CXA2022 Sony Corporation, CXA2022 Datasheet

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CXA2022

Manufacturer Part Number
CXA2022
Description
I2C Bus Sound Processor for TV
Manufacturer
Sony Corporation
Datasheet

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Part Number
Manufacturer
Quantity
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Part Number:
CXA2022S
Manufacturer:
SONY
Quantity:
112
Part Number:
CXA2022S
Manufacturer:
SONY
Quantity:
1 000
Part Number:
CXA2022S
Manufacturer:
SONY/索尼
Quantity:
20 000
Description
bus control sound processor for TV. This IC has
simulate stereo, surround, tone control, balance,
volume, muting, AGC and other functions.
Features
• Allows control by I
• Employs a special surround system to prevent
• Adopts an AGC circuit to absorb the difference in
Absolute Maximum Ratings
• Supply voltage
• Operating temperature
• Storage temperature
• Allowable power dissipation P
Recommended Operating Condition
Pin Configuration
The CXA2022S is a bipolar IC designed as an I
"vocal missing" in the surround mode
sound level between input sources and improves
S/N ratio of hearing characteristics
Supply voltage
I
Sony reserves the right to change products and specifications without prior notice. This information does not convey any license by
any implication or otherwise under any patents or other right. Application circuits shown, if any, are typical examples illustrating the
operation of the devices. Sony cannot assume responsibility for any problems arising out of the use of these circuits.
2
C Bus Sound Processor for TV
30
1
29
2
2
C bus
28
3
27
4
V
Topr –20 to +75 °C
Tstg –65 to +150 °C
CC
D
26
5
8 to 13
1.25
25
14
6
24
7
2
W
C
V
V
– 1 –
23
8
Structure
Applications
Bipolar silicon monolithic IC
TVs
22
9
10
21
CXA2022S
20
11
30 pin SDIP (Plastic)
19
12
13
18
17
14
15
16
E95Y17A7X

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CXA2022 Summary of contents

Page 1

... I C Bus Sound Processor for TV Description The CXA2022S is a bipolar IC designed bus control sound processor for TV. This IC has simulate stereo, surround, tone control, balance, volume, muting, AGC and other functions. Features 2 • Allows control bus • Employs a special surround system to prevent " ...

Page 2

... CXA2022S ...

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... V CC 40k 20k 75µ – 3 – CXA2022S (Ta = 25° 12V) CC Description V CC Input pins. GND V CC External pins for LPF capacitance (BASS External pins for HPF capacitance (TREBLE). DAC output pins. ...

Page 4

... CXA2022S Description V CC DC-cut pins for L and R. Internal impedance is approximately 20kΩ Output pins External capacitance pins for surround phase- shifter. Internal impedance is approximately 18kΩ. V ...

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... CXA2022S Description 10µ HPF external capacitance pin of AGC. 16k V CC 100µ bus clock line pin bus data line pin AGC detector output pin. ...

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... CXA2022S Description V CC External pin for surround filter. 18k V CC External pin for surround filter reference voltage CC pin. Power supply. ...

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... CXA2022S ...

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... Surround OFF 01 = Simulate Stereo (Monaural Surround Stereo Surround Stereo Surround 2 • TREBLE: High frequency control 00 = Minimum 10 = Typical 1F = Maximum (SLAVE ADDRESS = 82H) bit 3 bit 2 bit 1 bit 0 MUTE AGC (0) (0) MODE (00) MONO-EFFECT (00) – 8 – (Power ON setting value) AGC : 0 = OFF MUTE : 0 = OFF CXA2022S ...

Page 9

... L OUT C17 C19 C21 10µ 8200P 4700P C23 0.022µ C20 10µ C16 C18 C22 10µ 4700P 0.1µ R2 1MEG R OUT SCL CXA2022S V CC C24 C25 0.1µ 4.7µ 220 220 SDA ...

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... CXA2022S ...

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... CXA2022S ...

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... CXA2022S ...

Page 13

... Provides controls for BALANCE and VOLUME. the number of steps is 64 each. • DAC circuit Provides controls for BASS, TREBLE, VOLUME and BALANCE. The internal impedance is approximately 20kΩ and the LPF capacitance is used externally. for BASS and C L – 13 – CXA2022S for TREBLE H ...

Page 14

... TONE characteristics 10 100 1k Frequency [Hz] CH. vs. TREBLE-CONTROL (MAX) 0.047µ 0.022µ 4700p 10 100 1k Frequency [Hz] CH. vs. BASS-CONTROL (MAX) 0.01µ 0.1µ 0.047µ 1µ 0.47µ 10 100 1k Frequency [Hz] – 14 – BASS-TREBLE MAX. BASS-TREBLE MIN. 10k 100k 2200p 470p 10k 100k 10k 100k CXA2022S ...

Page 15

... Input = 10kHz –2 –4 –6 –8 –10 – AGC characteristics 10 100mV IN [rms] – 15 – CXA2022S OUT R OUT BUS Data (BALANCE) TREBLE CONTROL characteristics BUS Data (TREBLE) AGC = OFF AGC = ON 1V ...

Page 16

... PACKAGE STRUCTURE MOLDING COMPOUND LEAD TREATMENT SDIP-30P-01 LEAD MATERIAL SDIP030-P-0400 PACKAGE MASS – 16 – CXA2022S 0° to 15° Two kinds of package surface: 1.All mat surface type. 2.All mirror surface type. EPOXY RESIN SOLDER/PALLADIUM PLATING COPPER ALLOY 1.8g ...

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