HPMX-3003-BLK Agilent(Hewlett-Packard), HPMX-3003-BLK Datasheet

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HPMX-3003-BLK

Manufacturer Part Number
HPMX-3003-BLK
Description
1.5 - 2.5 GHz LNA Switch PA
Manufacturer
Agilent(Hewlett-Packard)
Datasheet
LNA out
1.5 – 2.5 GHz LNA Switch PA
Technical Data
Features
• GaAs MMIC LNA-Switch-
• LNA: 2.2 dB NF, 13 dB G
• Switch: 55 dBm OIP @
• Power Amp: +4 dBm in,
• 3 or 5 V Operation
• JEDEC Standard SSOP-28
Applications
• Personal Communications
• Cordless Telephone Systems
• 2400 MHz Wireless LANs
5965-1403E
Functional Block Diagram
(VG1)
PA in
Power Amp for 1.5 – 2.5 GHz
Transceiver Use
1.9 GHz
1.9 GHz
+27.5 dBm out, 23.5 dB Gain,
35%
Surface Mount Package
Systems (PCS)
and ISM Band Spread
Spectrum Applications
C1
C2
add
@ 1.9 GHz
VD1
VG2
a
@
Plastic SSOP-28
VD2
Package Pin
Configuration
LNA in
SW1
Antenna
SW2
PA out
7-82
YYWW
HPMX
3003
HPMX-3003
Description
Hewlett-Packard’s HPMX-3003
combines a Low Noise Amplifier,
GaAs MMIC switch, and 27.5 dBm
power amp in a single miniature
28 lead surface mount plastic
package. This RFIC would
typically serve as the “front end”
and power stage of a battery
operated wireless transceiver for
PCS or ISM band use. Each
section of the RFIC can also be
used independently.
The single-supply LNA makes use
of the low noise characteristics of
GaAs to create a matched, broad-
band amplifier with target perfor-
mance of 13 dB gain and 2.2 dB
noise figure. The switch provides
+55 dBm IP3 for linear operation.
The power amplifier produces up
to 820 mW with 35% power added
efficiency.
The HPMX-3003 is fabricated with
Hewlett-Packard’s GaAs MMIC
process, and features a nominal
0.5 micron recessed Schottky-
barrier-gate, gold metallization,
and silicon nitride passivation to
produce MMICs with superior
performance, uniformity and
reliability.

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HPMX-3003-BLK Summary of contents

Page 1

... The switch provides +55 dBm IP3 for linear operation. The power amplifier produces up to 820 mW with 35% power added efficiency. The HPMX-3003 is fabricated with Hewlett-Packard’s GaAs MMIC process, and features a nominal 0.5 micron recessed Schottky- barrier-gate, gold metallization, and silicon nitride passivation to ...

Page 2

... LNA P = -20 dBm dBm, frequency = 1.9 GHz in in Perfomance cited is performance in test circuit shown in Figure 17. HPMX-3003 Guaranteed Electrical Specifications Standard test conditions apply unless otherwise noted. Symbol Parameters and Test Conditions G LNA gain through switch test P Output power through switch ...

Page 3

... HPMX-3003 Pin Description Gnd 1 Gnd 2 Gnd Gnd 5 Gnd 6 VD1 7 LNA out 8 Gnd 9 Gnd 10 LNA in 11 Gnd 12 SW1 Figure 1. HPMX-3003 Pin Outs and Schematic [ 3 dBm 3 3 dBm ...

Page 4

... HPMX-3003 Pin Description Table No. Mnemonic Description Typical Signal 1 Gnd ground 2 Gnd ground 3 Gnd ground 4 PA input to Power in Amplifier 5 Gnd ground 6 Gnd ground 7 VD1 Drain bias of PA stage 1 8 LNA out output of LNA 9 Gnd ground 10 Gnd ground 11 LNA in input of LNA 12 Gnd ground ...

Page 5

... HPMX-3003 Typical Performance Standard test conditions apply unless otherwise noted. 2.4 GHz performance is performance in test circuit shown in Figure 18. Some aspects of performance are determined by the test circuit impedances 2.5 3 3.5 4 4.5 5 5.5 6 VOLTAGE (V) Figure 2. LNA Current vs. Device Voltage at 1900 MHz. ...

Page 6

... Figure 11. PA Current vs. Temperature at 1900 MHz and VD1 = 3 -10 -20 -30 -40 1.4 1.6 1.8 2.0 2.2 2.4 2.6 FREQUENCY (GHz) Figure 14. Switch Isolation and “ON” State Return Loss vs. Frequency. HPMX-3003 Typical Scattering Parameters for the LNA, Common Source Frequency S 11 GHz Mag Ang 1.0 0.97 -27 1.2 0.96 -33 1 ...

Page 7

... VG1 ~ – 0.75V 500 VD1 = 3.6V 100 LNA out 2 3.0V 1000 pF 100 pF LNA in 2.5 nH SW1 C1 Figure 18. HPMX-3003 Test Circuit (2400 MHz). 10 VG2 ~ – 0.75V 10 pF 1000 VD2 = 3.6V 2 out 30 pF SW2 C2 Antenna 10 VG2 ~ – 0.75V 10 pF 1000 VD2 = 3 ...

Page 8

... JEDEC Standard SSOP-28 Package Outline Drawing 8.255 (0.325) 10.000 (0.394) 0.185 (0.007) 0.635 (0.025) 0.250 (0.010) Part Number Ordering Information Part Number No. of Devices HPMX-3003-TR1 HPMX-3003-BLK 6.000 (0.236) TYPICAL DIMENSIONS ARE 3.850 (0.152) IN MILLIMETERS (INCHES) MEETS JEDEC OUTLINE DIMENSIONS 1.400 (0.055) 0.600 (0.024) Container ...

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