MC14490DWR2G ON Semiconductor, MC14490DWR2G Datasheet

MC14490DWR2G

Manufacturer Part Number

MC14490DWR2G

Description

IC ELIMINATOR BOUNCE HEX 16-SOIC

Manufacturer

ON Semiconductor

Series

4000r

Datasheet

1.MC14490DWG.pdf (11 pages)

Specifications of MC14490DWR2G

Logic Type

Contact Bounce Eliminator

Supply Voltage

3 V ~ 18 V

Number Of Bits

Operating Temperature

-55°C ~ 125°C

Mounting Type

Surface Mount

Package / Case

16-SOIC (0.300", 7.5mm Width)

Function

Eliminator

Operating Temperature (max)

125C

Operating Temperature (min)

-55

Package Type

SOIC W

Pin Count

Mounting

Surface Mount

Mounting Style

SMD/SMT

Number Of Circuits

Hex

Lead Free Status / RoHS Status

Lead free / RoHS Compliant

Other names

MC14490DWR2G
MC14490DWR2GOSTR

Available stocks

Company

Part Number

Manufacturer

Quantity

Price

Company:

Bonase Electronics (HK) Co., Limited

Part Number:

MC14490DWR2G

Manufacturer:

Quantity:

1 902

Company:

Meier Automation Equipment Co., Limited

Part Number:

MC14490DWR2G

Manufacturer:

ON/安森美

Quantity:

20 000

Current page: 1 of 11
Download datasheet (189Kb)

MC14490

Hex Contact Bounce

Eliminator

mode devices, and is used for the elimination of extraneous level changes

that result when interfacing with mechanical contacts. The digital contact

bounce eliminator circuit takes an input signal from a bouncing contact

and generates a clean digital signal four clock periods after the input has

stabilized. The bounce eliminator circuit will remove bounce on both the

“make” and the “break” of a contact closure. The clock for operation of

the MC14490 is derived from an internal R−C oscillator which requires

only an external capacitor to adjust for the desired operating frequency

(bounce delay). The clock may also be driven from an external clock

source or the oscillator of another MC14490 (see Figure 5).

indeterminate states.

Features

•

Stresses exceeding Maximum Ratings may damage the device. Maximum

Ratings are stress ratings only. Functional operation above the Recommended

Operating Conditions is not implied. Extended exposure to stresses above the

Recommended Operating Conditions may affect device reliability.

1. Temperature Derating: Plastic “P and D/DW”

static voltages or electric fields. However, precautions must be taken to avoid

applications of any voltage higher than maximum rated voltages to this

high−impedance circuit. For proper operation, V

to the range V

(e.g., either V

MAXIMUM RATINGS

September, 2009 − Rev. 8

DC Supply Voltage Range

Input or Output Voltage Range

(DC or Transient)

Input Current (DC or Transient) per Pin

Power Dissipation, per Package (Note 1)

Ambient Temperature Range

Storage Temperature Range

Lead Temperature (8−Second Soldering)

The MC14490 is constructed with complementary MOS enhancement

NOTE: Immediately after powerup, the outputs of the MC14490 are in

This device contains protection circuitry to guard against damage due to high

Unused inputs must always be tied to an appropriate logic voltage level

Can Be Used as a Digital Integrator, System Synchronizer, or Delay Line

Diode Protection on All Inputs

Six Debouncers Per Package

Internal Pullups on All Data Inputs

Internal Oscillator (R−C), or External Clock Source

TTL Compatible Data Inputs/Outputs

Single Line Input, Debounces Both “Make” and “Break” Contacts

Does Not Require “Form C” (Single Pole Double Throw) Input Signal

Cascadable for Longer Time Delays

Schmitt Trigger on Clock Input (Pin 7)

Supply Voltage Range = 3.0 V to 18 V

Chip Complexity: 546 FETs or 136.5 Equivalent Gates

These are Pb−Free Devices*

Packages: – 7.0 mW/_C From 65_C To 125_C

Parameter

or V

v (V

). Unused outputs must be left open.

or V

(Voltages Referenced to V

out

) v V

Symbol

, V

and V

stg

out

)

−0.5 to +18.0

−55 to +125

−65 to +150

−0.5 to V

should be constrained

Value

+ 0.5

± 10

500

260

Unit

°C

See detailed ordering and shipping information in the package

dimensions section on page 9 of this data sheet.

*For additional information on our Pb−Free strategy

and soldering details, please download the

ON Semiconductor Soldering and Mounting

Techniques Reference Manual, SOLDERRM/D.

ORDERING INFORMATION

WL, L

YY, Y

WW, W = Work Week

http://onsemi.com

DW SUFFIX

CASE 751G

SOEIAJ−16

CASE 648

CASE 966

P SUFFIX

F SUFFIX

= Assembly Location

= Wafer Lot

= Year

= Pb−Free Package

SOIC−16

PDIP−16

Publication Order Number:

DIAGRAMS

AWLYYWWG

MARKING

AWLYYWWG

MC14490P

MC14490

ALYWG

MC14490/D

14490

Related parts for MC14490DWR2G

MC14490DWR2G Summary of contents

Page 1

... DW SUFFIX AWLYYWWG CASE 751G SOEIAJ−16 MC14490 F SUFFIX ALYWG CASE 966 Assembly Location WL Wafer Lot YY Year WW Work Week G = Pb−Free Package ORDERING INFORMATION and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. Publication Order Number: MC14490/D ...

Page 2

OSCILLATOR φ 1 OSC 7 AND in TWO-PHASE φ 2 CLOCK GENERATOR OSC 9 out PIN ASSIGNMENT ...

Page 3

ELECTRICAL CHARACTERISTICS Î Î Î Î Î ...

Page 4

SWITCHING CHARACTERISTICS Î Î Î Î Î Î Î Î Î Î Î Î Î Î Î Î Î Î Characteristic Î Î Î Î Î Î Î Î Î Î Î Î Î Î Î Î Î Î Î ...

Page 5

The MC14490 Hex Contact Bounce Eliminator is basically a digital integrator. The circuit can integrate both up and down. This enables the circuit to eliminate bounce on both the leading and trailing edges of the signal, shown in the timing ...

Page 6

DD PULLUP RESISTOR (INTERNAL “FORM A” CONTACT 7 OSC OSCILLATOR in AND C ext TWO-PHASE 9 CLOCK GENERATOR OSC out Figure 4. Typical “Form A” Contact Debounce Circuit The single most important characteristic of the MC14490 ...

Page 7

ASYMMETRICAL TIMING In applications where different leading and trailing edge delays are required (such as a fast attack/slow release timer.) Clocks of different frequencies can be gated into the MC14490 as shown in Figure 6. In order to produce a ...

Page 8

≡ ACTIVE LOW B ≡ ACTIVE LOW OSC OR in OSC out INPUT Figure 10. Multiple Output Signal Timing Diagram OUT OUT ...

Page 9

... ORDERING INFORMATION Device MC14490DWG MC14490DWR2G MC14490FG MC14490FELG MC14490PG †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. Package SOIC−16 (Pb−Free) SOIC−16 (Pb−Free) SOEIAJ−16 (Pb−Free) SOEIAJ−16 (Pb− ...

Page 10

−T− 0.25 (0.010 16X 0. SEATING e PLANE 14X ...

Page 11

... Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada Fax: 303− ...

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