MC10EP16DTR2G ON Semiconductor, MC10EP16DTR2G Datasheet

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MC10EP16DTR2G

Manufacturer Part Number
MC10EP16DTR2G
Description
IC RCVR/DRVR 5V DIFF ECL 8-TSSOP
Manufacturer
ON Semiconductor
Series
10EPr
Datasheet

Specifications of MC10EP16DTR2G

Logic Type
Differential Receiver/Driver
Supply Voltage
3 V ~ 5.5 V
Number Of Bits
6
Operating Temperature
-40°C ~ 85°C
Mounting Type
Surface Mount
Package / Case
8-TSSOP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
MC10EP16, MC100EP16
3.3V / 5V ECL Differential
Receiver/Driver
Description
functionally equivalent to the EL16 and LVEL16 devices with higher
performance capabilities. With output transition times significantly
faster than the EL16 and LVEL16, the EP16 is ideally suited for
interfacing with high frequency sources.
this device only. For single-ended input conditions, the unused
differential input is connected to V
V
and V
to 0.5 mA. When not used, V
will force the Q output LOW.
Features
© Semiconductor Components Industries, LLC, 2008
August, 2008 − Rev. 6
BB
The EP16 is a world−class differential receiver/driver. The device is
The V
Under open input conditions (pulled to V
The 100 Series contains temperature compensation.
with V
with V
220 ps Typical Propagation Delay
Maximum Frequency > 4 GHz Typical
PECL Mode Operating Range: V
NECL Mode Operating Range: V
Open Input Default State
Safety Clamp on Inputs
Q Output Will Default LOW with Inputs Open or at V
V
Pb−Free Packages are Available
BB
may also rebias AC coupled inputs. When used, decouple V
CC
Output
BB
via a 0.01 mF capacitor and limit current sourcing or sinking
EE
EE
pin, an internally generated voltage supply, is available to
= −3.0 V to −5.5 V
= 0 V
BB
should be left open.
BB
CC
CC
as a switching reference voltage.
= 3.0 V to 5.5 V
= 0 V
EE
) internal input clamps
EE
1
BB
See detailed ordering and shipping information in the package
dimensions section on page 8 of this data sheet.
CASE 506AA
MN SUFFIX
CASE 948R
DT SUFFIX
CASE 751
D SUFFIX
H
K
5L
3B
M
TSSOP−8
*For additional marking information, refer to
8
(Note: Microdot may be in either location)
SOIC−8
Application Note AND8002/D.
DFN8
8
= MC10
= MC100
= MC10
= MC100
= Date Code
1
ORDERING INFORMATION
1
http://onsemi.com
8
1
8
1
MARKING DIAGRAMS*
ALYWG
HP16
Publication Order Number:
A
L
Y
W
G
HEP16
1
ALYW
G
G
4
= Assembly Location
= Wafer Lot
= Year
= Work Week
= Pb−Free Package
8
1
MC10EP16/D
8
1
KEP16
ALYW
ALYWG
1
KP16
G
G
4

Related parts for MC10EP16DTR2G

MC10EP16DTR2G Summary of contents

Page 1

MC10EP16, MC100EP16 3.3V / 5V ECL Differential Receiver/Driver Description The EP16 is a world−class differential receiver/driver. The device is functionally equivalent to the EL16 and LVEL16 devices with higher performance capabilities. With output transition times significantly faster than the EL16 and ...

Page 2

Figure 1. 8−Lead Pinout (Top View) and Logic Diagram Table 2. ATTRIBUTES Characteristics Internal Input Pulldown Resistor Internal Input Pullup Resistor ESD Protection Moisture Sensitivity, Indefinite Time Out of Drypack (Note ...

Page 3

Table 3. MAXIMUM RATINGS Symbol Parameter V PECL Mode Power Supply CC V NECL Mode Power Supply EE V PECL Mode Input Voltage I NECL Mode Input Voltage I Output Current out I V Sink/Source Operating Temperature ...

Page 4

Table 5. 10EP DC CHARACTERISTICS, PECL Symbol Characteristic I Power Supply Current EE V Output HIGH Voltage (Note Output LOW Voltage (Note Input HIGH Voltage (Single−Ended Input LOW Voltage (Single−Ended ...

Page 5

Table 7. 100EP DC CHARACTERISTICS, PECL Symbol Characteristic I Power Supply Current EE V Output HIGH Voltage (Note 13 Output LOW Voltage (Note 13 Input HIGH Voltage (Single−Ended Input LOW Voltage (Single−Ended ...

Page 6

Table 9. 100EP DC CHARACTERISTICS, NECL Symbol Characteristic I Power Supply Current EE V Output HIGH Voltage (Note 19 Output LOW Voltage (Note 19 Input HIGH Voltage (Single−Ended Input LOW Voltage (Single−Ended ...

Page 7

FREQUENCY (MHz) ...

Page 8

... ORDERING INFORMATION Device MC10EP16D MC10EP16DG MC10EP16DR2 MC10EP16DR2G MC10EP16DT MC10EP16DTG MC10EP16DTR2 MC10EP16DTR2G MC10EP16MNR4 MC10EP16MNR4G MC100EP16D MC100EP16DG MC100EP16DR2 MC100EP16DR2G MC100EP16DT MC100EP16DTG MC100EP16DTR2 MC100EP16DTR2G MC100EP16MNR4 MC100EP16MNR4G †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D ...

Page 9

... G C SEATING PLANE −Z− 0.25 (0.010 *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. PACKAGE DIMENSIONS SOIC−8 NB CASE 751−07 ISSUE 0.10 (0.004 SOLDERING FOOTPRINT* 1 ...

Page 10

K 8x REF 0.10 (0.004) 0.15 (0.006 L −U− PIN 1 IDENT 0.15 (0.006 −V− C 0.10 (0.004) D −T− G SEATING PLANE PACKAGE DIMENSIONS TSSOP−8 ...

Page 11

... Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada Fax: 303− ...

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