SIM3U156-B-GQ Silicon Labs, SIM3U156-B-GQ Datasheet

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SIM3U156-B-GQ

Manufacturer Part Number
SIM3U156-B-GQ
Description
ARM Microcontrollers - MCU ARM Cortex-M3 USB 128KB TQFP64
Manufacturer
Silicon Labs
Datasheet

Specifications of SIM3U156-B-GQ

Rohs
yes
Core
ARM Cortex M3
Processor Series
SIM3U1xx
Data Bus Width
32 bit
Maximum Clock Frequency
80 MHz
Program Memory Size
128 KB
Data Ram Size
32 KB
On-chip Adc
Yes
Operating Supply Voltage
1.8 V to 3.6 V
Operating Temperature Range
- 40 C to + 85 C
Package / Case
TQFP-64
Mounting Style
SMD/SMT
Interface Type
2 x I2C, I2S, 3 x SPI, 2 x USART, 2 x UART
Number Of Programmable I/os
65
Number Of Timers
2 x 32 bit
Supply Voltage - Max
3.6 V

Available stocks

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Price
Part Number:
SIM3U156-B-GQ
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SIM3U156-B-GQ
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Silicon Laboratories Inc
Quantity:
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Part Number:
SIM3U156-B-GQR
Manufacturer:
Silicon Laboratories Inc
Quantity:
10 000
32-bit ARM® Cortex™-M3 CPU
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Memory
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Power Management
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Low Power Features
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Clock Sources
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Temperature Range: –40 to +85 °C
Package Options
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Rev. 1.0 11/12
80 MHz maximum frequency
Single-cycle multiplication, hardware division support
Nested vectored interrupt control (NVIC) with 16 priority levels
32–256 kB Flash, in-system programmable
8–32 kB SRAM (including 4 kB retention SRAM)
16-channel DMA controller
External bus interface supports up to 16 MB of external mem-
ory and a parallel LCD interface with QVGA resolution
Low drop-out (LDO) regulator
Power-on reset circuit and brownout detectors
5-to-3.3 V 150 mA regulator supports direct USB power
Adjustable external regulator supports up to 3.6 V, 1000 mA
Multiple power modes supported for low power optimization
85 nA current mode with voltage supply monitor enabled
Low-current RTC: 350 nA internal LFO, 620 nA external crystal
12 µs wakeup (lowest power mode); 1.5 µs analog setting time
275 µA/MHz active current
Clocks can be gated off from unused peripherals to save power
Flexible clock divider: Reduce operational frequency up to 128x
Internal oscillator with PLL: 23-80 MHz, reduced EMI mode
USB internal 48 MHz oscillator supports crystal-less operation
Low power internal oscillator: 20 MHz and 2.5 MHz modes
Low frequency internal oscillator: 16.4 kHz
External oscillators: Crystal, RC, C, CMOS and RTC Crystal
QFN options: 40-pin (6 x 6 mm), 64-pin (9 x 9 mm)
TQFP options: 64-pin (10 x 10 mm), 80-pin (12 x 12 mm)
LGA option: 92-pin (7 x 7 mm)
(Internal Logic and Memory Power)
Real-Time Clock w/ Dedicated Crystal
16 kHz Low Frequency Oscillator
20 MHz Low Power Oscillator
(Direct Power From USB)
Power Management Unit
5 V In, 3.3 V Out LDO
External 1A Regulator
External Oscillator Drive
Clocking / Oscillators
48 MHz USB Oscillator
1.8 V Internal LDO
Supply Monitor
80 MHz PLL
Power
Copyright © 2012 by Silicon Laboratories
8/16/32 kB SRAM w/ 4kB Retention
16-Channel DMA Controller
ARM Cortex M3 (80 MHz)
Core / Memory / Support
Serial Wire / JTAG / ETM
32/64/128/256 kB Flash
Full-Speed
I2S TX/RX
MAC/PHY
Watchdog
USB 2.0
High-Performance, Low-Power, 32-Bit Precision32™
Analog Peripherals
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Digital and Communication Peripherals
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Timers/Counters
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Up to 65 Flexible I/O
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On-Chip Debugging
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Supply Voltage
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2 x I2C
Low-Power Timer
2 x UART, 2 x USART w/ IrDA/SmartCard
2 x 12-Bit Analog-to-Digital Converters: Up to 250 ksps 12-bit
mode or 1 Msps 10-bit mode, internal or external reference
2 x 10-Bit Current-mode Digital-to-Analog Converters, four-
word buffer enables 12-bit operation
2 x Low-current comparators
16-Channel Capacitance-to-Digital: Fast, <1 µA wake-on-touch
2 x Current-to-Voltage Converter, up to 6 mA input range
USB 2.0-compliant full speed with 10 endpoints, 2 kB buffer,
oscillator with automatic frequency correction, and transceiver;
no external components needed
2 x USARTs and 2 x UARTs with IrDA and ISO7816 SmartCard
3 x SPIs, 2 x I2C, I
128/192/256-bit Hardware AES Encryption
2 x 32-bit or 4 x 16-bit timers with capture/compare
2 x 16-bit, 2-channel counters with capture/compare/PWM
16-bit, 6-channel counter with capture/compare/PWM and
dead-time controller with differential outputs
16-bit low power timer/pulse counter operational in sleep
32-bit real time clock (RTC) with multiple alarms
Watchdog timer
Up to 59 contiguous GPIO with two priority crossbars providing
flexibility in pin assignments; 12 x 5 V tolerant GPIO
Up to 6 programmable high drive capable (5–300 mA, 1.8–6 V)
I/O can drive LEDs, power MOSFETs, buzzers, etc.
Serial wire debug (SWD) or JTAG (no boundary scan), serial
wire viewer (SWV)
Cortex-M3 embedded trace macrocell (ETM)
2.7 to 5.5 V (regulator enabled)
1.8 to 3.6 V (regulator disabled)
Digital Peripherals
2 x 2-Channel Standard PWM
USB MCU Family with up to 256 kB of Flash
2 x 32-bit Timers (4 x 16-bit)
6-Channel Enhanced PWM
3 x SPI
2 x Current-to-Voltage Converter
(12-bit 250 ksps / 10-bit 1 Msps)
16-Channel Capacitive Sense
2 x Low Current Comparators
2 x Current-Source DAC
Analog Peripherals
Voltage Reference
2 x SAR ADC
External Parallel I/F
2
AES
S (receive and transmit), 16/32-bit CRC
CRC
SiM3U1xx
SiM3U1xx

