STM32F302RCT6 STMicroelectronics, STM32F302RCT6 Datasheet

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STM32F302RCT6

Manufacturer Part Number
STM32F302RCT6
Description
ARM Microcontrollers - MCU 32-Bit ARM Cortex M4 72MHz 256kB MCU FPU
Manufacturer
STMicroelectronics
Datasheet

Specifications of STM32F302RCT6

Product Category
ARM Microcontrollers - MCU
Rohs
yes
Core
ARM Cortex M4
Data Bus Width
32 bit

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Features
January 2013
This is information on a product in full production.
ARM Cortex-M4F 32b MCU+FPU, up to 256KB Flash+48KB SRAM
Core: ARM® 32-bit Cortex ™ -M4F CPU (72 MHz
max), single-cycle multiplication and HW
division, DSP instruction with FPU (floating-point
unit) and MPU (memory protection unit).
Operating conditions:
– V
Memories
– 128 to 256 Kbytes of Flash memory
– Up to 40 Kbytes of SRAM on data bus with
– 8 Kbytes of SRAM on instruction bus with
CRC calculation unit
Reset and supply management
– Power-on/Power down reset (POR/PDR)
– Programmable voltage detector (PVD)
– Low power modes: Sleep, Stop and Standby
– V
Clock management
– 4 to 32 MHz crystal oscillator
– 32 kHz oscillator for RTC with calibration
– Internal 8 MHz RC with x 16 PLL option
– Internal 40 kHz oscillator
Up to 87 fast I/Os
– All mappable on external interrupt vectors
– Several 5 V-tolerant
12-channel DMA controller
Up to four ADC 0.20 µS (up to 39 channels) with
selectable resolution of 12/10/8/6 bits, 0 to 3.6 V
conversion range, separate analog supply from
2 to 3.6 V
Up to two 12-bit DAC channels with analog
supply from 2.4 to 3.6 V
Seven fast rail-to-rail analog comparators with
analog supply from 2 to 3.6 V
Up to four operational amplifiers that can be
used in PGA mode, all terminal accessible with
analog supply from 2.4 to 3.6 V
Up to 24 capacitive sensing channels supporting
touchkey, linear and rotary touch sensors
4 ADCs, 2 DAC ch., 7 comp, 4 PGA, timers, 2.0-3.6 V operation
HW parity check
HW parity check (CCM)
DD
BAT
, V
supply for RTC and backup registers
DDA
voltage range: 2.0 V to 3.6 V
Doc ID 023353 Rev 5
STM32F302xB STM32F302xC
STM32F303xB STM32F303xC
Table 1.
STM32F302xx
STM32F303xx
Reference
Up to 13 timers
– One 32-bit timer and two 16-bit timers with
– Up to two 16-bit 6-channel advanced-control
– One 16-bit timer with 2 IC/OCs, 1
– Two 16-bit timers with IC/OC/OCN/PWM,
– Two watchdog timers (independent, window)
– SysTick timer: 24-bit downcounter
– Up to two 16-bit basic timers to drive the
Calendar RTC with Alarm, periodic wakeup from
Stop/Standby
Communication interfaces
– CAN interface (2.0B Active)
– Two I
– Up to five USART/UARTs (ISO 7816
– Up to three SPIs, two with multiplexed I
– USB 2.0 full speed interface
– Infrared Transmitter
Serial wire debug, JTAG, Cortex-M4F ETM
96-bit unique ID
up to 4 IC/OC/PWM or pulse counter and
quadrature (incremental) encoder input
timers, with up to 6 PWM channels,
deadtime generation and emergency stop
OCN/PWM, deadtime generation and
emergency stop
deadtime generation and emergency stop
DAC
mA current sink, SMBus/PMBus, wakeup
from STOP
interface, LIN, IrDA, modem control)
interface, 4 to 16 programmable bit frame
2
C Fast mode plus (1 Mbit/s) with 20
Device summary
STM32F302CB, STM32F302CC, STM32F302RB,
STM32F302RC, STM32F302VB, STM32F302VC
STM32F303CB, STM32F303CC, STM32F303RB,
STM32F303RC, STM32F303VB, STM32F303VC
LQFP100 (14 × 14 mm)
LQFP64 (10 × 10 mm)
LQFP48 (7 × 7 mm)
Datasheet
Part number
production data
www.st.com
2
1/133
S
1

Related parts for STM32F302RCT6

STM32F302RCT6 Summary of contents

Page 1

ARM Cortex-M4F 32b MCU+FPU 256KB Flash+48KB SRAM 4 ADCs, 2 DAC ch., 7 comp, 4 PGA, timers, 2.0-3.6 V operation Features ■ Core: ARM® 32-bit Cortex ™ -M4F CPU (72 MHz max), single-cycle multiplication and HW division, DSP ...

Page 2

Contents Contents 1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ...

Page 3

STM32F302xx/STM32F303xx 3.16.4 3.16.5 3.16.6 3.17 Real-time clock (RTC) and backup registers . . . . . . . . . . . . . . . . . . . . . . 25 3.18 Inter-integrated circuit interface (I 3.19 ...

Page 4

Contents 6.3.6 6.3.7 6.3.8 6.3.9 6.3.10 6.3.11 6.3.12 6.3.13 6.3.14 6.3.15 6.3.16 6.3.17 6.3.18 6.3.19 6.3.20 6.3.21 6.3.22 6.3.23 7 Package characteristics . . . . . . . . . . . . . . . . . . ...

