APM4550KC-TRL ANPEC [Anpec Electronics Coropration], APM4550KC-TRL Datasheet - Page 12

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APM4550KC-TRL

Manufacturer Part Number
APM4550KC-TRL
Description
Dual Enhancement Mode MOSFET (N- and P-Channel)
Manufacturer
ANPEC [Anpec Electronics Coropration]
Datasheet
Notes: All temperatures refer to topside of the package. Measured on the body surface.
APM4550K
Physical Specifications
Reflow Condition
Copyright
Rev. A.1 - May, 2007
Average ramp-up rate
(T
Preheat
Time maintained above:
Peak/Classification Temperature (Tp)
Time within 5 C of actual
Peak Temperature (tp)
Ramp-down Rate
Time 25 C to Peak Temperature
Classification Reflow Profiles
Terminal Material
Lead Solderability
L
- Temperature Min (Tsmin)
- Temperature Max (Tsmax)
- Time (min to max) (ts)
- Temperature (T
- Time (t
to T
P
)
T
T
25
P
L
L
)
ANPEC Electronics Corp.
Profile Feature
Tsmax
Tsmin
L
)
Solder-Plated Copper (Solder Material : 90/10 or 63/37 SnPb), 100%Sn
Meets EIA Specification RSI86-91, ANSI/J-STD-002 Category 3.
(IR/Convection or VPR Reflow)
Preheat
t 25 C to Peak
ts
Sn-Pb Eutectic Assembly
Ramp-up
3 C/second max.
6 C/second max.
60-120 seconds
60-150 seconds
6 minutes max.
10-30 seconds
See table 1
12
100 C
150 C
183 C
Tim e
tp
Ramp-down
t
L
Pb-Free Assembly
3 C/second max.
6 C/second max.
60-180 seconds
60-150 seconds
8 minutes max.
20-40 seconds
See table 2
150 C
200 C
217 C
www.anpec.com.tw
Critical Zone
T
L
to T
P

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