RS9110-N-11-28-04 Redpine Signals, RS9110-N-11-28-04 Datasheet - Page 3

• Manufacturer Part Number: RS9110-N-11-28-04
• Description: WiFi / 802.11 Modules Dualband 2.4GHz&5GHz module
• Manufacturer: Redpine Signals

Specifications of RS9110-N-11-28-04

• Rohs: yes
• Protocol Supported: 802.11 a/b/g
• Frequency Band: 2.4 GHz, 5 GHz
• Data Rate: 1 Mbps to 54 Mbps
• Interface Type: SPI, UART
• Transmit Power (max): 17 dBm
• Antenna Connector Type: Chip
• Operating Supply Voltage: 3.3 V
• Maximum Operating Temperature: + 85 C
• Dimensions: 20 mm x 17.5 mm
• Minimum Operating Temperature: - 40 C
• Modulation Technique: CCK, DSSS, OFDM
• Security: WEP 64/128 bit AES, WPA2-PSK

RS-9110-N-11-28 Self Contained 802.11 a/b/g/n Module with
Networking Stack ..................................................................... 1
1: Detailed Feature List ............................................................ 7
2: Package Description ............................................................. 9
3: Pin Description ................................................................... 13
4: Electrical Characteristics .................................................... 17
5: Performance Specifications ................................................ 20
6: Software Architecture ........................................................ 22
Redpine Signals, Inc.
1.1: Host Interfaces ........................................................................ 7
1.2: WLAN ....................................................................................... 7
1.3: Networking Protocols .............................................................. 8
1.4: Configuration ........................................................................... 8
1.5: Software .................................................................................. 8
2.1: Top View .................................................................................. 9
2.2: Bottom View ............................................................................ 9
2.3: Package Dimensions ................................................................ 9
2.4: PCB Landing Pattern .............................................................. 11
2.5: Recommended Reflow Profile ................................................ 12
2.6: Baking Instructions ............................................................... 12
3.1: Module Pinout ........................................................................ 13
3.2: Pin Description ....................................................................... 13
4.1: Absolute Maximum Ratings .................................................... 17
4.2: Recommended Operating Conditions ..................................... 17
4.3: DC Characteristics – Digital I/O Signals ................................. 17
4.4: AC Characteristics .................................................................. 18
5.1: Wireless Specifications .......................................................... 20
5.2: Receive Characteristics .......................................................... 20
5.3: Throughput ............................................................................ 21
5.4: Standards Compliance ........................................................... 21
6.1: Host ....................................................................................... 23
6.2: RS9110-N-11-28 .................................................................... 23
1.2.1: MAC .............................................................................................. 7
1.2.2: Baseband Processing .................................................................... 7
1.2.3: RF ................................................................................................. 7
4.4.1: SPI Interface .............................................................................. 18
4.4.2: Reset Sequence and Timing ........................................................ 19
5.2.1: Sensitivity................................................................................... 20
6.1.1: UART .......................................................................................... 23
6.1.2: SPI ............................................................................................. 23
6.1.3: Thin SPI Driver ........................................................................... 23
6.2.1: SPI ............................................................................................. 23
6.2.2: UART .......................................................................................... 23
6.2.3: Host Abstraction Layer (HAL) ..................................................... 23
6.2.4: Wireless Control Block (WCB) ..................................................... 24
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