Page 5

STM32F302xx/STM32F303xx List of tables Table 1. Device summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ...

Page 6

List of tables Table 49. ESD absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ...

Page 7

STM32F302xx/STM32F303xx List of figures Figure 1. STM32F302xB/STM32F302xC block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ...

Page 8

... This datasheet provides the ordering information and mechanical device characteristics of the STM32F30xB/C microcontrollers. This STM32F30xB/C datasheet should be read in conjunction with the STM32F30xB/C reference manual. The reference manual is available from the STMicroelectronics website www.st.com. For information on the Cortex™-M4F core please refer to: ● ...

Page 9

STM32F302xx/STM32F303xx 2 Description The STM32F302xx/STM32F303xx family is based on the high-performance ARM Cortex™-M4F 32-bit RISC core operating at a frequency MHz, and embedding a floating point unit (FPU), a memory protection unit (MPU) and an embedded ...

Page 10

Description Table 2. STM32F30xB/C family device features and peripheral counts STM32F Peripheral 302Cx Flash (Kbytes) 128 SRAM (Kbytes data bus SRAM (Kbytes) on instruction bus (CCM: core coupled memory) Advanced control Timers General purpose Basic (1) SPI(I2S) 2 ...

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STM32F302xx/STM32F303xx Figure 1. STM32F302xB/STM32F302xC block diagram TPIU ETM TRADECLK Trace/Trig SWJTAG TRACED[0-3] MPU/FPU as AF JTRST JTDI Cortex M4 CPU JTCK/SWCLK JTMS/SWDIO MHz JTDO max As AF NVIC GP DMA1 7 channels GP DMA2 5 channels Temp. ...

Page 12

Description Figure 2. STM32F303xB/STM32F303xC block diagram TPIU ETM TRADECLK Trace/Trig SWJTAG TRACED[0-3] MPU/FPU as AF JTRST JTDI Cortex M4 CPU JTCK/SWCLK JTMS/SWDIO MHz JTDO max As AF NVIC GP DMA1 7 channels GP DMA2 5 channels Temp. ...

Page 13

STM32F302xx/STM32F303xx 3 Functional overview ® 3.1 ARM Cortex™-M4F core with embedded Flash and SRAM The ARM Cortex-M4F processor is the latest generation of ARM processors for embedded systems. It was developed to provide a low-cost platform that meets the needs ...

Page 14

Functional overview 3.4 Embedded SRAM STM32F302xx/STM32F303xx devices feature Kbytes of embedded SRAM with hardware parity check. The memory can be accessed in read/write at CPU clock speed with 0 wait states, allowing the CPU to achieve 90 ...

Page 15

STM32F302xx/STM32F303xx 3.7 Power management 3.7.1 Power supply schemes ● 2 provided externally through V ● SSA DDA operational amplifiers, reset blocks, RCs and PLL (minimum voltage to be ...

Page 16

Functional overview 3.7.4 Low-power modes The STM32F302xx/STM32F303xx supports three low power modes to achieve the best compromise between low power consumption, short startup time and available wakeup sources: ● Sleep mode In Sleep mode, only the CPU is stopped. All ...

Page 17

STM32F302xx/STM32F303xx 3.8 Clocks and startup System clock selection is performed on startup, however the internal RC 8 MHz oscillator is selected as default CPU clock on reset. An external 4-32 MHz clock can be selected, in which case it is ...

Page 18

Functional overview Figure 3. Clock tree I2S_CKIN HSI 8 MHz HSI RC PLLSRC PLLMUL x2,x3,.. /2,/3,... /16 OSC_OUT 4-32 MHz HSE OSC OSC_IN OSC32_IN LSE OSC 32.768kHz OSC32_OUT LSI RC 40kHz Main clock output MCO MCO 18/133 HSI SYSCLK I2SSRC ...

Page 19

STM32F302xx/STM32F303xx 3.9 General-purpose input/outputs (GPIOs) Each of the GPIO pins can be configured by software as output (push-pull or open-drain), as input (with or without pull-up or pull-down peripheral alternate function. Most of the GPIO pins are shared ...

Page 20

Functional overview 3.12 Fast analog-to-digital converter (ADC four fast analog-to-digital converters 5 MSPS, with selectable resolution between 12 and 6 bit, are embedded in the STM32F302xx/STM32F303xx family devices. The ADCs have external channels. Some of ...

Page 21

STM32F302xx/STM32F303xx 3.12.3 V battery voltage monitoring BAT This embedded hardware feature allows the application to measure the V using the internal ADC channel ADC_IN17. As the V and thus outside the ADC input range, the V divider ...

Page 22

Functional overview 3.13 Digital-to-analog converter (DAC two 12-bit buffered DAC channels can be used to convert digital signals into analog voltage signal outputs. The chosen design structure is composed of integrated resistor strings and an amplifier in inverting ...

Page 23

STM32F302xx/STM32F303xx 3.16 Timers and watchdogs The STM32F302xx/STM32F303xx includes up to two advanced control timers general-purpose timers, two basic timers, two watchdog timers and a SysTick timer. The table below compares the features of the advanced control, general ...