Related parts for SIM3U156-B-GQ

SIM3U156-B-GQ Summary of contents

Page 1

ARM® Cortex™-M3 CPU - 80 MHz maximum frequency - Single-cycle multiplication, hardware division support - Nested vectored interrupt control (NVIC) with 16 priority levels Memory - 32–256 kB Flash, in-system programmable - 8–32 kB SRAM (including 4 kB retention ...

Page 2

SiM3U1xx Ta ble of Contents 1. Related Documents and Conventions ...............................................................................4 1.1. Related Documents........................................................................................................4 1.1.1. SiM3U1xx/SiM3C1xx Reference Manual...............................................................4 1.1.2. Hardware Access Layer (HAL) API Description ....................................................4 1.1.3. ARM Cortex-M3 Reference Manual.......................................................................4 1.2. Conventions ...................................................................................................................4 2. Typical Connection Diagrams ............................................................................................5 2.1. ...

Page 3

SPI (SPI0, SPI1) .................................................................................................. 46 4.6.6. I2C (I2C0, I2C1)................................................................................................... 46 4.6.7. I2S (I2S0)............................................................................................................. 47 4.7. Analog .......................................................................................................................... 48 4.7.1. 12-Bit Analog-to-Digital Converters (SARADC0, SARADC1).............................. 48 4.7.2. Sample Sync Generator (SSG0) ......................................................................... 48 4.7.3. 10-Bit Digital-to-Analog Converter (IDAC0, IDAC1) ............................................ ...

Page 4

SiM3U1xx 1. Related Documents and Conventions 1.1. Related Documents This data sheet accompanies several documents to provide the complete description of the SiM3U1xx device family. 1.1.1. SiM3U1xx/SiM3C1xx Reference Manual The Silicon Laboratories SiM3U1xx/SiM3C1xx Reference Manual provides detailed functional descriptions for ...

Page 5

Typical Connection Diagrams This section provides typical connection diagrams for SiM3U1xx devices. 2.1. Power Figure 2.1 shows a typical connection diagram for the power pins of the SiM3U1xx devices when the internal regulator is in use and USB is ...

Page 6

SiM3U1xx USB 5 V (in and 0.1 uF bypass capacitors required for each power pin placed as close to the pins as possible. Figure 2.3. Connection Diagram with Voltage Regulator Used and USB Connected (Bus-Powered) Figure 2.4 shows ...

Page 7

USB 5 V (in and 0.1 uF bypass capacitors required for each power pin placed as close to the pins as possible. Figure 2.5. Connection Diagram with Voltage Regulator Used, USB Connected (Bus-Powered), VBUS 3.3-6 V (in) VREGIN ...

