MC100EP16FDG ON Semiconductor, MC100EP16FDG Datasheet

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MC100EP16FDG

Manufacturer Part Number
MC100EP16FDG
Description
IC RCVR/DRVR ECL DIFF 5V 8SOIC
Manufacturer
ON Semiconductor
Series
100EPr
Datasheet
1.MC100EP16FDTR2G.pdf (10 pages)

Specifications of MC100EP16FDG

Logic Type
Differential Receiver/Driver
Supply Voltage
3 V ~ 5.5 V
Operating Temperature
-40°C ~ 85°C
Mounting Type
Surface Mount
Package / Case
8-SOIC (3.9mm Width)
Logic Family
100EP
Maximum Operating Temperature
+ 85 C
Function
Line Transmitter / Receiver
Minimum Operating Temperature
- 40 C
Mounting Style
SMD/SMT
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Number Of Bits
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
MC100EP16FDGOS
MC100EP16F
3.3V / 5V ECL Differential
Receiver/Driver With
Reduced Output Swing
Description
functionally equivalent to the EP16 device with higher performance
capabilities. With reduced output swings, rise/fall transition times are
significantly faster than on the EP16. The EP16F is ideally suited for
interfacing with high frequency sources.
this device only. For single−ended input conditions, the unused
differential input is connected to V
V
and V
to 0.5 mA. When not used, V
Features
•
•
•
•
•
•
•
•
© Semiconductor Components Industries, LLC, 2008
August, 2008 − Rev. 5
BB
The MC100EP16F is a differential receiver/driver. The device is
The V
with V
with V
100 ps Typical Rise and Fall Time
Max Frequency >4 GHz Typical
The 100 Series Contains Temperature Compensation
PECL Mode Operating Range: V
NECL Mode Operating Range: V
Open Input Default State
Safety Clamp on Inputs
Pb−Free Packages are Available
may also rebias AC coupled inputs. When used, decouple V
CC
BB
via a 0.01 mF capacitor and limit current sourcing or sinking
EE
EE
pin, an internally generated voltage supply, is available to
= 0 V
= −3.0 V to −5.5 V
BB
should be left open.
BB
CC
CC
as a switching reference voltage.
= 3.0 V to 5.5 V
= 0V
1
BB
See detailed ordering and shipping information in the package
dimensions section on page 7 of this data sheet.
CASE 506AA
MN SUFFIX
CASE 948R
DT SUFFIX
CASE 751
D SUFFIX
TSSOP−8
*For additional marking information, refer to
8
(Note: Microdot may be in either location)
SOIC−8
Application Note AND8002/D.
DFN8
8
1
ORDERING INFORMATION
1
A
L
Y
W
M
G
http://onsemi.com
= Assembly Location
= Wafer Lot
= Year
= Work Week
= Date Code
= Pb−Free Package
MARKING DIAGRAMS*
Publication Order Number:
8
1
8
1
ALYWG
KEP60
1
ALYW
KP60
MC100EP16F/D
G
G
4

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MC100EP16FDG Summary of contents

Page 1

MC100EP16F 3.3V / 5V ECL Differential Receiver/Driver With Reduced Output Swing Description The MC100EP16F is a differential receiver/driver. The device is functionally equivalent to the EP16 device with higher performance capabilities. With reduced output swings, rise/fall transition times are significantly faster ...

Page 2

Figure 1. 8−Lead Pinout (Top View) and Logic Diagram Table 2. ATTRIBUTES Characteristics Internal Input Pulldown Resistor Internal Input Pullup Resistor ESD Protection Moisture Sensitivity, Indefinite Time Out of Drypack (Note ...

Page 3

Table 3. MAXIMUM RATINGS Symbol Parameter V PECL Mode Power Supply CC V NECL Mode Power Supply EE V PECL Mode Input Voltage I NECL Mode Input Voltage I Output Current out I V Sink/Source Operating Temperature ...

Page 4

Table 4. DC CHARACTERISTICS, PECL Symbol Characteristic I Power Supply Current EE V Output HIGH Voltage (Note Output LOW Voltage (Note Input HIGH Voltage (Single−Ended Input LOW Voltage (Single−Ended) IL (Note 5) ...

Page 5

Table 6. DC CHARACTERISTICS, NECL Symbol Characteristic I Power Supply Current EE V Output HIGH Voltage (Note 12 Output LOW Voltage (Note 12 Input HIGH Voltage (Single−Ended Input LOW Voltage (Single−Ended) IL (Note 13) ...

Page 6

FREQUENCY (MHz) ...

Page 7

... ORDERING INFORMATION Device MC100EP16FD MC100EP16FDG MC100EP16FDR2 MC100EP16FDR2G MC100EP16FDT MC100EP16FDTG MC100EP16FDTR2 MC100EP16FDTR2G MC100EP16FMNR4 MC100EP16FMNR4G †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. Resource Reference of Application Notes AN1405/D AN1406/D ...

Page 8

... G C SEATING PLANE −Z− 0.25 (0.010 *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. PACKAGE DIMENSIONS SOIC−8 NB CASE 751−07 ISSUE 0.10 (0.004 SOLDERING FOOTPRINT* 1 ...

Page 9

K 8x REF 0.10 (0.004) 0.15 (0.006 L −U− PIN 1 IDENT 0.15 (0.006 −V− C 0.10 (0.004) D −T− G SEATING PLANE PACKAGE DIMENSIONS TSSOP−8 ...

Page 10

... Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada Fax: 303− ...

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