Page 24

Functional overview In debug mode, the advanced-control timer counter can be frozen and the PWM outputs disabled to turn off any power switches driven by these outputs. Many features are shared with those of the general-purpose TIM timers (described in ...

Page 25

STM32F302xx/STM32F303xx 3.16.5 Window watchdog (WWDG) The window watchdog is based on a 7-bit downcounter that can be set as free running. It can be used as a watchdog to reset the device when a problem occurs clocked from ...

Page 26

Functional overview 3.18 Inter-integrated circuit interface ( two I C bus interfaces can operate in multimaster and slave modes. They can support standard (up to 100 KHz), fast (up to 400 KHz) and fast mode + (up ...

Page 27

STM32F302xx/STM32F303xx 3.19 Universal synchronous/asynchronous receiver transmitter (USART) The STM32F302xx/STM32F303xx devices have three embedded universal synchronous/asynchronous receiver transmitters (USART1, USART2 and USART3). The USART interfaces are able to communicate at speeds Mbits/s. They provide hardware management of ...

Page 28

Functional overview 3.21 Serial peripheral interface (SPI)/Inter-integrated sound interfaces (I2S three SPIs are able to communicate Mbits/s in slave and master modes in full-duplex and half-duplex communication modes. The 3-bit prescaler gives 8 master mode ...

Page 29

STM32F302xx/STM32F303xx TIM17 is used to provide the carrier frequency and TIM16 provides the main signal to be sent. The infrared output signal is available on PB9 or PA13. To generate the infrared remote control signals, TIM16 channel 1 and TIM17 ...

Page 30

Functional overview Table 8. Capacitive sensing GPIOs available on STM32F302xx/STM32F303xx devices (continued) Capacitive sensing Group TSC_G3_IO1 TSC_G3_IO2 3 TSC_G3_IO3 TSC_G3_IO4 TSC_G4_IO1 TSC_G4_IO2 4 TSC_G4_IO3 TSC_G4_IO4 Table 9. No. of capacitive sensing channels available on STM32F302xx/STM32F303xx devices Analog I/O group G1 ...

Page 31

STM32F302xx/STM32F303xx STM32F302xx/STM32F303xx through a small number of ETM pins to an external hardware trace port analyzer (TPA) device. The TPA is connected to a host computer using a high- speed channel. Real-time instruction and data flow activity can be recorded ...

Page 32

Pinouts and pin description 4 Pinouts and pin description Figure 5. STM32F302xx/STM32F303xx LQFP48 pinout VBAT PC13 PC14/OSC32_IN PC15/OSC32_OUT PF0/OSC_IN PF1/OSC_OUT NRST VSSA/VREF- VDDA/VREF+ PA0 PA1 PA2 32/133 ...

Page 33

STM32F302xx/STM32F303xx Figure 6. STM32F302xx/STM32F303xx LQFP64 pinout VBAT PC13 PC14/OSC32_IN PC15/OSC32_OUT PF0/OSC_IN PF1/OSC_OUT NRST PC0 PC1 PC2 PC3 VSSA/VREF- VDDA PA0 PA1 PA2 ...

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Pinouts and pin description Figure 7. STM32F302xx/STM32F303xx LQFP100 pinout 34/133 Doc ID 023353 Rev 5 STM32F302xx/STM32F303xx ...

Page 35

STM32F302xx/STM32F303xx Table 10. Legend/abbreviations used in the pinout table Name Pin name Pin type I/O structure Notes Alternate functions Pin functions Additional functions Abbreviation Unless otherwise specified in brackets below the pin name, the pin function during and after reset ...

Page 36

Pinouts and pin description Table 11. STM32F302xx/STM32F303xx pin definitions Pin number Pin name (function after reset) 1 PE2 2 PE3 3 PE4 4 PE5 5 PE6 BAT ( PC13 (2) PC14 8 3 ...

Page 37

STM32F302xx/STM32F303xx Table 11. STM32F302xx/STM32F303xx pin definitions (continued) Pin number Pin name (function after reset PA0 PA1 PA2 PA3 27 18 PF4 28 19 VDD_4 PA4 ...

Page 38

Pinouts and pin description Table 11. STM32F302xx/STM32F303xx pin definitions (continued) Pin number Pin name (function after reset PB0 PB1 PB2 38 PE7 39 PE8 40 PE9 41 PE10 42 PE11 43 ...

Page 39

STM32F302xx/STM32F303xx Table 11. STM32F302xx/STM32F303xx pin definitions (continued) Pin number Pin name (function after reset) 58 PD11 59 PD12 60 PD13 61 PD14 62 PD15 63 37 PC6 64 38 PC7 65 39 PC8 66 40 PC9 PA8 ...

Page 40

Pinouts and pin description Table 11. STM32F302xx/STM32F303xx pin definitions (continued) Pin number Pin name (function after reset VSS_3 VDD_3 PA14 PA15 78 51 PC10 79 52 PC11 80 ...

Page 41

STM32F302xx/STM32F303xx Table 11. STM32F302xx/STM32F303xx pin definitions (continued) Pin number Pin name (function after reset PB5 PB6 PB7 BOOT0 PB8 PB9 97 PE0 ...

