ICX274 SONY [Sony Corporation], ICX274 Datasheet - Page 71

• Manufacturer Part Number: ICX274
• Description: Diagonal 8.923mm (Type 1/1.8) Progressive Scan CCD Image Sensor with Square Pixel for Color Cameras
• Manufacturer: SONY [Sony Corporation]

5) Others
c) The adhesive may cause the marking on the rear surface to disappear, especially in case the regulated
d) The notch of the package is used for directional index, and that can not be used for reference of fixing.
e) If the leads are bent repeatedly and metal, etc., clash or rub against the package, the dust may be
f) Acrylate anaerobic adhesives are generally used to attach CCD image sensors. In addition, cyano-
a) Do not expose to strong light (sun rays) for long periods, as color filters will be discolored. When high
b) Exposure to high temperature or humidity will affect the characteristics. Accordingly avoid storage or
c) Brown stains may be seen on the bottom or side of the package. But this does not affect the CCD
d) This package has 2 kinds of internal structure. However, their package outline, optical size, and strength
voltage value is indicated on the rear surface. Therefore, the adhesive should not be applied to this area,
and indicated values should be transferred to other locations as a precaution.
In addition, the cover glass and seal resin may overlap with the notch of the package.
generated by the fragments of resin.
acrylate instantaneous adhesives are sometimes used jointly with acrylate anaerobic adhesives.
(reference)
luminous objects are imaged with the exposure level controlled by the electronic iris, the luminance of
the image-plane may become excessive and discoloring of the color filter will possibly be accelerated. In
such a case, it is advisable that taking-lens with the automatic-iris and closing of the shutter during the
power-off mode should be properly arranged. For continuous using under cruel condition exceeding the
normal using condition, consult our company.
usage in such conditions.
characteristics.
are the same.
The cross section of lead frame can be seen on the side of the package for structure A.
Cross section of
lead frame
Structure A
– 71 –
Package
Metal plate
(lead frame)
Chip
Structure B
ICX274AQF