FST3384QSC Fairchild Semiconductor, FST3384QSC Datasheet

FST3384QSC

Manufacturer Part Number

FST3384QSC

Description

IC SWITCH BUS 10BIT LP 24QSOP

Manufacturer

Fairchild Semiconductor

Type

Bus Switchr

Datasheet

1.FST3384MTCX.pdf (5 pages)

Specifications of FST3384QSC

Circuit

5 x 1:1

Independent Circuits

Voltage Supply Source

Single Supply

Voltage - Supply

4 V ~ 5.5 V

Operating Temperature

-40°C ~ 85°C

Mounting Type

Surface Mount

Package / Case

24-QSOP

0606

Lead Free Status / RoHS Status

Lead free / RoHS Compliant

Current - Output High, Low

Available stocks

Company

Part Number

Manufacturer

Quantity

Price

Company:

Bonase Electronics (HK) Co., Limited

Part Number:

FST3384QSCX

Manufacturer:

Quantity:

Company:

BOSTOCK HK LIMITED

Part Number:

FST3384QSCX

Manufacturer:

FAIR

Quantity:

1 000

Company:

BOSTOCK HK LIMITED

Part Number:

FST3384QSCX

Manufacturer:

FAIR

Quantity:

5 000

Company:

Meier Automation Equipment Co., Limited

Part Number:

FST3384QSCX

Manufacturer:

FAIRCHILD/仙童

Quantity:

20 000

Company:

H&T Electronics

Part Number:

FST3384QSCX

Quantity:

1 300

Current page: 1 of 4
Download datasheet (41Kb)

This is to inform you that a design and/or process change will be made to the following

product(s). This notification is for your information and concurrence.

If you require data or samples to qualify this change, please contact Fairchild Semiconductor

within 30 days of receipt of this notification.

Updated process quality documentation, such as FMEAs and Control Plans, are available for

viewing upon request.

If you have any questions concerning this change, please contact:

PCN Originator:

Name: Lam, HH

E-mail: HH.Lam@fairchildsemi.com

Phone: 604 850 2392

Implementation of change:

Expected 1st Device Shipment Date: 2008/11/14

Earliest Year/Work Week of Changed Product: 0847

Change Type Description: Mold Compound

Description of Change (From): NMSON 8L and NQSOP 16/20/24L packages assembly at all

FSC approved manufacturing locations (Unisem) using non Green mold compound as shown in

table 1.

Description of Change (To): NMSON 8L and NQSOP 16/20/24L packages assembly at all FSC

approved manufacturing locations (Unisem) using Green mold compound as shown in table 2.

Reason for Change : 1. Current mold compound supplier has announce the discontinuance of

LSA mold compound EME6730B. Based on current run rates there is a potential for a mold

compound material shortage if this PCN is not approved within the timeframe noted above. 2.

Green initiative by Fairchild Semiconductor. Fairchild Semiconductor is dedicated to being a

good corporate citizen. All Fairchild Semiconductor products are 2nd level interconnect

lead-free and RoHS compliance. The referenced material changes have been made to provide a

'Full Green' (Halogen Free Flame Retardant) package. For additional details on the corporate

wide green initiative please visit our Web site at :

http://www.fairchildsemi.com/company/green/index.html Manufacturing will occur at the same

assembly facilities producing the current non-green products. Package outline drawings of the

affected products remain un-changed. Green products will be fully compliant to all published

data sheet specifications and will be interchangeable with current non-green product. Quality

and reliability will remain at the highest standards already demonstrated with Fairchild's

existing products.

Qual/REL Plan Numbers : Q20070249

DESIGN/PROCESS CHANGE NOTIFICATION -- FINAL

Technical Contact:

Name: Po, Peter

E-mail: Peter.Po@notes.fairchildsemi.com

Phone: 604 850 2267

Date Issued On : 2008/08/27

Date Created : 2008/07/21

PCN# : Q3083001

Pg. 1

Related parts for FST3384QSC

FST3384QSC Summary of contents

Page 1

... This is to inform you that a design and/or process change will be made to the following product(s). This notification is for your information and concurrence. If you require data or samples to qualify this change, please contact Fairchild Semiconductor within 30 days of receipt of this notification. Updated process quality documentation, such as FMEAs and Control Plans, are available for viewing upon request ...

Page 2

Qualification : All the reliability tests defined in this qual plan completed with no failures. Therefore Unisem is qualified to assembly NMSON 8L and NQSOP 16/20/24L packages. Change From Change To Results/Discussion for Qual Plan NumberQ20070249 Test: (Autoclave) Lot Device ...

Page 3

... Test: MSL(3), PKG(Small), PeakTemp(260c), Cycles(3) (Precondition) Lot Device Q20070249AAPCNL3AB 74F543PC Product Id Description : This Final PCN covers Fairchild Semiconductor NMSON 8L and NQSOP 16/20/24L packages. For a complete listing of products covered in this PCN release, please refer to the Affected FSID listing. Affected FSIDs : 100EL11MX 100EL16M ...

Page 4

... FST3384QSCX FSUSB22QSCX GTLP1B151M FST3384QSC FSUSB22QSC GTLP2T152MX FST6800QSCX GTLP1B151MX GTLP2T152M Pg. 4 ...

Related keywords

fst3384
fst3345
fst3384wm
fst3383
fst3345mtc
fst3384wmx
fst3384qsc
fst3384mtc
fst3306
fst3384qscx
fst3384mtcx
FST3384QSC datasheet
FST3384QSC data sheet
FST3384QSC pdf datasheet
FST3384QSC component
FST3384QSC part
FST3384QSC distributor
FST3384QSC RoHS
FST3384QSC datasheet download