Page 42

Table 12. Alternate functions for port A Port & AF0 AF1 AF2 AF3 Pin Name TIM2_ TSC_ PA0 CH1_ G1_IO1 ETR TIM2_ TSC_ PA1 CH2 G1_IO2 TIM2_ TSC_ PA2 CH3 G1_IO3 TIM2_ TSC_ PA3 CH4 G1_IO4 TIM3_ TSC_ PA4 CH2 ...

Page 43

Table 12. Alternate functions for port A (continued) Port & AF0 AF1 AF2 AF3 Pin Name TIM16_ PA12 CH1 SWDIO TIM16_ TSC_ PA13 -JTMS CH1N G4_IO3 SWCLK TSC_ I2C1_ PA14 -JTCK G4_IO4 SDA TIM2_ TIM8_ I2C1_ PA15 JTDI CH1_ CH1 ...

Page 44

Table 13. Alternate functions for port B Port & AF0 AF1 AF2 AF3 Pin Name TIM3_ TSC_ PB0 CH3 G3_IO2 TIM3_ TSC_ PB1 CH4 G3_IO3 TSC_ PB2 G3_IO4 JTDO- TIM2_ TIM4_ TSC_ PB3 TRACES CH2 ETR G5_IO1 WO TIM16_ TIM3_ ...

Page 45

Table 13. Alternate functions for port B (continued) Port & AF0 AF1 AF2 AF3 Pin Name TSC_ PB13 G6_IO3 TIM15_ TSC_ PB14 CH1 G6_IO4 TIM15_ TIM15_ PB15 CH2 CH1N AF4 AF5 AF6 AF7 SPI2_SCK, TIM1_ USART3_ I2S2_CK CH1N CTS SPI2_MISO, ...

Page 46

Table 14. Alternate functions for port C Port & Pin AF1 AF2 Name PC0 EVENTOUT PC1 EVENTOUT PC2 EVENTOUT COMP7_OUT PC3 EVENTOUT PC4 EVENTOUT PC5 EVENTOUT TSC_G3_IO1 PC6 EVENTOUT TIM3_CH1 PC7 EVENTOUT TIM3_CH2 PC8 EVENTOUT TIM3_CH3 PC9 EVENTOUT TIM3_CH4 PC10 ...

Page 47

Table 15. Alternate functions for port D Port & AF1 AF2 Pin Name PD0 EVENTOUT PD1 EVENTOUT PD2 EVENTOUT TIM3_ETR PD3 EVENTOUT TIM2_CH1_ETR PD4 EVENTOUT TIM2_CH2 PD5 EVENTOUT PD6 EVENTOUT TIM2_CH4 PD7 EVENTOUT TIM2_CH3 PD8 EVENTOUT PD9 EVENTOUT PD10 EVENTOUT ...

Page 48

Table 16. Alternate functions for port E Port & AF0 AF1 Pin Name PE0 EVENTOUT PE1 EVENTOUT PE2 TRACECK EVENTOUT PE3 TRACED0 EVENTOUT PE4 TRACED1 EVENTOUT PE5 TRACED2 EVENTOUT PE6 TRACED3 EVENTOUT PE7 EVENTOUT PE8 EVENTOUT PE9 EVENTOUT PE10 EVENTOUT ...

Page 49

Table 17. Alternate functions for port F Port & AF1 AF2 Pin Name PF0 PF1 PF2 EVENTOUT PF4 EVENTOUT COMP1_OUT PF6 EVENTOUT TIM4_CH4 PF9 EVENTOUT PF10 EVENTOUT AF3 AF4 AF5 I2C2_SDA I2C2_SCL I2C2_SCL TIM15_CH1 SPI2_SCK TIM15_CH2 SPI2_SCK AF6 AF7 TIM1_CH3N ...

Page 50

Memory mapping 5 Memory mapping Figure 8. STM32F30xB/C memory map 0xFFFF FFFF Cortex-M4F 7 Internal Peripherals 0xE000 0000 6 0xC000 0000 5 0xA000 0000 4 0x8000 0000 3 0x6000 0000 2 Peripherals 0x4000 0000 1 SRAM 0x2000 0000 0 CODE ...

Page 51

STM32F302xx/STM32F303xx Table 18. STM32F30xB/C memory map and peripheral register boundary addresses Bus 0x5000 0400 - 0x5000 07FF AHB3 0x5000 0000 - 0x5000 03FF 0x4800 1800 - 0x4FFF FFFF 0x4800 1400 - 0x4800 17FF 0x4800 1000 - 0x4800 13FF 0x4800 0C00 ...

Page 52

Memory mapping Table 18. STM32F30xB/C memory map and peripheral register boundary addresses (continued) Bus 0x4000 8000 - 0x4000 FFFF 0x4000 7800 - 0x4000 7FFF 0x4000 7400 - 0x4000 77FF 0x4000 7000 - 0x4000 73FF 0x4000 6C00 - 0x4000 6FFF 0x4000 ...

Page 53

STM32F302xx/STM32F303xx 6 Electrical characteristics 6.1 Parameter conditions Unless otherwise specified, all voltages are referenced to V 6.1.1 Minimum and maximum values Unless otherwise specified, the minimum and maximum values are guaranteed in the worst conditions of ambient temperature, supply voltage ...

Page 54

Electrical characteristics 6.1.6 Power supply scheme Figure 11. Power supply scheme μF 1. Dotted lines represent the internal connections on low pin count packages, joining the dedicated supply pins. Caution: Each power supply pair (V ceramic ...

