54F540DM NSC [National Semiconductor], 54F540DM Datasheet

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54F540DM

Manufacturer Part Number
54F540DM
Description
Octal Buffer/Line Driver with TRI-STATE Outputs
Manufacturer
NSC [National Semiconductor]
Datasheet

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Part Number:
54F540DMQB
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C 1995 National Semiconductor Corporation
54F 74F540 54F 74F541
Octal Buffer Line Driver with TRI-STATE Outputs
General Description
The ’F540 and ’F541 are similar in function to the ’F240 and
’F244 respectively except that the inputs and outputs are
on opposite sides of the package (see Connection Dia-
grams) This pinout arrangement makes these devices es-
pecially useful as output ports for microprocessors allowing
ease of layout and greater PC board density
Connection Diagrams
TRI-STATE is a registered trademark of National Semiconductor Corporation
Note 1 Devices also available in 13 reel Use suffix
Note 2 Military grade device with environmental and burn-in processing Use suffix
74F540PC
74F540SC (Note 1)
74F540SJ (Note 1)
74F541PC
74F541SC (Note 1)
74F541SJ (Note 1)
Commercial
DIP SOIC and Flatpak
Pin Assignment for
54F540DM (Note 2)
54F540FM (Note 2)
54F540LM (Note 2)
54F541DM (Note 2)
54F541FM (Note 2)
54F541LM (Note 2)
TL F 9553
Military
e
TL F 9553 – 1
SCX and SJX
Package
N20A
J20A
M20B
M20D
W20A
E20A
N20A
J20A
M20B
M20D
W20A
E20A
Number
’F540
Features
Y
Y
20-Lead (0 300 Wide) Molded Dual-In-Line
20-Lead Ceramic Dual-In-Line
20-Lead (0 300 Wide) Molded Small Outline JEDEC
20-Lead (0 300 Wide) Molded Small Outline EIAJ
20-Lead Cerpack
20-Lead Ceramic Leadless Chip Carrier Type C
20-Lead (0 300 Wide) Molded Dual-In-Line
20-Lead Ceramic Dual-In-Line
20-Lead (0 300 Wide) Molded Small Outline JEDEC
20-Lead (0 300 Wide) Molded Small Outline EIAJ
20-Lead Cerpack
20-Lead Ceramic Leadless Chip Carrier Type C
TRI-STATE outputs drive bus lines
Inputs and outputs opposite side of package allowing
easier interface to microprocessors
e
DMQB FMQB and LMQB
Package Description
Pin Assignment
for LCC
RRD-B30M75 Printed in U S A
TL F 9553 – 2
May 1995

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54F540DM Summary of contents

Page 1

... Connection Dia- grams) This pinout arrangement makes these devices es- pecially useful as output ports for microprocessors allowing ease of layout and greater PC board density Commercial Military 74F540PC 54F540DM (Note 2) 74F540SC (Note 1) 74F540SJ (Note 1) 54F540FM (Note 2) 54F540LM (Note 2) 74F541PC 54F541DM (Note 2) ...

Page 2

Connection Diagrams (Continued) Unit Loading Fan Out Pin Names Description OE OE TRI-STATE Output Enable Input (Active LOW Inputs Outputs n n Truth Table Inputs Outputs ’F540 ...

Page 3

Absolute Maximum Ratings If Military Aerospace specified devices are required please contact the National Semiconductor Sales Office Distributors for availability and specifications Storage Temperature b Ambient Temperature under Bias b Junction Temperature under Bias b Plastic b V Pin Potential ...

Page 4

DC Electrical Characteristics Symbol Parameter I Power Supply Current (’F540) CCH I Power Supply Current (’F540) CCL I Power Supply Current (’F540) CCZ I Power Supply Current (’F541) CCH I Power Supply Current (’F541) CCL I Power Supply Current (’F541) ...

Page 5

Physical Dimensions inches (millimeters) 20-Lead Ceramic Leadless Chip Carrier (L) NS Package Number E20A 5 ...

Page 6

Physical Dimensions inches (millimeters) (Continued) 20-Lead Ceramic Dual-In-Lead Package (D) 20-Lead (0 300 Wide) Molded Small Outline Package JEDEC (S) NS Package Number J20A NS Package Number M20B 6 ...

Page 7

Physical Dimensions inches (millimeters) (Continued) 20-Lead (0 300 Wide) Molded Small Outline Package EIAJ (SJ) 20-Lead (0 300 Wide) Molded Dual-In-Line Package (P) NS Package Number M20D NS Package Number N20A 7 ...

Page 8

Physical Dimensions inches (millimeters) (Continued) LIFE SUPPORT POLICY NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF NATIONAL SEMICONDUCTOR CORPORATION As used herein 1 ...

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