductors, 74HC166D,652 Datasheet

IC 8BIT SHIFT REGISTER 16-SOIC

74HC166D,652

Manufacturer Part Number
74HC166D,652
Description
IC 8BIT SHIFT REGISTER 16-SOIC
Manufacturer
NXP Semiconductors
Series
74HCr
Datasheets
1.74HCT4046ADB112.pdf (19 pages)
2.74HCT4046ADB112.pdf (23 pages)
3.74HC166N652.pdf (10 pages)

Specifications of 74HC166D,652

Logic Type
Shift Register
Output Type
Standard
Number Of Elements
1
Number Of Bits Per Element
8
Function
Parallel or Serial to Serial
Voltage - Supply
2 V ~ 6 V
Operating Temperature
-40°C ~ 125°C
Mounting Type
Surface Mount
Package / Case
16-SOIC (3.9mm Width)
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
568-2624-5
933714550652
INTEGRATED CIRCUITS
DATA SHEET
Package outline drawings
January 1996
File under Integrated Circuits, IC06

Related parts for 74HC166D,652

Image
Part Number
Description
Manufacturer
Datasheet
Request R
74HC166D,653
Part Number:
74HC166D,653
Description:
IC 8BIT SHIFT REGISTER 16SOIC
Manufacturer:
NXP Semiconductors
Datasheet:
74HC166N652.pdf (10 pages)
LPC2420_60
Part Number:
LPC2420_60
Description:
NXP Semiconductors designed the LPC2420/2460 microcontroller around a 16-bit/32-bitARM7TDMI-S CPU core with real-time debug interfaces that include both JTAG andembedded trace
Manufacturer:
NXP Semiconductors
Datasheet:
LPC2420_60.pdf (86 pages)
LPC2458
Part Number:
LPC2458
Description:
NXP Semiconductors designed the LPC2458 microcontroller around a 16-bit/32-bitARM7TDMI-S CPU core with real-time debug interfaces that include both JTAG andembedded trace
Manufacturer:
NXP Semiconductors
Datasheet:
LPC2458.pdf (80 pages)
LPC2468
Part Number:
LPC2468
Description:
NXP Semiconductors designed the LPC2468 microcontroller around a 16-bit/32-bitARM7TDMI-S CPU core with real-time debug interfaces that include both JTAG andembedded trace
Manufacturer:
NXP Semiconductors
Datasheet:
LPC2468.pdf (85 pages)
LPC2470
Part Number:
LPC2470
Description:
NXP Semiconductors designed the LPC2470 microcontroller, powered by theARM7TDMI-S core, to be a highly integrated microcontroller for a wide range ofapplications that require advanced communications and high quality graphic displays
Manufacturer:
NXP Semiconductors
Datasheet:
LPC2470.pdf (91 pages)
LPC2478
Part Number:
LPC2478
Description:
NXP Semiconductors designed the LPC2478 microcontroller, powered by theARM7TDMI-S core, to be a highly integrated microcontroller for a wide range ofapplications that require advanced communications and high quality graphic displays
Manufacturer:
NXP Semiconductors
Datasheet:
LPC2478.pdf (93 pages)
XA-G30
Part Number:
XA-G30
Description:
The Philips Semiconductors XA (eXtended Architecture) family of 16-bit single-chip microcontrollers is powerful enough to easily handle the requirements of high performance embedded applications, yet inexpensive enough to compete in the market for hi
Manufacturer:
NXP Semiconductors
Datasheet:
XA-G30.pdf (36 pages)
XA-G37
Part Number:
XA-G37
Description:
The Philips Semiconductors XA (eXtended Architecture) family of 16-bit single-chip microcontrollers is powerful enough to easily handle the requirements of high performance embedded applications, yet inexpensive enough to compete in the market for hi
Manufacturer:
NXP Semiconductors
Datasheet:
XA-G37.pdf (37 pages)
XA-S3
Part Number:
XA-S3
Description:
The XA-S3 device is a member of Philips Semiconductors? XA(eXtended Architecture) family of high performance 16-bitsingle-chip microcontrollers
Manufacturer:
NXP Semiconductors
Datasheet:
XA-S3.pdf (52 pages)
LH75401_LH75411_N
Part Number:
LH75401_LH75411_N
Description:
The NXP BlueStreak LH75401/LH75411 family consists of two low-cost 16/32-bit System-on-Chip (SoC) devices
Manufacturer:
NXP Semiconductors
Datasheet:
LH75401_LH75411_N.pdf (63 pages)
LPC3130_3131
Part Number:
LPC3130_3131
Description:
The NXP LPC3130/3131 combine an 180 MHz ARM926EJ-S CPU core, high-speed USB2
Manufacturer:
NXP Semiconductors
Datasheet:
LPC3130_3131.pdf (68 pages)
LPC3141FET180
Part Number:
LPC3141FET180
Description:
The NXP LPC3141 combine a 270 MHz ARM926EJ-S CPU core, High-speed USB 2
Manufacturer:
NXP Semiconductors
LPC3143FET180
Part Number:
LPC3143FET180
Description:
The NXP LPC3143 combine a 270 MHz ARM926EJ-S CPU core, High-speed USB 2
Manufacturer:
NXP Semiconductors
LPC3152FET208
Part Number:
LPC3152FET208
Description:
The NXP LPC3152 combines an 180 MHz ARM926EJ-S CPU core, High-speed USB 2
Manufacturer:
NXP Semiconductors
LPC3154FET208
Part Number:
LPC3154FET208
Description:
The NXP LPC3154 combines an 180 MHz ARM926EJ-S CPU core, High-speed USB 2
Manufacturer:
NXP Semiconductors

74HC166D,652 Summary of contents

Page 1

DATA SHEET Package outline drawings File under Integrated Circuits, IC06 INTEGRATED CIRCUITS January 1996 ...

