MC100EP16VBDG ON Semiconductor, MC100EP16VBDG Datasheet
MC100EP16VBDG
Specifications of MC100EP16VBDG
Related parts for MC100EP16VBDG
MC100EP16VBDG Summary of contents
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MC100EP16VB 3.3V / 5V ECL Differential Receiver/Driver with High and Low Gain Description The EP16VB is a world−class differential receiver/driver. The device is functionally equivalent to the EP16 and LVEP16 devices but with both high and low gain outputs. Q gain ...
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Figure 1. 8−Lead Pinout (Top View) and Logic Diagram Table 2. ATTRIBUTES Characteristics Internal Input Pulldown Resistor Internal Input Pullup Resistor ESD Protection Moisture Sensitivity, Indefinite Time Out of Drypack (Note ...
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Table 3. MAXIMUM RATINGS Symbol Parameter V PECL Mode Power Supply CC V NECL Mode Power Supply EE V PECL Mode Input Voltage I NECL Mode Input Voltage I Output Current out I V Sink/Source Operating Temperature ...
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Table 5. 100EP DC CHARACTERISTICS, PECL Symbol Characteristic I Power Supply Current EE V Output HIGH Voltage (Note Output LOW Voltage (Note Input HIGH Voltage (Single−Ended Input LOW Voltage (Single−Ended ...
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Table 7. AC CHARACTERISTICS V Symbol Characteristic f Maximum Frequency (Figure 2) max t , Propagation Delay (Differential) Q PLH t (Differential) QHG, QHG PHL (Single−Ended) Q (Single−Ended) QHG, QHG t Duty Cycle Skew (Note 13) SKEW t Cycle−to−Cycle Jitter ...
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900 800 700 600 500 400 300 200 100 É É É É É É É É É É É É É É É É É É É É É É É É É É 500 1000 1500 ...
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... ORDERING INFORMATION Device MC100EP16VBD MC100EP16VBDG MC100EP16VBDR2 MC100EP16VBDR2G MC100EP16VBDT MC100EP16VBDTG MC100EP16VBDTR2 MC100EP16VBDTR2G MC100EP16VBMNR4 MC100EP16VBMNR4G †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. Resource Reference of Application Notes AN1405/D AN1406/D ...
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... G C SEATING PLANE −Z− 0.25 (0.010 *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. PACKAGE DIMENSIONS SOIC−8 NB CASE 751−07 ISSUE 0.10 (0.004 SOLDERING FOOTPRINT* 1 ...
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K 8x REF 0.10 (0.004) 0.15 (0.006 L −U− PIN 1 IDENT 0.15 (0.006 −V− C 0.10 (0.004) D −T− G SEATING PLANE PACKAGE DIMENSIONS TSSOP−8 ...
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... Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada Fax: 303− ...