MPX2300DT1_10 FREESCALE [Freescale Semiconductor, Inc], MPX2300DT1_10 Datasheet

MPX2300DT1_10

Manufacturer Part Number

MPX2300DT1_10

Description

High Volume Pressure Sensor for Disposable Applications

Manufacturer

FREESCALE [Freescale Semiconductor, Inc]

Datasheet

1.MPX2300DT1_10.pdf (5 pages)

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Freescale Semiconductor

NOTE: The die and wire bonds are exposed on the front side of the Chip Pak (pressure is applied to the backside of the device).

MPX2300DT1

MPX2301DT1

High Volume Pressure Sensor

for Disposable Applications

pressure sensor package which is ideal as a sub-module component or a

disposable unit. The unique concept of the Chip Pak allows great flexibility in

system design while allowing an economic solution for the designer. This new

chip carrier package uses Freescale Semiconductor's unique sensor die with its

piezoresistive technology, along with the added feature of on-chip, thin-film

temperature compensation and calibration.

Features

• Low Cost

• Integrated Temperature Compensation and Calibration

• Ratiometric to Supply Voltage

• Polysulfone Case Material (ISO 10993)

• Provided in Easy-to-Use Tape and Reel

NOTE:Freescale Semiconductor is also offering the Chip Pak package in

Freescale Semiconductor has developed a low cost, high volume, miniature

Device Name

application-specific configurations, which will have an “SPX” prefix,

followed by a four-digit number, unique to the specific customer

Front side die and wire protection must be provided in the customer's housing. Use caution when handling the devices

during all processes.

Package Options

Tape and Reel

Case

423A

No.

ORDERING INFORMATION

MPX2300DT1/MPX2301DT1

CHIP PAK PACKAGE

CASE 423A-03

Gauge

Pressure Type

Differential

•

Application Examples

• Medical Diagnostics

• Infusion Pumps

• Blood Pressure Monitors

• Pressure Catheter Applications

• Patient Monitoring

Absolute

MPX2300DT1

MPX2301DT1

Pressure Sensors

0 to 300 mmHg

(0 to 40 kPa)

Date Code, Lot ID

Device Marking

Pressure

Rev 8, 04/2010

MPX2300DT1

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MPX2300DT1_10 Summary of contents

Page 1

Freescale Semiconductor High Volume Pressure Sensor for Disposable Applications Freescale Semiconductor has developed a low cost, high volume, miniature pressure sensor package which is ideal as a sub-module component or a disposable unit. The unique concept of the Chip Pak ...

Page 2

Pressure The MPX2300DT1/MPX2301DT1 Pressure Sensors have been designed for medical usage by combining the performance of Freescale's shear stress pressure sensor design and the use of biomedically approved materials. Materials with a proven history in medical situations have been chosen ...

Page 3

Maximum Ratings (1) Table 1. Maximum Ratings Rating Maximum Pressure (Backside) Storage Temperature Operating Temperature 1. Exposure beyond the specified limits may cause permanent damage or degradation to the device. Operating Characteristics Table 2. Operating Characteristics (V Characteristics Pressure Range ...

Page 4

Pressure FRONT VIEW BACK VIEW MPX2300DT1 4 PACKAGE DIMENSIONS DETAIL DETAIL A CASE 423A-03 ISSUE C CHIP PAK PACKAGE C F ...

Page 5

How to Reach Us: Home Page: www.freescale.com Web Support: http://www.freescale.com/support USA/Europe or Locations Not Listed: Freescale Semiconductor, Inc. Technical Information Center, EL516 2100 East Elliot Road Tempe, Arizona 85284 1-800-521-6274 or +1-480-768-2130 www.freescale.com/support Europe, Middle East, and Africa: Freescale Halbleiter ...

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