Page 8

SiM3U1xx 3. Electrical Specifications 3.1. Electrical Characteristics All electrical parameters in all tables are specified under the conditions listed in Table 3.1, unless stated otherwise. Table 3.1. Recommended Operating Conditions Parameter Operating Supply Voltage on VDD Operating Supply Voltage on ...

Page 9

Table 3.2. Power Consumption Parameter Digital Core Supply Current 2,3,4,5 Normal Mode —Full speed with code executing from Flash, peripheral clocks ON 2,3,4,5 Normal Mode —Full speed with code executing from Flash, peripheral clocks OFF 2,3,4,6 Power Mode 1 —Full ...

Page 10

SiM3U1xx Table 3.2. Power Consumption (Continued) Parameter 2,3 Power Mode 3 2,3 Power Mode 9 —Low Power Shutdown with VREG0 disabled, powered through VDD and VIO 2,3 Power Mode 9 —Low Power Shutdown with VREG0 in low- power mode, VDD ...

Page 11

Table 3.2. Power Consumption (Continued) Parameter Analog Peripheral Supply Currents Voltage Regulator (VREG0) Voltage Regulator (VREG0) Sense I External Regulator (EXTVREG0) PLL0 Oscillator (PLL0OSC) USB0 Oscillator (USB0OSC) USB0 Transceiver (USB0) Low-Power Oscillator (LPOSC0) Low-Frequency Oscillator (LFOSC0) Notes: 1. Perhipheral currents ...

Page 12

SiM3U1xx Table 3.2. Power Consumption (Continued) Parameter 8 External Oscillator (EXTOSC0) SARADC0, SARADC1 Temperature Sensor Internal SAR Reference VREF0 Comparator 0 (CMP0), Comparator 1 (CMP1) Capacitive Sensing (CAPSENSE0) 7 IDAC0 , 7 IDAC1 7 IVC0 Voltage Supply Monitor (VMON0) Notes: ...

Page 13

Table 3.2. Power Consumption (Continued) Parameter Flash Current on VDD Write Operation Erase Operation Notes: 1. Perhipheral currents drop to zero when peripheral clock and peripheral are disabled, unless otherwise noted. 2. Currents are additive. For example, where functions increases ...

Page 14

SiM3U1xx Table 3.4. Reset and Supply Monitor Parameter V High Supply Monitor Threshold DD (VDDHITHEN = 1) V Low Supply Monitor Threshold DD (VDDHITHEN = 0) V Supply Monitor Threshold REGIN Power-On Reset (POR) Threshold V Ramp Time DD Reset ...

Page 15

Table 3.5. On-Chip Regulators Parameter 3.3 V Regulator Characteristics (VREG0, Supplied from VREGIN Pin) Output Voltage (at VDD pin) Output Current (at VDD pin)* Output Load Regulation Output Capacitance *Note: Total current VREG0 is capable of providing. Any current consumed ...

Page 16

SiM3U1xx Table 3.6. External Regulator Parameter Symbol Input Voltage Range (at VRE- V GIN) Output Voltage (at V EXREGOUT EXREGOUT) NPN Current Drive PNP Current Drive EXREGBD Voltage (PNP V EXREGBD Mode) Standalone Mode Output I EXTREGBD Current External Capacitance ...

Page 17

Table 3.7. Flash Memory Parameter 1 Write Time 1 Erase Time V Voltage During Programming DD Endurance (Write/Erase Cycles) 2 Retention Notes: 1. Does not include sequencing time before and after the write/erase operation, which may take ...

Page 18

SiM3U1xx Table 3.8. Internal Oscillators (Continued) Parameter Lock Time Low Power Oscillator (LPOSC0) Oscillator Frequency Divided Oscillator Frequency Power Supply Sensitivity Temperature Sensitivity Low Frequency Oscillator (LFOSC0) Oscillator Frequency Power Supply Sensitivity Temperature Sensitivity RTC0 Oscillator (RTC0OSC) Missing Clock Detector ...

Page 19

Table 3.9. External Oscillator Parameter External Input CMOS Clock Frequency* External Input CMOS Clock High Time External Input CMOS Clock Low Time External Crystal Clock Frequency *Note: Minimum of 10 kHz during debug operations. Symbol Test Condition f CMOS t ...

Page 20

SiM3U1xx Table 3.10. SAR ADC Parameter Resolution Supply Voltage Requirements (VDD) Throughput Rate (High Speed Mode) Throughput Rate (Low Power Mode) Tracking Time SAR Clock Frequency Conversion Time Sample/Hold Capacitor Input Pin Capacitance Input Mux Impedance Voltage Reference Range 1 ...

