MPXV7002 FREESCALE [Freescale Semiconductor, Inc], MPXV7002 Datasheet

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MPXV7002

Manufacturer Part Number
MPXV7002
Description
Integrated Silicon Pressure Sensor On-Chip Signal Conditioned, Temperature Compensated and Calibrated
Manufacturer
FREESCALE [Freescale Semiconductor, Inc]
Datasheet

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Part Number:
MPXV7002DP
Manufacturer:
FREESCALE
Quantity:
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Part Number:
MPXV7002DP
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Freescale Semiconductor
Technical Data
© Freescale Semiconductor, Inc., 2005. All rights reserved.
Integrated Silicon Pressure Sensor
On-Chip Signal Conditioned,
Temperature Compensated and
Calibrated
monolithic silicon pressure sensors designed for a wide range of applications, but
particularly those employing a microcontroller or microprocessor with A/D inputs.
This transducer combines advanced micromachining techniques, thin-film
metallization, and bipolar processing to provide an accurate, high level analog
output signal that is proportional to the applied pressure.
Features
Typical Applications
SMALL OUTLINE PACKAGE (MPXV7002 SERIES)
Elements
Device
Ported
Type
The MPXV7002 series piezoresistive transducers are state-of-the-art
2.5% Typical Error over +10°C to +60°C with Auto Zero
6.25% Maximum Error over +10°C to +60°C without Auto Zero
Ideally Suited for Microprocessor or Microcontroller-Based Systems
Thermoplastic (PPS) Surface Mount Package
Temperature Compensated over +10° to +60°C
Patented Silicon Shear Stress Strain Gauge
Available in Differential and Gauge Configurations
Hospital Beds
HVAC
Respiratory Systems
Process Control
Gauge, Axial Port, SMT
Gauge, Axial Port, SMT
Gauge, Side Port, SMT
Differential, Dual Port,
SMT
Differential, Dual Port,
SMT
Options
ORDERING INFORMATION
Case
482A
482A
1369
1351
1351
No.
Sensing
Element
MPXV7002GC6U
MPXV7002GC6T1 Tape &
MPXV7002GP
MPXV7002DP
MPXV7002DPT1
MPX Series
Order No.
GND
Compensation
Gain Stage #1
Temperature
Thin Film
Pins 1 and 5 through 8 are NO CONNECTS
for surface mount package
and
Packing
Options
Tape &
V
Trays MPXV7002G
Trays MPXV7002G
Rails
S
Reel
Reel
MPXV7002G
MPXV7002G
MPXV7002G
Marking
Device
Gain Stage #2
Shift Circuitry
Reference
Ground
and
1. Pins 1, 5, 6, 7, and 8 are internal device
connections. Do not connect to external
circuitry or ground. Pin 1 is noted by the
notch in the lead.
CASE 1369-01
MPXV7002GP
1
2
3
4
V
SMALL OUTLINE PACKAGE
SMALL OUTLINE PACKAGE
out
Document Number: MPXV7002
-2 to 2 kPa (-0.3 to 0.3 psi)
PRESSURE SENSOR
0.5 to 4.5 V OUTPUT
MPXV7002
PIN NUMBERS
MPXV7002GC6U
CASE 482A-01
INTEGRATED
SERIES
Gnd
N/C
V
V
out
S
CASE 1351-01
MPXV7002DP
Rev 0, 09/2005
5
6
7
8
(1)
N/C
N/C
N/C
N/C

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MPXV7002 Summary of contents

Page 1

... Integrated Silicon Pressure Sensor On-Chip Signal Conditioned, Temperature Compensated and Calibrated The MPXV7002 series piezoresistive transducers are state-of-the-art monolithic silicon pressure sensors designed for a wide range of applications, but particularly those employing a microcontroller or microprocessor with A/D inputs. This transducer combines advanced micromachining techniques, thin-film metallization, and bipolar processing to provide an accurate, high level analog output signal that is proportional to the applied pressure ...

Page 2

... Variation from Nominal: The variation from nominal values, for Offset or Full Scale Span percent Auto Zero at Factory Installation: Due to the sensitivity of the MPXV7002 Series, external mechanical stresses and mounting position can affect the zero pressure output reading. Autozero is defined as storing the zero pressure output reading and subtracting this from the device's output during normal operations. Reference AN1636 for specific information. The specified accuracy assumes a maximum temperature change of ± ...

Page 3

... The MPXV7002 series pressure sensor operating characteristics, and internal reliability and qualification tests are based on use of dry air as the pressure media. Media, other than dry air, may have adverse effects on sensor ...

Page 4

... The footprint for the surface mount packages must be the correct size to ensure proper solder connection interface between the board and the package. With the correct 0.060 TYP 8X 1.52 MPXV7002 4 The Pressure (P1) side may be identified by using the table below: Case Type 482A-01 ...

Page 5

... ALL VERTICAL SURFACES 5˚ TYPICAL DRAFT. INCHES MILLIMETERS DIM MIN MAX MIN MAX A 0.415 0.425 10.54 10.79 B 0.415 0.425 10.54 10.79 C 0.500 0.520 12.70 13.21 D 0.038 0.042 0.96 1.07 G 0.100 BSC 2.54 BSC H 0.002 0.010 0.05 0.25 J 0.009 0.011 0.23 0.28 K 0.061 0.071 1.55 1.80 M 0˚ 7˚ 0˚ 7˚ N 0.444 0.448 11.28 11.38 S 0.709 0.725 18.01 18.41 V 0.245 0.255 6.22 6.48 W 0.115 0.125 2.92 3.17 MPXV7002 5 ...

Page 6

... MPXV7002 6 PACKAGE DIMENSIONS CASE 1351-01 ISSUE A SMALL OUTLINE PACKAGE PAGE Sensors Freescale Semiconductor ...

Page 7

... Sensors Freescale Semiconductor PACKAGE DIMENSIONS CASE 1351-01 ISSUE A SMALL OUTLINE PACKAGE PAGE MPXV7002 7 ...

Page 8

... MPXV7002 8 PACKAGE DIMENSIONS CASE 1369-01 ISSUE B SMALL OUTLINE PACKAGE PAGE Sensors Freescale Semiconductor ...

Page 9

... Sensors Freescale Semiconductor PACKAGE DIMENSIONS CASE 1369-01 ISSUE B SMALL OUTLINE PACKAGE PAGE MPXV7002 9 ...

Page 10

... Freescale Semiconductor Literature Distribution Center P.O. Box 5405 Denver, Colorado 80217 1-800-441-2447 or 303-675-2140 Fax: 303-675-2150 LDCForFreescaleSemiconductor@hibbertgroup.com MPXV7002 Rev. 0 09/2005 Information in this document is provided solely to enable system and software implementers to use Freescale Semiconductor products. There are no express or implied copyright licenses granted hereunder to design or fabricate any integrated circuits or integrated circuits based on the information in this document ...

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