ICX209 SONY [Sony Corporation], ICX209 Datasheet - Page 17

• Manufacturer Part Number: ICX209
• Description: Diagonal 4.5mm (Type 1/4) CCD Image Sensor for PAL Color Video Cameras
• Manufacturer: SONY [Sony Corporation]

5) Others
c) The adhesive may cause the marking on the rear surface to disappear, especially in case the regulated
d) The notch of the package is used for directional index, and that can not be used for reference of fixing.
e) If the lead bend repeatedly and the metal, etc., clash or rub against the package, the dust may be
f) Acrylate anaerobic adhesives are generally used to attach CCD image sensors. In addition, cyano-
a) Do not expose to strong light (sun rays) for long periods, color filters will be discolored. When high
b) Exposure to high temperature or humidity will affect the characteristics. Accordingly avoid storage or
c) The brown stain may be seen on the bottom or side of the package. But this does not affect the CCD
d) This package has 2 kinds of internal structure. However, their package outline, optical size, and strength
The cross section of lead frame can be seen on the side of the package for structure A.
voltage value is indicated on the rear surface. Therefore, the adhesive should not be applied to this area,
and indicated values should be transferred to the other locations as a precaution.
In addition, the cover glass and seal resin may overlap with the notch of the package.
generated by the fragments of resin.
acrylate instantaneous adhesives are sometimes used jointly with acrylate anaerobic adhesives. (reference)
luminance objects are imaged with the exposure level control by electronic-iris, the luminance of the
image-plane may become excessive and discolor of the color filter will possibly be accelerated. In such a
case, it is advisable that taking-lens with the automatic-iris and closing of the shutter during the power-off
mode should be properly arranged. For continuous using under cruel condition exceeding the normal
using condition, consult our company.
usage in such conditions.
characteristics.
are the same.
Cross section of
lead frame
Structure A
– 17 –
Package
Metal plate
(lead frame)
Chip
Structure B
ICX209AK