Page 21

Table 3.10. SAR ADC (Continued) Parameter Differential Nonlinearity  (Guaranteed Monotonic) Offset Error (using VREFGND) Offset Temperatue Coefficient 3 Slope Error Dynamic Performance with 10 kHz Sine Wave Input 1dB below full scale, Max throughput Signal-to-Noise Signal-to-Noise Plus Distortion Total ...

Page 22

SiM3U1xx Table 3.11. IDAC Parameter Static Performance Resolution Integral Nonlinearity Differential Nonlinearity (Guaranteed Monotonic) Output Compliance Range Full Scale Output Current Offset Error Full Scale Error Tempco VDD Power Supply Rejection Ratio Test Load Impedance ( Dynamic ...

Page 23

Table 3.12. Capacitive Sense Parameter Single Conversion Time (Default Configuration) Maximum External Capacitive Load Maximum External Series Imped- ance Table 3.13. Current-to-Voltage Converter (IVC) Parameter Supply Voltage (VDD) Input Pin Voltage Minimum Input Current (source) Integral Nonlinearity Full Scale Output ...

Page 24

SiM3U1xx Table 3.14. Voltage Reference Electrical Characteristics V – = 1 +85 °C unless otherwise specified. DD Parameter Internal Fast Settling Reference Output Voltage Temperature Coefficient Turn-on Time Power Supply Rejection PSRR On-Chip Precision Reference ...

Page 25

Table 3.15. Temperature Sensor Parameter Offset Offset Error* Slope Slope Error* Linearity Turn-on Time *Note: Represents one standard deviation from the mean. Symbol Test Condition °C OFF °C OFF A M ...

Page 26

SiM3U1xx Table 3.16. Comparator Parameter Response Time, CMPMD = 00 (Highest Speed) Response Time, CMPMD = 11 (Lowest Power) Positive Hysteresis Mode 0 (CPMD = 00) Negative Hysteresis Mode 0 (CPMD = 00) Positive Hysteresis Mode 1 (CPMD = 01) ...

Page 27

Table 3.16. Comparator (Continued) Parameter Positive Hysteresis Mode 3 (CPMD = 11) Negative Hysteresis Mode 3 (CPMD = 11) Input Range (CP+ or CP–) Input Pin Capacitance Common-Mode Rejection Ratio Power Supply Rejection Ratio Input Offset Voltage Input Offset Tempco ...

Page 28

SiM3U1xx Table 3.17. USB Transceiver Parameter Valid Supply Range (for USB Compliance) VBUS Pull-Down Leakage Current Transmitter Output High Voltage Output Low Voltage Output Crossover Point Output Impedance Pull-up Resistance Output Rise Time Output Fall Time Receiver Differential Input Sensitivity ...

Page 29

Table 3.18. Port I/O Parameter Standard I/O (PB0, PB1, and PB2 Tolerant I/O (PB3), VBUS and RESET 1, 2 Output High Voltage 1, 2 Output Low Voltage Input High Voltage Input Low Voltage Pin Capacitance Weak Pull-Up Current ...

Page 30

SiM3U1xx Table 3.18. Port I/O (Continued) Parameter Output Fall Time Input High Voltage Input Low Voltage N-Channel Sink Current Limit (2.7 V < V < IOHD See Figure 3.1 Total N-Channel Sink Current ...

Page 31

Table 3.18. Port I/O (Continued) Parameter P-Channel Source Current Limit (2.7 V < VIOHD < VIOHD– 0 See Figure 3.2 Total P-Channel Source Current on P4.0-P4.5 (dc) Pin Capacitance Weak Pull-Up Current in Low ...

Page 32

SiM3U1xx 350 300 250 200 150 Safe Operating Region 100 Figure 3.1. Maximum Sink Current vs. PB4.x Pin Voltage 250 200 150 100 Figure 3.2. Maximum Source Current vs. PB4.x Pin Voltage 32 ...

Page 33

Thermal Conditions Table 3.19. Thermal Conditions Parameter Thermal Resistance* *Note: Thermal resistance assumes a multi-layer PCB with any exposed pad soldered to a PCB pad. 3.3. Absolute Maximum Ratings Stresses above those listed under Table 3.20 may cause permanent ...

Page 34

SiM3U1xx Table 3.20. Absolute Maximum Ratings Parameter Voltage on I/O pins, Port Bank 3 I/O Total Current Sunk into Supply Pins Total Current Sourced out of Ground Pins Current Sourced or Sunk by Any I/O Pin Current Injected on Any ...

Page 35

Precision32™ SiM3U1xx System Overview The SiM3U1xx Precision32™ devices are fully integrated, mixed-signal system-on-a-chip MCUs. Highlighted features are listed below. Refer to Table 5.1 for specific product feature selection and part ordering numbers.  Core: 32-bit ARM Cortex-M3 CPU.  ...