Page 55

STM32F302xx/STM32F303xx 6.1.7 Current consumption measurement Figure 12. Current consumption measurement scheme Doc ID 023353 Rev 5 Electrical characteristics 55/133 ...

Page 56

Electrical characteristics 6.2 Absolute maximum ratings Stresses above the absolute maximum ratings listed in Table 20: Current permanent damage to the device. These are stress ratings only and functional operation of the device at these conditions is not implied. Exposure ...

Page 57

STM32F302xx/STM32F303xx Table 20. Current characteristics Symbol I Total current into sum of all VDD_x power lines (source) VDD(Σ) I Total current out of sum of all VSS_x ground lines (sink) VSS(Σ) I Maximum current into each V VDD I Maximum ...

Page 58

Electrical characteristics 6.3 Operating conditions 6.3.1 General operating conditions Table 22. General operating conditions Symbol f Internal AHB clock frequency HCLK f Internal APB1 clock frequency PCLK1 f Internal APB2 clock frequency PCLK2 V Standard operating voltage DD Analog operating ...

Page 59

STM32F302xx/STM32F303xx 6.3.2 Operating conditions at power-up / power-down The parameters given in temperature condition summarized in Table 23. Operating conditions at power-up / power-down Symbol V rise time rate DD t VDD V fall time rate DD V DDA t ...

Page 60

Electrical characteristics Table 25. Programmable voltage detector characteristics Symbol V PVD threshold 0 PVD0 V PVD threshold 1 PVD1 V PVD threshold 2 PVD2 V PVD threshold 3 PVD3 V PVD threshold 4 PVD4 V PVD threshold 5 PVD5 V ...

Page 61

STM32F302xx/STM32F303xx 1. Data based on characterization results, not tested in production. 2. Guaranteed by design, not tested in production Table 27. Internal reference voltage calibration values Calibration value name V REFINT_CAL 6.3.5 Supply current characteristics The current consumption is a ...

Page 62

Electrical characteristics Table 28. Typical and maximum current consumption from V Symbol Parameter Conditions External clock (HSE bypass) Supply current in Run mode, executing from Flash Internal clock (HSI External clock (HSE bypass) Supply current in Run mode, ...

Page 63

STM32F302xx/STM32F303xx Table 28. Typical and maximum current consumption from V Symbol Parameter Conditions External clock (HSE Supply bypass) current in Sleep I mode, DD executing from Flash or RAM Internal clock (HSI) 1. Data based on characterization results, not tested ...

Page 64

Electrical characteristics 1. Current consumption from the V DDA PLL is off independent from the frequency. DDA 2. Data based on characterization results, not tested in production. 64/133 supply is independent of whether the peripherals are on or ...

Page 65

STM32F302xx/STM32F303xx Table 30. Typical and maximum V Symbol Parameter Conditions Regulator in run mode, Supply all oscillators OFF current in Regulator in low-power Stop mode mode, all oscillators OFF I DD Supply LSI ON and IWDG ON current in Standby ...

Page 66

Electrical characteristics Table 32. Typical and maximum current consumption from V Para Conditions Symbol (1) meter LSE & RTC ON; "Xtal mode" lower driving capability; LSEDRV[1: Backup 0] = '00' domain I LSE & RTC DD_VBAT supply ON; "Xtal current ...

Page 67

STM32F302xx/STM32F303xx Typical current consumption The MCU is placed under the following conditions: ● DDA ● All I/O pins available on each package are in analog input configuration ● The Flash access time is adjusted to f ...

Page 68

Electrical characteristics 2. When peripherals are enabled, the power consumption of the analog part of peripherals such as ADC, DAC, Comparators, OpAmp etc. is not included. Refer to the tables of characteristics in the subsequent sections. Table 34. Typical current ...

Page 69

STM32F302xx/STM32F303xx I/O system current consumption The current consumption of the I/O system has two components: static and dynamic. I/O static current consumption All the I/Os used as inputs with pull-up generate current consumption when the pin is externally held low. ...

Page 70

Electrical characteristics Table 35. Switching output I/O current consumption Symbol Parameter I/O current I SW consumption (estimated value). 70/133 I/O toggling (1) Conditions frequency (f 2 MHz 4 MHz MHz ...

Page 71

STM32F302xx/STM32F303xx On-chip peripheral current consumption The MCU is placed under the following conditions: ● all I/O pins are in analog input configuration ● all peripherals are disabled unless otherwise mentioned ● the given value is calculated by measuring the current ...

Page 72

Electrical characteristics Table 36. Peripheral current consumption (continued) Peripheral TIM6 TIM7 WWDG SPI2 SPI3 USART2 USART3 UART4 UART5 I2C1 I2C2 USB CAN PWR DAC 1. The power consumption of the analog part (I etc. is not included. Refer to the ...

Page 73

STM32F302xx/STM32F303xx 6.3.6 Wakeup time from low-power mode The wakeup times given in to the first instruction executed by the CPU: ● For Stop or Sleep mode: the wakeup event is WFE. ● WKUP1 (PA0) pin is used to wakeup from ...

Page 74

Electrical characteristics 6.3.7 External clock source characteristics High-speed external user clock generated from an external source In bypass mode the HSE oscillator is switched off and the input pin is a standard GPIO. The external clock signal has to respect ...