Page 2

Philips Semiconductors Package outline drawings INDEX PACKAGE VERSIONS DIP SOT27-1 plastic dual in-line package; 14 leads (300 mil) SOT38-4 plastic dual in-line package; 16 leads (300 mil) SOT146-1 plastic dual in-line package; 20 leads (300 mil) SOT101-1 plastic dual in-line ...

Page 3

Philips Semiconductors Package outline drawings DIP DIP14: plastic dual in-line package; 14 leads (300 mil pin 1 index 1 DIMENSIONS (inch dimensions are derived from the original mm dimensions UNIT b ...

Page 4

Philips Semiconductors Package outline drawings DIP16: plastic dual in-line package; 16 leads (300 mil pin 1 index 1 DIMENSIONS (inch dimensions are derived from the original mm dimensions UNIT b max. min. ...

Page 5

Philips Semiconductors Package outline drawings DIP20: plastic dual in-line package; 20 leads (300 mil pin 1 index 1 DIMENSIONS (inch dimensions are derived from the original mm dimensions UNIT b max. min. ...

Page 6

Philips Semiconductors Package outline drawings DIP24: plastic dual in-line package; 24 leads (600 mil pin 1 index 1 DIMENSIONS (inch dimensions are derived from the original mm dimensions UNIT max. min. max. ...

Page 7

Philips Semiconductors Package outline drawings DIP24: plastic dual in-line package; 24 leads (300 mil pin 1 index 1 DIMENSIONS (millimetre dimensions are derived from the original inch dimensions UNIT b max. min. ...

Page 8

Philips Semiconductors Package outline drawings DIP28: plastic dual in-line package; 28 leads (600 mil) handbook, full pagewidth pin 1 index 1 DIMENSIONS (inch dimensions are derived from the original mm dimensions UNIT ...

Page 9

Philips Semiconductors Package outline drawings SO SO8: plastic small outline package; 8 leads; body width 3 pin 1 index 1 e DIMENSIONS (inch dimensions are derived from the original mm dimensions) A UNIT ...

Page 10

Philips Semiconductors Package outline drawings SO14: plastic small outline package; 14 leads; body width 3 pin 1 index 1 e DIMENSIONS (inch dimensions are derived from the original mm dimensions) A UNIT ...

Page 11

Philips Semiconductors Package outline drawings SO16: plastic small outline package; 16 leads; body width 3 pin 1 index 1 e DIMENSIONS (inch dimensions are derived from the original mm dimensions) A UNIT ...

Page 12

Philips Semiconductors Package outline drawings SO16: plastic small outline package; 16 leads; body width 7 pin 1 index 1 e DIMENSIONS (inch dimensions are derived from the original mm dimensions) A UNIT ...

Page 13

Philips Semiconductors Package outline drawings SO20: plastic small outline package; 20 leads; body width 7 pin 1 index 1 e DIMENSIONS (inch dimensions are derived from the original mm dimensions) A UNIT ...

Page 14

Philips Semiconductors Package outline drawings SO24: plastic small outline package; 24 leads; body width 7 pin 1 index 1 e DIMENSIONS (inch dimensions are derived from the original mm dimensions) A UNIT ...

Page 15

Philips Semiconductors Package outline drawings SO28: plastic small outline package; 28 leads; body width 7 pin 1 index 1 e DIMENSIONS (inch dimensions are derived from the original mm dimensions) A UNIT ...

Page 16

Philips Semiconductors Package outline drawings SSOP SSOP14: plastic shrink small outline package; 14 leads; body width 5 pin 1 index 1 e DIMENSIONS (mm are the original dimensions) A UNIT ...

Page 17

Philips Semiconductors Package outline drawings SSOP16: plastic shrink small outline package; 16 leads; body width 5 pin 1 index 1 e DIMENSIONS (mm are the original dimensions) A UNIT ...

Page 18

Philips Semiconductors Package outline drawings SSOP20: plastic shrink small outline package; 20 leads; body width 5 pin 1 index 1 e DIMENSIONS (mm are the original dimensions) A UNIT ...

Page 19

Philips Semiconductors Package outline drawings SSOP24: plastic shrink small outline package; 24 leads; body width 5 pin 1 index 1 e DIMENSIONS (mm are the original dimensions) A UNIT ...

Page 20

Philips Semiconductors Package outline drawings TSSOP TSSOP14: plastic thin shrink small outline package; 14 leads; body width 4 pin 1 index 1 e DIMENSIONS (mm are the original dimensions) A UNIT ...

Page 21

Philips Semiconductors Package outline drawings TSSOP16: plastic thin shrink small outline package; 16 leads; body width 4 pin 1 index 1 e DIMENSIONS (mm are the original dimensions) A UNIT ...

Page 22

Philips Semiconductors Package outline drawings TSSOP20: plastic thin shrink small outline package; 20 leads; body width 4 pin 1 index 1 e DIMENSIONS (mm are the original dimensions) A UNIT ...

Page 23

Philips Semiconductors Package outline drawings TSSOP24: plastic thin shrink small outline package; 24 leads; body width 4 pin 1 index 1 e DIMENSIONS (mm are the original dimensions) A UNIT ...

Related keywords