Page 36

SiM3U1xx With on-chip power-on reset, voltage supply monitor, watchdog timer, and clock oscillator, the SiM3U1xx devices are truly standalone system-on-a-chip solutions. The Flash memory is reprogrammable in-circuit, providing non- volatile data storage and allowing field upgrades of the firmware. User ...

Page 37

Power 4.1.1. LDO and Voltage Regulator (VREG0) The SiM3U1xx devices include two internal regulators: the core LDO Regulator and the Voltage Regulator (VREG0). The LDO Regulator converts a 1.8–3.6 V supply to the core operating voltage of 1.8 V. ...

Page 38

SiM3U1xx 4.1.5. Device Power Modes The SiM3U1xx devices feature four low power modes in addition to normal operating mode. Several peripherals provide wake up sources for these low power modes, including the Low-Power Timer (LPT0), RTC0 (alarms and oscillator failure ...

Page 39

I/O 4.2.1. General Features The SiM3U1xx ports have the following features:  Push-pull or open-drain output modes and analog or digital modes.  Option for high or low output drive strength.  Port Match allows the device to recognize ...

Page 40

SiM3U1xx 4.3. Clocking The SiM3U1xx devices have two system clocks: AHB and APB. The AHB clock services memory peripherals and is derived from one of seven sources: the RTC0 timer clock (RTC0TCLK), the Low Frequency Oscillator, the Low Power Oscillator, ...

Page 41

PLL (PLL0) The PLL module consists of a dedicated Digitally-Controlled Oscillator (DCO) that can be used in Free-Running mode without a reference frequency, Frequency-Locked to a reference frequency, or Phase-Locked to a reference frequency. The reference frequency for Frequency-Lock ...

Page 42

SiM3U1xx 4.4. Data Peripherals 4.4.1. 16-Channel DMA Controller The DMA facilitates autonomous peripheral operation, allowing the core to finish tasks more quickly without spending time polling or waiting for peripherals to interrupt. This helps reduce the overall power consumption of ...

Page 43

Counters/Timers and PWM 4.5.1. Programmable Counter Array (EPCA0, PCA0, PCA1) The SiM3U1xx devices include two types of PCA module: Enhanced and Standard. The Enhanced Programmable Counter Array (EPCA0) and Standard Programmable Counter Array (PCA0, PCA1) modules are timer/counter systems ...

Page 44

SiM3U1xx 4.5.3. Real-Time Clock (RTC0) The RTC0 module includes a 32-bit timer that allows hours of independent time-keeping when used with a 32.768 kHz watch crystal. The RTC0 provides three alarm events in addition to a missing ...

Page 45

Communications Peripherals 4.6.1. External Memory Interface (EMIF0) The External Memory Interface (EMIF0) allows external parallel asynchronous devices, like SRAMs and LCD controllers, to appear as part of the system memory map. The EMIF0 module includes the following features:  ...

Page 46

SiM3U1xx  IrDA modulation and demodulation with programmable pulse widths.  Smartcard ACK/NACK support.  Parity error, frame error, overrun, and underrun detection.  Multi-master and half-duplex support.  Multiple loop-back modes supported.  Multi-processor communications support. 4.6.4. UART (UART0, ...

Page 47

SDA (serial data), SCL (serial clock) generation and synchronization, arbitration logic, and start/ stop control and generation. The I2C module includes the following features:  Standard (up to 100 kbps) and Fast (400 kbps) transfer speeds.  ...

Page 48

SiM3U1xx 4.7. Analog 4.7.1. 12-Bit Analog-to-Digital Converters (SARADC0, SARADC1) The SARADC0 and SARADC1 modules on SiM3U1xx devices are Successive Approximation Register (SAR) Analog to Digital Converters (ADCs). The key features of the SARADC module are:  Single-ended 12-bit and 10-bit ...

Page 49

Capacitance-to-Digital Converter (CAPSENSE0) The Capacitance Sensing module measures capacitance on external pins and converts digital value. The CAPSENSE module has the following features:  Multiple start-of-conversion sources (CSnTx).  Option to convert to 12, 13, ...

Page 50

SiM3U1xx 4.8. Reset Sources Reset circuitry allows the controller to be easily placed in a predefined default condition. On entry to this reset state, the following occur:  The core halts program execution.  Module registers are initialized to their ...

Page 51

Security The peripherals on the SiM3U1xx devices have a register lock and key mechanism that prevents any undesired accesses of the peripherals from firmware. Each bit in the PERIPHLOCKx registers controls a set of peripherals. A key sequence must ...