Page 75

STM32F302xx/STM32F303xx Low-speed external user clock generated from an external source In bypass mode the LSE oscillator is switched off and the input pin is a standard GPIO. The external clock signal has to respect the I/O characteristics in recommended clock ...

Page 76

Electrical characteristics High-speed external clock generated from a crystal/ceramic resonator The high-speed external (HSE) clock can be supplied with MHz crystal/ceramic resonator oscillator. All the information given in this paragraph are based on design simulation results ...

Page 77

STM32F302xx/STM32F303xx For C and recommended to use high-quality external ceramic capacitors in the range (typ.), designed for high-frequency applications, and selected to match the requirements of the crystal or ...

Page 78

Electrical characteristics Low-speed external clock generated from a crystal/ceramic resonator The low-speed external (LSE) clock can be supplied with a 32.768 kHz crystal/ceramic resonator oscillator. All the information given in this paragraph are based on design simulation results obtained with ...

Page 79

STM32F302xx/STM32F303xx Figure 17. Typical application with a 32.768 kHz crystal Note: An external resistor is not required between OSC32_IN and OSC32_OUT and it is forbidden to add one. Doc ID 023353 Rev 5 Electrical characteristics 79/133 ...

Page 80

Electrical characteristics 6.3.8 Internal clock source characteristics The parameters given in temperature and supply voltage conditions summarized in High-speed internal (HSI) RC oscillator Table 42. HSI oscillator characteristics Symbol f Frequency HSI TRIM HSI user trimming step DuCy Duty cycle ...

Page 81

STM32F302xx/STM32F303xx Low-speed internal (LSI) RC oscillator Table 43. LSI oscillator characteristics Symbol f Frequency LSI (2) t LSI oscillator startup time su(LSI) (2) I LSI oscillator power consumption DD(LSI 3 DDA A 2. Guaranteed ...

Page 82

Electrical characteristics 6.3.10 Memory characteristics Flash memory The characteristics are given at T Table 45. Flash memory characteristics Symbol Parameter t 16-bit programming time T prog t Page (2 KB) erase time ERASE t Mass erase time ME I Supply ...

Page 83

STM32F302xx/STM32F303xx 6.3.11 EMC characteristics Susceptibility tests are performed on a sample basis during device characterization. Functional EMS (electromagnetic susceptibility) While a simple application is executed on the device (toggling 2 LEDs through I/O ports). the device is stressed by two ...

Page 84

Electrical characteristics Prequalification trials Most of the common failures (unexpected reset and program counter corruption) can be reproduced by manually forcing a low state on the NRST pin or the Oscillator pins for 1 second. To complete these trials, ESD ...

Page 85

STM32F302xx/STM32F303xx Static latch-up Two complementary static tests are required on six parts to assess the latch-up performance: ● A supply overvoltage is applied to each power supply pin ● A current injection is applied to each input, output and configurable ...

Page 86

Electrical characteristics Table 51. I/O current injection susceptibility Symbol Injected current on BOOT0 Injected current on PC0, PC1, PC2, PC3, PF2, PA0, PA1, PA2, PA3, PF4, PA4, PA5, PA6, PA7, PC4, PC5, PB2 with induced leakage current on other pins ...

Page 87

STM32F302xx/STM32F303xx 6.3.14 I/O port characteristics General input/output characteristics Unless otherwise specified, the parameters given in performed under the conditions summarized in compliant. Table 52. I/O static characteristics Symbol Parameter Low level input V IL voltage High level input V IH ...

Page 88

Electrical characteristics All I/Os are CMOS and TTL compliant (no software configuration required). Their characteristics cover more than the strict CMOS-technology or TTL parameters. The coverage of these requirements is shown in Figure 19. TC and TTa I/O input characteristics ...

Page 89

STM32F302xx/STM32F303xx Figure 22. Five volt tolerant (FT and FTf) I/O input characteristics - TTL port 2.0 1.0 0.8 0.5 2.0 TTL standard requirements IHmin Area not determined TTL standard requirements V ...

Page 90

Electrical characteristics Output driving current The GPIOs (general purpose input/outputs) can sink or source up to +/-8 mA, and sink or source up to +/- 20 mA (with a relaxed V In the user application, the number of I/O pins ...

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STM32F302xx/STM32F303xx Input/output AC characteristics The definition and values of input/output AC characteristics are given in Table 54, respectively. Unless otherwise specified, the parameters given are derived from tests performed under ambient temperature and V Table 54. I/O AC characteristics OSPEEDRy ...

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Electrical characteristics Figure 23. I/O AC characteristics definition EXT ERNAL OUTPUT ON 50pF Maximum frequency is achieved ≤ 2/3)T and if the duty cycle is (45-55%) 6.3.15 NRST pin characteristics The NRST pin ...

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STM32F302xx/STM32F303xx Figure 24. Recommended NRST pin protection 1. The reset network protects the device against parasitic resets. 2. The user must ensure that the level on the NRST pin can go below the V Table 55. Otherwise the reset will ...

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Electrical characteristics Table 56. TIMx Symbol (2) 16-bit counter clock period t COUNTER Maximum possible count t MAX_COUNT with 32-bit counter (2) 1. TIMx is used as a general term to refer to the TIM1, TIM2, TIM3, TIM4, TIM8, TIM15, ...

