MT18VDDF12872Y-40B Micron Semiconductor Products, MT18VDDF12872Y-40B Datasheet

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MT18VDDF12872Y-40B

Manufacturer Part Number
MT18VDDF12872Y-40B
Description
Manufacturer
Micron Semiconductor Products
Datasheet
DDR SDRAM RDIMM
MT18VDDF6472 – 512MB
MT18VDDF12872 – 1GB
For component data sheets, refer to Micron’s Web site:
Features
• 184-pin, registered dual in-line memory module
• Fast data transfer rates: PC2100, PC2700, or PC3200
• 512MB (64 Meg x 72) and 1GB (128 Meg x 72)
• Supports ECC error detection and correction
• V
• V
• 2.5V I/O (SSTL_2-compatible)
• Internal, pipelined double data rate (DDR)
• Bidirectional data strobe (DQS) transmitted/
• Differential clock inputs (CK and CK#)
• Multiple internal device banks for concurrent
• Single rank
• Selectable burst lengths (BL): 2, 4, or 8
• Auto precharge option
• Auto refresh and self refresh modes: 7.8125µs
• Serial presence-detect (SPD) with EEPROM
• Selectable CAS latency (CL) for maximum
• Gold edge contacts
184-Pin RDIMM (MO-206) Figures
Figure 1:
PDF: 09005aef8074e85b/Source: 09005aef8072fe49
DDF18C64_128x72.fm - Rev. E 6/08 EN
PCB height: 28.58mm (1.125in)
(RDIMM)
2n-prefetch architecture
received with data—that is, source-synchronous
data capture
operation
maximum average periodic refresh interval
compatibility
DD
DDSPD
= V
DD
= +2.3V to +3.6V
Q = +2.5V (-40B: V
R/C J (-40B)
Products and specifications discussed herein are subject to change by Micron without notice.
DD
= V
DD
1
Q = +2.6V)
512MB, 1GB (x72, ECC, SR) 184-Pin DDR SDRAM RDIMM
www.micron.com
1
Figure 2:
Notes: 1. Not recommended for new designs.
PCB height: 28.58mm (1.125in)
Options
• Operating temperature
• Package
• Memory clock, speed, CAS latency
– Commercial (0°C ≤ T
– Industrial (–40°C ≤ T
– 184-pin DIMM (standard)
– 184-pin DIMM (Pb-free)
– 5.0ns (200 MHz), 400 MT/s, CL = 3
– 6.0ns (167 MHz), 333 MT/s, CL = 2.5
– 7.5ns (133 MHz), 266 MT/s, CL = 2.5
Micron Technology, Inc., reserves the right to change products or specifications without notice.
2. Contact Micron for industrial temperature
3. CL = CAS (READ) latency; registered mode
module offerings.
will add one clock cycle to CL.
R/C C (-335, -265)
A
A
2
≤ +85°C)
≤ +70°C)
©2003 Micron Technology, Inc. All rights reserved.
3
1
Marking
Features
None
-40B
-335
-265
G
Y
I

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