Page 52

... SiM3U1xx 5. Ordering Information – B Family – U (USB), C (Core) Core – M3 (Cortex M3) Silicon Labs Figure 5.1. SiM3U1xx Part Numbering All devices in the SiM3U1xx family have the following features:  Core: ARM Cortex-M3 with maximum operating frequency of 80 MHz.  ...

Page 53

... SiM3U166-B-GM 256 32 16  SiM3U166-B-GQ 256 32 16 SiM3U164-B-GM 256 32  SiM3U157-B-GM 128 32 24  SiM3U157-B-GQ 128 32 24  SiM3U156-B-GM 128 32 16  SiM3U156-B-GQ 128 32 16 SiM3U154-B-GM 128 32  SiM3U146-B-  SiM3U146-B- SiM3U144-B-  SiM3U136-B-  SiM3U136-B-GQ 32 ...

Page 54

SiM3U1xx 6. Pin Definitions and Packaging Information 6.1. SiM3U1x7 Pin Definitions PB4.5 1 PB4.4 2 PB4.3 3 VSSHD 4 VIOHD 5 PB4.2 6 PB4.1 7 PB4.0 8 PB3.11 9 PB3.10 10 PB3.9 11 PB3.8 12 PB3.7 13 PB3.6 14 PB3.5 ...

Page 55

D1 A48 A47 A46 A45 PB4 B36 B35 B34 PB4.4 A2 PB4 VIOHD B2 VSSHD A4 PB4.2 B3 PB3.11 A5 PB4.1 B4 PB3.10 A6 PB4.0 B5 PB3.9 A7 PB3.8 B6 PB3.7 A8 PB3.6 B7 PB3.5 A9 ...

Page 56

SiM3U1xx Table 6.1. Pin Definitions and Alternate Functions for SiM3U1x7 Pin Name Type VSS Ground VDD Power (Core) VIO Power (I/O) VREGIN Power (Regulator) VSSHD Ground (High Drive) VIOHD Power (High Drive) RESET Active-low Reset D– USB Data- D+ USB ...

Page 57

Table 6.1. Pin Definitions and Alternate Functions for SiM3U1x7 (Continued) Pin Name Type PB0.7 Standard I/O PB0.8 Standard I/O PB0.9 Standard I/O PB0.10 Standard I/O PB0.11 Standard I/O PB0.12 Standard I/O PB0.13 Standard I/O PB0.14 Standard I/O PB0.15 Standard I/O ...

Page 58

SiM3U1xx Table 6.1. Pin Definitions and Alternate Functions for SiM3U1x7 (Continued) Pin Name Type PB1.8/ETM3 Standard I/O /ETM PB1.9/ Standard I/O /ETM TRACECLK PB1.10 Standard I/O PB1.11 Standard I/O PB1.12 Standard I/O PB1.13 Standard I/O PB1.14 Standard I/O PB1.15 Standard ...

Page 59

Table 6.1. Pin Definitions and Alternate Functions for SiM3U1x7 (Continued) Pin Name Type PB2.5 Standard I/O PB2.6 Standard I/O PB2.7 Standard I/O PB2.8 Standard I/O PB2.9 Standard I/O PB2.10 Standard I/O PB2.11 Standard I/O PB2.12 Standard I/O PB2.13 Standard I/O ...

Page 60

SiM3U1xx Table 6.1. Pin Definitions and Alternate Functions for SiM3U1x7 (Continued) Pin Name Type PB3 Tolerant I/O PB3 Tolerant I/O PB3 Tolerant I/O PB3 Tolerant I/O PB3 Tolerant I/O PB3.9 ...

Page 61

Table 6.1. Pin Definitions and Alternate Functions for SiM3U1x7 (Continued) Pin Name Type PB4.0 High Drive I/O PB4.1 High Drive I/O PB4.2 High Drive I/O PB4.3 High Drive I/O PB4.4 High Drive I/O PB4.5 High Drive I/O Note: All unnamed ...

Page 62

SiM3U1xx 6.2. SiM3U1x6 Pin Definitions PB4.3 1 VSSHD 2 VIOHD 3 PB4.2 4 PB4.1 5 PB4.0 6 PB3.9 7 PB3.8 8 PB3.7 9 PB3.6 10 PB3.5 11 PB3.4 12 PB3.3 13 PB3.2 14 PB3.1 15 PB3 Pin ...

Page 63

PB4.3 1 VSSHD 2 VIOHD 3 PB4.2 4 PB4.1 5 PB4.0 6 PB3.9 7 PB3.8 8 PB3.7 9 PB3.6 10 PB3.5 11 PB3.4 12 PB3.3 13 PB3.2 14 PB3.1 15 PB3 pin QFN (TopView) VSS Figure 6.4. SiM3U1x6-GM ...