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STM32F302xx/STM32F303xx Table 57. IWDG min/max timeout period at 40 kHz (LSI) Prescaler divider /4 /8 /16 /32 /64 /128 /256 1. These timings are given for a 40 kHz clock but the microcontroller’s internal RC frequency can vary from 30 ...

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Electrical characteristics 6.3.17 Communications interfaces interface characteristics Unless otherwise specified, the parameters given in performed under ambient temperature, f summarized in Table 2 The I C interface meets the requirements of the standard I the following restrictions: ...

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STM32F302xx/STM32F303xx 2 Figure 25 bus AC waveforms and measurement circuit 1. Measurement points are done at CMOS levels: 0.3V Ω Ω and 0. Doc ID 023353 Rev 5 Electrical characteristics 97/133 ...

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Electrical characteristics 2 SPI/I S characteristics Unless otherwise specified, the parameters given in are derived from tests performed under ambient temperature, f supply voltage conditions summarized in Refer to Section 6.3.14: I/O port characteristics function characteristics (NSS, SCK, MOSI, MISO ...

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STM32F302xx/STM32F303xx Figure 26. SPI timing diagram - slave mode and CPHA = 0 NSS input t SU(NSS) CPHA= 0 CPOL=0 t w(SCKH) CPHA w(SCKL) CPOL=1 t a(SO) MISO OUT su(SI) MOSI I NPUT Figure 27. ...

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Electrical characteristics Figure 28. SPI timing diagram - master mode 1. Measurement points are done at 0.5V 2 Table 62 characteristics Symbol f CK (1) 1/t c(CK) t r(CK) (1) t f(CK) (1) t w(CKH) (1) t w(CKL) ...

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STM32F302xx/STM32F303xx 2 Table 62 characteristics (continued) Symbol (1) t su(SD_MR) (1) t su(SD_SR) (1) t h(SD_MR) (1) t h(SD_SR) (1) t v(SD_ST) (1) t h(SD_ST) (1) t v(SD_MT) (1) t h(SD_MT) 1. Data based on characterization results, not ...

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Electrical characteristics 2 Figure 30 master timing diagram (Philips protocol) CPOL = 0 CPOL = 1 WS output SD transmit SD receive 1. Measurement points are done at 0.5V 2. LSB transmit/receive of the previously transmitted byte. No ...

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STM32F302xx/STM32F303xx Table 64. USB DC electrical characteristics Symbol Input levels V USB operating voltage DD (4) V Differential input sensitivity DI (4) V Differential common mode range CM (4) V Single ended receiver threshold SE Output levels V Static output ...

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Electrical characteristics Table 65. USB: Full-speed electrical characteristics Symbol Parameter Driver characteristics (2) t Rise time r (2) t Fall time f t Rise/ fall time matching rfm V Output signal crossover voltage CRS Output driver Z (3) DRV Impedance ...

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STM32F302xx/STM32F303xx 6.3.18 ADC characteristics Unless otherwise specified, the parameters given in design, with conditions summarized in Table 66. ADC characteristics Symbol Parameter Analog supply voltage for V DDA ADC f ADC clock frequency ADC (1) f Sampling rate S (1) ...

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Electrical characteristics Table 67. Maximum ADC R Sampling Resolution cycle @ 72 MHz 1.5 2.5 4.5 7.5 12 bits 19.5 61.5 181.5 601.5 1.5 2.5 4.5 7.5 10 bits 19.5 61.5 181.5 601.5 1.5 2.5 4.5 7.5 8 bits 19.5 ...

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STM32F302xx/STM32F303xx Table 68. ADC accuracy - limited test conditions Symbol Parameter Total ET unadjusted error EO Offset error EG Gain error Differential ADC clock freq. ED linearity ≤ 72 MHz error Sampling freq ≤ DDA Integral ...

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Electrical characteristics Table 68. ADC accuracy - limited test conditions Symbol Parameter Signal-to- SNR ADC clock freq. ≤ 72 noise ratio Sampling freq ≤ DDA Total THD harmonic distortion 1. ADC DC accuracy values are measured ...

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STM32F302xx/STM32F303xx (1)(2)(3) Table 69. ADC accuracy Symbol Parameter Total ET unadjusted error EO Offset error EG Gain error ADC clock freq. Sampling freq. ≤ 5 Differential ED 2V ≤ V linearity error Integral EL linearity error Effective ENOB number of ...

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Electrical characteristics (1)(2)(3) Table 69. ADC accuracy Symbol Parameter Signal-to- SINAD noise and distortion ratio ADC clock freq. Sampling freq. ≤ 5 Signal-to- SNR noise ratio 2V ≤ V Total THD harmonic distortion 1. ADC DC accuracy values are measured ...

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STM32F302xx/STM32F303xx Figure 33. Typical connection diagram using the ADC R AIN (1) V AIN 1. Refer to Table represents the capacitance of the PCB (dependent on soldering and PCB layout quality) plus the parasitic pad capacitance (roughly ...

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Electrical characteristics 6.3.19 DAC electrical specifications Table 70. DAC characteristics Symbol Parameter Analog supply voltage for V DDA DAC ON (1) R Resistive load with buffer ON LOAD Impedance output with buffer ( OFF (1) C Capacitive load ...

