CBT3257AD,112 NXP Semiconductors, CBT3257AD,112 Datasheet
CBT3257AD,112
Specifications of CBT3257AD,112
935275888112
CBT3257AD
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CBT3257AD,112 Summary of contents
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CBT3257A Quad 1-of-2 multiplexer/demultiplexer Rev. 04 — 19 March 2009 1. General description The CBT3257A is a quad 1-of-2 high-speed TTL-compatible multiplexer/demultiplexer. The low ON resistance of the switch allows inputs to be connected to outputs without adding propagation delay ...
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... NXP Semiconductors Table 1. Ordering information Type number Temperature range CBT3257ADS +85 C CBT3257APW +85 C CBT3257ABQ +85 C [1] Also known as QSOP16. 4. Functional diagram Fig 1. Logic diagram CBT3257A_4 Product data sheet …continued Package Name Description [1] SSOP16 plastic shrink small outline package; 16 leads; body width 3.9 mm; lead pitch 0.635 mm TSSOP16 plastic thin shrink small outline package ...
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... NXP Semiconductors 5. Pinning information 5.1 Pinning CBT3257A 1 S 1B1 2 1B2 2B1 5 2B2 GND 8 001aai364 Fig 2. Pin configuration SOT109-1 (SO16) and SOT519-1 (SSOP16) (1) The die substrate is attached to this pad using conductive die attach material. It can not be used as supply pin or input. Fig 4. ...
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... NXP Semiconductors 5.2 Pin description Table 2. Pin description Symbol Pin S 1 1B1, 2B1, 3B1, 4B1 11, 14 1B2, 2B2, 3B2, 4B2 3, 6, 10, 13 1A, 2A, 3A GND Functional description Table 3. Function selection H = HIGH voltage level LOW voltage level Don’t care. Inputs Limiting values Table 4 ...
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... NXP Semiconductors 8. Recommended operating conditions Table 5. Operating conditions All unused control inputs of the device must be held at V Symbol Parameter V supply voltage CC V HIGH-level input voltage IH V LOW-level input voltage IL T ambient temperature amb 9. Static characteristics Table 6. Static characteristics +85 C. amb Symbol ...
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... NXP Semiconductors 10. Dynamic characteristics Table 7. Dynamic characteristics + 4 5.5 V; for test circuit see amb CC Symbol Parameter t propagation delay pd t enable time en t disable time dis [1] This parameter is warranted but not production tested. The propagation delay is based on the RC time constant of the typical ON resistance of the switch and a load capacitance, when driven by an ideal voltage source (zero output impedance). ...
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... NXP Semiconductors OE, S input output LOW-to-OFF OFF-to-LOW output HIGH-to-OFF OFF-to-HIGH Measurement points are given in V and V are typical voltage output levels that occur with the output load Fig 6. Enable and disable times Table 8. Measurement points Supply voltage Input 4 5.5 V GND to 3.0 V ...
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... NXP Semiconductors 12. Test information Test data is given in Table Definitions for test circuit Load resistance Load capacitance including jig and probe capacitance Termination resistance should be equal to the output impedance External voltage for measuring switching times. EXT Fig 7. Test circuit for measuring switching times Table 9 ...
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... NXP Semiconductors 13. Package outline SO16: plastic small outline package; 16 leads; body width 3 pin 1 index 1 DIMENSIONS (inch dimensions are derived from the original mm dimensions) A UNIT max. 0.25 1.45 mm 1.75 0.25 0.10 1.25 0.010 0.057 inches 0.069 0.01 0.004 0.049 Note 1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included. ...
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... NXP Semiconductors SSOP16: plastic shrink small outline package; 16 leads; body width 5 pin 1 index 1 e DIMENSIONS (mm are the original dimensions) A UNIT max. 0.21 1. 0.25 0.05 1.65 Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION IEC SOT338-1 Fig 9. ...
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... NXP Semiconductors SSOP16: plastic shrink small outline package; 16 leads; body width 3.9 mm; lead pitch 0.635 DIMENSIONS (mm are the original dimensions) A UNIT max. 0.25 1.55 mm 1.73 0.25 0.10 1.40 Note 1. Plastic or metal protrusions of 0.2 mm maximum per side are not included. OUTLINE VERSION ...
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... NXP Semiconductors TSSOP16: plastic thin shrink small outline package; 16 leads; body width 4 pin 1 index 1 DIMENSIONS (mm are the original dimensions) A UNIT max. 0.15 0.95 mm 1.1 0.25 0.05 0.80 Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic interlead protrusions of 0.25 mm maximum per side are not included. ...
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... NXP Semiconductors DHVQFN16: plastic dual in-line compatible thermal enhanced very thin quad flat package; no leads; 16 terminals; body 2.5 x 3.5 x 0.85 mm terminal 1 index area terminal 1 index area DIMENSIONS (mm are the original dimensions) (1) A UNIT max. 0.05 0. 0.2 0.00 0.18 Note 1. Plastic or metal protrusions of 0.075 mm maximum per side are not included. ...
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... NXP Semiconductors 14. Abbreviations Table 10. Abbreviations Acronym Description CDM Charged Device Model ESD ElectroStatic Discharge HBM Human Body Model MM Machine Model TTL Transistor-Transistor Logic 15. Revision history Table 11. Revision history Document ID Release date CBT3257A_4 20090319 • Modifications: Table 4 “Limiting values” CBT3257A_3 ...
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... Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice ...
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... NXP Semiconductors 18. Contents 1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 3 Ordering information . . . . . . . . . . . . . . . . . . . . . 1 4 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2 5 Pinning information . . . . . . . . . . . . . . . . . . . . . . 3 5.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 5.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4 6 Functional description . . . . . . . . . . . . . . . . . . . 4 7 Limiting values Recommended operating conditions Static characteristics Dynamic characteristics . . . . . . . . . . . . . . . . . . waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . 6 12 Test information . . . . . . . . . . . . . . . . . . . . . . . . . 8 13 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 9 14 Abbreviations ...