Page 64

SiM3U1xx Table 6.2. Pin Definitions and Alternate Functions for SiM3U1x6 Pin Name Type VSS Ground VDD Power (Core) VIO Power (I/O) VREGIN Power (Regulator) VSSHD Ground (High Drive) VIOHD Power (High Drive) RESET Active-low Reset D- USB Data- D+ USB ...

Page 65

Table 6.2. Pin Definitions and Alternate Functions for SiM3U1x6 (Continued) Pin Name Type PB0.6 Standard I/O PB0.7 Standard I/O PB0.8 Standard I/O PB0.9 Standard I/O PB0.10 Standard I/O PB0.11 Standard I/O PB0.12 Standard I/O PB0.13 Standard I/O PB0.14/TDO/ Standard I/O ...

Page 66

SiM3U1xx Table 6.2. Pin Definitions and Alternate Functions for SiM3U1x6 (Continued) Pin Name Type PB1.7 Standard I/O PB1.8 Standard I/O PB1.9 Standard I/O PB1.10 Standard I/O PB1.11 Standard I/O PB1.12 Standard I/O PB1.13 Standard I/O PB1.14 Standard I/O PB1.15 Standard ...

Page 67

Table 6.2. Pin Definitions and Alternate Functions for SiM3U1x6 (Continued) Pin Name Type PB3 Tolerant I/O PB3 Tolerant I/O PB3 Tolerant I/O PB3 Tolerant I/O PB3 Tolerant I/O PB3.6 5 ...

Page 68

SiM3U1xx Table 6.2. Pin Definitions and Alternate Functions for SiM3U1x6 (Continued) Pin Name Type PB3 Tolerant I/O PB4.0 High Drive I/O PB4.1 High Drive I/O PB4.2 High Drive I/O PB4.3 High Drive I/O 68  7 XBR1 BE0 ...

Page 69

SiM3U1x4 Pin Definitions PB4.3 1 VSSHD 2 VIOHD 3 PB4.2 4 PB4.1 5 PB4.0 6 PB3.3 7 PB3.2 8 PB3.1 9 PB3 pin QFN (Top View) VSS Figure 6.5. SiM3U1x4-GM Pinout Rev. 1.0 SiM3U1xx 30 PB0.4 29 ...

Page 70

SiM3U1xx Table 6.3. Pin Definitions and Alternate Functions for SiM3U1x4 Pin Name Type VSS Ground VDD Power (Core) VIO Power (I/O) VREGIN Power (Regulator) VSSHD Ground (High Drive) VIOHD Power (High Drive) RESET Active-low Reset D- USB Data– D+ USB ...

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Table 6.3. Pin Definitions and Alternate Functions for SiM3U1x4 (Continued) Pin Name Type PB0.6 Standard I/O PB0.7 Standard I/O PB0.8 Standard I/O PB0.9 Standard I/O PB0.10 Standard I/O PB0.11 Standard I/O PB0.12 Standard I/O PB0.13 Standard I/O PB0.14 Standard I/O ...

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SiM3U1xx Table 6.3. Pin Definitions and Alternate Functions for SiM3U1x4 (Continued) Pin Name Type PB3 Tolerant I/O PB3 Tolerant I/O PB3 Tolerant I/O PB3 Tolerant I/O PB4.0 High Drive I/O PB4.1 High ...

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LGA-92 Package Specifications Figure 6.6. LGA-92 Package Drawing Table 6.4. LGA-92 Package Dimensions Dimension aaa bbb ccc ddd eee Notes: 1. All dimensions shown are in millimeters (mm) unless ...

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SiM3U1xx   Figure 6.7. LGA-92 Landing Diagram Table 6.5. LGA-92 Landing Diagram Dimensions Dimension Notes: 1. All dimensions shown are in millimeters (mm) unless otherwise noted. 2. All feature sizes shown are at Maximum ...

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LGA-92 Solder Mask Design All metal pads are to be non-solder mask defined (NSMD). Clearance between the solder mask and the metal pad µm minimum, all the way around the pad. 6.4.2. LGA-92 Stencil Design ...

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SiM3U1xx 6.5. TQFP-80 Package Specifications Figure 6.8. TQFP-80 Package Drawing Table 6.6. TQFP-80 Package Dimensions Dimension Min Nominal Max — — 1.20 0.05 — 0.15 0.95 1.00 1.05 0.17 ...

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Table 6.6. TQFP-80 Package Dimensions (Continued) Dimension Min L 0.45 L1  0° aaa bbb ccc ddd eee Notes: 1. All dimensions shown are in millimeters (mm) unless otherwise noted. 2. Dimensioning and Tolerancing per ANSI Y14.5M-1994. 3. This package ...