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STM32F302xx/STM32F303xx Table 70. DAC characteristics (continued) Symbol Parameter Settling time (full scale: for a 10-bit input code transition between the lowest and the (3) t SETTLING highest input codes when DAC_OUT reaches final value ±1LSB Max frequency for a correct ...

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Electrical characteristics 6.3.20 Comparator characteristics Table 71. Comparator characteristics Symbol Parameter V Analog supply voltage DDA Comparator input voltage V IN range V Scaler input voltage BG V Scaler offset voltage SC Scaler startup time from t S_SC power down ...

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STM32F302xx/STM32F303xx Table 71. Comparator characteristics (continued) Symbol Parameter V Comparator hysteresis hys 1. Data based on characterization results, not tested in production. Conditions No hysteresis (COMPxHYST[1:0]=00) High speed mode Low hysteresis All other power (COMPxHYST[1:0]=01) modes High speed mode Medium ...

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Electrical characteristics 6.3.21 Operational amplifier characteristics Table 72. Operational amplifier characteristics Symbol Parameter V Analog supply voltage DDA CMIR Common mode input range VI Input offset voltage OFFSET ΔVI Input offset voltage drift OFFSET I Drive current LOAD IDDOPAMP Consumption ...

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STM32F302xx/STM32F303xx Table 72. Operational amplifier characteristics Symbol Parameter PGA gain Non inverting gain value R2/R1 internal resistance values in R (2) network PGA mode PGA gain error PGA gain error I OPAMP input bias current bias 1. Data guaranteed by ...

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Electrical characteristics 6.3.22 Temperature sensor characteristics Table 73. TS characteristics Symbol ( SENSE (1) Avg_Slope Average slope V Voltage at 25 °C 25 (1) t Startup time START ADC sampling time when reading the (1)(2) T S_temp ...

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STM32F302xx/STM32F303xx 7 Package characteristics 7.1 Package mechanical data In order to meet environmental requirements, ST offers these devices in different grades of ® ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are ...

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Package characteristics Figure 35. LQFP100 – mm, 100-pin low-profile quad flat package outline 1. Drawing is not to scale. Table 76. LQPF100 – mm, low-profile quad flat package mechanical data Symbol Min A A1 ...

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STM32F302xx/STM32F303xx Table 76. LQPF100 – mm, low-profile quad flat package mechanical data (continued) Symbol Min E1 13. 0. 0° ccc 1. Values in inches are converted from mm and rounded to 4 ...

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Package characteristics Figure 37. LQFP64 – mm, 64 pin low-profile quad flat package outline 1. Drawing is not to scale. Table 77. LQFP64 – low-profile quad flat package mechanical data Symbol Min A ...

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STM32F302xx/STM32F303xx Table 77. LQFP64 – low-profile quad flat package mechanical data (continued) Symbol Min E 11. 0° ccc 1. Values in inches are converted from mm and rounded ...

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Package characteristics Figure 39. LQFP48 – mm, 48-pin low-profile quad flat package outline 1. Drawing is not to scale. Table 78. LQFP48 – mm, 48-pin low-profile quad flat package mechanical data Symbol Min A ...

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STM32F302xx/STM32F303xx Table 78. LQFP48 – mm, 48-pin low-profile quad flat package mechanical data (continued) Symbol Min L 0. 0° ccc 1. Values in inches are converted from mm and rounded to 4 decimal digits. Figure ...

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Package characteristics 7.2 Thermal characteristics The maximum chip junction temperature (T Table 22: General operating conditions on page The maximum chip-junction temperature, T using the following equation: Where: ● T max is the maximum ambient temperature in °C, A Θ ...

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STM32F302xx/STM32F303xx 7.2.2 Selecting the product temperature range When ordering the microcontroller, the temperature range is specified in the ordering information scheme shown in Each temperature range suffix corresponds to a specific guaranteed ambient temperature at maximum dissipation and ...

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Package characteristics Using the values obtained in – For LQFP100, 41°C 115 °C + (41°C/W × 98.8 mW) = 115 °C + 4.05 °C = 119.05 °C Jmax This is within the range of the suffix 7 version ...

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STM32F302xx/STM32F303xx 8 Part numbering Table 80. Ordering information scheme Example: Device family STM32 = ARM-based 32-bit microcontroller Product type F = general-purpose Device subfamily 302 = STM32F302xx 303 = STM32F303xx Pin count pins pins ...

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Revision history 9 Revision history Table 81. Document revision history Date Revision 22-Jun-2012 07-Sep-2012 21-Sep-2012 130/133 1 Initial release Modified Features on cover page. Modified Table 2: STM32F301xx family device features and peripheral counts Added clock tree to Section 3.8: ...

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STM32F302xx/STM32F303xx Table 81. Document revision history Date Revision 05-Dec-2012 Updated first page Removed references to VDDSDx and VSSSD Added reference to PM0214 in Moved Temp. sensor calibartion values calibration values to Table 27 Updated Table 2: STM32F30xB/C family device features ...

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Revision history Table 81. Document revision history Date Revision 08-Jan-2013 132/133 Updated V and I in Table 52: I/O static hys lkg Updated IL(NRST) IH(NRST) 5 characteristics. Updated Table 68: ADC accuracy - limited test conditions ADC ...

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... STM32F302xx/STM32F303xx Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. ...

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