VCBUP8168CCYG2

Manufacturer Part NumberVCBUP8168CCYG2
DescriptionDigital Signal Processors & Controllers - DSP, DSC DaVinci Digital Media Processor
ManufacturerTexas Instruments
SeriesTMS320DM8168
VCBUP8168CCYG2 datasheet
 


Specifications of VCBUP8168CCYG2

RohsyesCoreTMS320DM816x
Data Bus Width32 bitProgram Memory Size32 KB
Data Ram Size256 KBMaximum Clock Frequency1.35 GHz
Number Of Programmable I/os64Number Of Timers7
Device Million Instructions Per Second9000 MIPsOperating Supply Voltage1.5 V, 1.8 V, 3.3 V
Maximum Operating Temperature+ 95 CPackage / CaseFCBGA-1031
Mounting StyleSMD/SMTInstruction Set ArchitectureFloating Point
Interface TypeSPIMinimum Operating Temperature0 C
On-chip AdcNoProcessor SeriesTMS320DM8168
ProductDSPsProgram Memory TypeCache
Supply Current3.3 VSupply Voltage - Min1.5 V
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PARAMETER
Processor-to-HDMI header trace length
Number of stubs allowed on TMDS traces
TX and RX pair differential impedance
TX and RX single-ended impedance
Number of vias on each TMDS trace
TMDS differential pair to any other trace spacing
(1) Vias must be used in pairs with their distance minimized.
(2) DS = differential spacing of the HDMI traces.
8.9.1.3
DDC Signals
As shown in
Figure
8-66, the DDC connects just like a standard I2C bus. As such, resistor pullups must
be used to pull up the open drain buffer signals unless they are integrated into the ESD protection chip
used. If used, these pullup resistors should be connected to a 3.3-V supply.
8.9.1.4
HDMI ESD Protection Device (Required)
Interfaces that connect to a cable such as HDMI generally require more ESD protection than can be built
into the processor's outputs. Therefore, this HDMI interface requires the use of an ESD protection chip to
provide adequate ESD protection and to translate I2C voltage levels from the 3.3 V supplied by the device
to the 5 volts required by the HDMI specification.
When selecting an ESD protection chip, choose the lowest capacitance ESD protection available to
minimize signal degradation. In no case should the ESD protection circuit capacitance be more than 5 pF.
TI manufactures devices that provide ESD protection for HDMI signals such as the TPD12S521. For more
information see the
www.ti.com
8.9.1.5
PCB Stackup Specifications
Table 8-63
shows the stackup and feature sizes required for HDMI.
Table 8-63. HDMI PCB Stackup Specifications
PARAMETER
PCB routing and plane layers
Signal routing layers
Number of ground plane cuts allowed within HDMI routing region
Number of layers between HDMI routing region and reference ground plane
PCB trace width
PCB BGA escape via pad size
PCB BGA escape via hole size
(1) (2)
Processor device BGA pad size
(1) Non-solder mask defined pad.
(2) Per IPC-7351A BGA pad size guideline.
Copyright © 2011–2013, Texas Instruments Incorporated
Product Folder Links:
Table 8-62. TMDS Routing Specifications
website.
Submit Documentation Feedback
TMS320DM8168 TMS320DM8167 TMS320DM8166 TMS320DM8165
TMS320DM8168, TMS320DM8167
TMS320DM8166, TMS320DM8165
SPRS614D – MARCH 2011 – REVISED JANUARY 2013
MIN
TYP
MAX
UNIT
7000
Mils
0
Stubs
90
100
110
Ω
54
60
66
Ω
2
Vias
(2)
2*DS
MIN
TYP
MAX
UNIT
4
6
-
Layers
2
3
-
Layers
-
-
0
Cuts
-
-
0
Layers
-
4
-
Mils
-
20
-
Mils
-
10
Mils
0.3
mm
Peripheral Information and Timings
(1)
255