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SiM3U1xx   Figure 6.9. TQFP-80 Landing Diagram Table 6.7. TQFP-80 Landing Diagram Dimensions Dimension Notes: 1. All dimensions shown are in millimeters (mm) unless otherwise noted. 2. This land pattern design is based on the ...

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TQFP-80 Solder Mask Design All metal pads are to be non-solder mask defined (NSMD). Clearance between the solder mask and the metal pad µm minimum, all the way around the pad. 6.5.2. TQFP-80 Stencil Design ...

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SiM3U1xx 6.6. QFN-64 Package Specifications Figure 6.10. QFN-64 Package Drawing Table 6.8. QFN-64 Package Dimensions Dimension aaa bbb ccc ddd eee Notes: 1. All dimensions shown are in millimeters (mm) unless ...

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Figure 6.11. QFN-64 Landing Diagram Table 6.9. QFN-64 Landing Diagram Dimensions Dimension Notes: 1. All dimensions shown are in millimeters (mm). 2. This Land Pattern Design is based on the IPC-7351 guidelines. ...

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SiM3U1xx 6.6.1. QFN-64 Solder Mask Design All metal pads are to be non-solder mask defined (NSMD). Clearance between the solder mask and the metal pad µm minimum, all the way around the pad. 6.6.2. QFN-64 Stencil ...

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TQFP-64 Package Specifications Figure 6.12. TQFP-64 Package Drawing Table 6.10. TQFP-64 Package Dimensions Dimension  Min Nominal Max — — 1.20 0.05 — 0.15 0.95 1.00 1.05 0.17 ...

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SiM3U1xx Table 6.10. TQFP-64 Package Dimensions (Continued) Dimension aaa bbb ccc ddd Notes: 1. All dimensions shown are in millimeters (mm) unless otherwise noted. 2. Dimensioning and Tolerancing per ANSI Y14.5M-1994. 3. This package outline conforms to JEDEC MS-026, variant ...

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Figure 6.13. TQFP-64 Landing Diagram Table 6.11. TQFP-64 Landing Diagram Dimensions Dimension Min C1 11.30 C2 11. 0.20 Y 1.40 Notes: 1. All dimensions shown are in millimeters (mm) unless otherwise noted. 2. This land pattern design ...

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SiM3U1xx 6.7.1. TQFP-64 Solder Mask Design All metal pads are to be non-solder mask defined (NSMD). Clearance between the solder mask and the metal pad µm minimum, all the way around the pad. 6.7.2. TQFP-64 Stencil ...

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QFN-40 Package Specifications Figure 6.14. QFN-40 Package Drawing Table 6.12. QFN-40 Package Dimensions Dimension aaa bbb ccc ddd eee Notes: 1. All dimensions shown are in millimeters (mm) unless otherwise ...

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SiM3U1xx Figure 6.15. QFN-40 Landing Diagram Table 6.13. QFN-40 Landing Diagram Dimensions Dimension Notes: 1. All dimensions shown are in millimeters (mm). 2. This Land Pattern Design is based on the IPC-7351 guidelines. 3. All dimensions shown are at Maximum ...

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QFN-40 Solder Mask Design All metal pads are to be non-solder mask defined (NSMD). Clearance between the solder mask and the metal pad µm minimum, all the way around the pad. 6.8.2. QFN-40 Stencil Design ...

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SiM3U1xx 7. Revision Specific Behavior This chapter details any known differences from behavior as stated in the device datasheet and reference manual. All known errata for the current silicon revision are rolled into this section at the time of publication. ...

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QFN-64 SiM3U166 1142BCS701 e3 Figure 7.3. SiM3U1x6 Revision Information Figure 7.4. SiM3U1x4 Revision Information 7.2. Comparator Rising/Falling Edge Flags in Debug Mode (CMP0, CMP1) 7.2.1. Problem On Revision A and Revision B devices, if the comparator output is high, the ...

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SiM3U1xx OCUMENT HANGE IST Revision 0.8 to Revision 1.0  Added block diagram to front page; updated feature bullet lists.  Electrical Specifications Tables Additions: Voltage Regulator Current Sense Supply Current, Typ = 3 µA (Table 3.2) ...

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N : OTES Rev. 1.0 SiM3U1xx 93 ...

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... Patent Notice Silicon Labs invests in research and development to help our customers differentiate in the market with innovative low-power, small size, analog- intensive mixed-signal solutions. Silicon Labs' extensive patent portfolio is a testament to our unique approach and world-class engineering team. ...

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