CAT24C04YI-GT3JN ON Semiconductor, CAT24C04YI-GT3JN Datasheet
CAT24C04YI-GT3JN
Specifications of CAT24C04YI-GT3JN
Related parts for CAT24C04YI-GT3JN
CAT24C04YI-GT3JN Summary of contents
Page 1
... I C CMOS Serial EEPROM Description The CAT24C01/02/04/08/16 are 1−Kb, 2−Kb, 4−Kb, 8−Kb and 16−Kb respectively CMOS Serial EEPROM devices organized internally as 8/16/32/64 and 128 pages respectively of 16 bytes each. All devices support both the Standard (100 kHz) as well as Fast 2 (400 kHz protocol. ...
Page 2
V CC SCL CAT24Cxx Figure 1. Functional Symbol Table 2. ABSOLUTE MAXIMUM RATINGS Parameters Storage Temperature Voltage on any pin with respect to Ground (Note 1) Stresses exceeding Maximum ...
Page 3
Table 5. PIN IMPEDANCE CHARACTERISTICS ( −40°C to +125°C and Symbol Parameter C (Note 4) SDA Pin Capacitance IN Other Pins I (Note 5) WP Input Current WP I ...
Page 4
... SCL: The Serial Clock input pin accepts the Serial Clock generated by the Master. SDA: The Serial Data I/O pin receives input data and transmits data stored in EEPROM. In transmit mode, this pin is open drain. Data is acquired on the positive edge, and is delivered on the negative edge of SCL. ...
Page 5
SCL SDA START CONDITION BUS RELEASE DELAY (TRANSMITTER) SCL FROM MASTER DATA OUTPUT FROM TRANSMITTER DATA OUTPUT FROM RECEIVER START SCL t SU:STA t HD:SDA ...
Page 6
Byte Write In Byte Write mode, the Master sends the START condition and the Slave address with the R/W bit set to zero to the Slave. After the Slave generates an acknowledge, the Master sends the byte address that is ...
Page 7
SCL th SDA 8 Bit Byte n S BUS ACTIVITY SLAVE R MASTER ADDRESS SLAVE ADDRESS BYTE 1 SCL a 7 SDA WP ACK t WR STOP ...
Page 8
Immediate Read Upon receiving a Slave address with the R/W bit set to ‘1’, the CAT24Cxx will interpret this as a request for data residing at the current byte address in memory. The CAT24Cxx will acknowledge the Slave address, will ...
Page 9
PIN # 1 IDENTIFICATION D TOP VIEW SIDE VIEW Notes: (1) All dimensions are in millimeters. (2) Complies with JEDEC MS-001. PACKAGE DIMENSIONS PDIP−8, 300 mils CASE 646AA ISSUE A SYMBOL ...
Page 10
PIN # 1 IDENTIFICATION TOP VIEW SIDE VIEW Notes: (1) All dimensions are in millimeters. Angles in degrees. (2) Complies with JEDEC MS-012. PACKAGE DIMENSIONS SOIC 8, 150 mils CASE 751BD ISSUE O SYMBOL ...
Page 11
E1 e TOP VIEW SIDE VIEW Notes: (1) All dimensions are in millimeters. Angles in degrees. (2) Complies with JEDEC MO-153. PACKAGE DIMENSIONS TSSOP8, 4.4x3 CASE 948AL ISSUE O SYMBOL MIN A A1 0.05 A2 ...
Page 12
E E1 TOP VIEW SIDE VIEW Notes: (1) All dimensions are in millimeters. Angles in degrees. (2) Complies with JEDEC MO-187. PACKAGE DIMENSIONS MSOP 8, 3x3 CASE 846AD ISSUE O SYMBOL ...
Page 13
D E PIN#1 INDEX AREA TOP VIEW SYMBOL MIN NOM A 0.70 0.75 A1 0.00 0.02 A2 0.45 0.55 A3 0.20 REF b 0.20 0.25 D 1.90 2.00 D2 1.30 1.40 E 2.90 3.00 E2 1.20 1.30 e 0.50 TYP ...
Page 14
TOP VIEW SIDE VIEW Notes: (1) All dimensions are in millimeters. Angles in degrees. (2) Complies with JEDEC MO-193. PACKAGE DIMENSIONS TSOT−23, 5 LEAD CASE 419AE ISSUE O SYMBOL MIN A A1 0.01 A2 ...
Page 15
... SEATING 0.05 PLANE H T *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. PACKAGE DIMENSIONS TSOP−5 CASE 483−02 ISSUE H NOTES: 1. DIMENSIONING AND TOLERANCING PER 2. CONTROLLING DIMENSION: MILLIMETERS. 3. MAXIMUM LEAD THICKNESS INCLUDES ...
Page 16
D E PIN #1 INDEX AREA TOP VIEW SYMBOL MIN NOM A 0.45 0.50 A1 0.00 0.02 A3 0.127 REF b 0.20 0.25 D 1.95 2.00 D2 1.35 1.40 E 2.95 3.00 E2 1.25 1.30 e 0.50 REF L 0.25 ...
Page 17
... Die Coat (Optional) DETAIL A A SEATING C * Die Coat (Optional) PLANE NOTE 3 SOLDERING FOOTPRINT* e 0.40 PITCH *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. http://onsemi.com 17 MILLIMETERS DIM MIN MAX A 0.28 0.38 A1 0.08 0. ...
Page 18
... DIMENSION b IS MEASURED AT THE MAXIMUM CON- TACT BALL DIAMETER PARALLEL TO DATUM C. DIM A2 SEATING C PLANE SOLDERING FOOTPRINT* e1 0.52 PITCH *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. http://onsemi.com 18 MILLIMETERS MIN MAX A 0.29 0.39 A1 0.10 ...
Page 19
Ordering Information CAT24C01 Ordering Information Specific Device Marking Device Order Number CAT24C01TDI−GT3 MM CAT24C01VP2I−GT3* EE CAT24C01WI−GT3 24C01WI CAT24C01WE−GT3 24C01WI CAT24C01YI−GT3 C01 CAT24C01YE−GT3 C01 CAT24C01ZI−GT3 ABMK CAT24C02 Ordering Information (Notes 10, 11) Specific Device Marking Device Order Number CAT24C02WI−G 24C02H CAT24C02WI−GA ...
Page 20
... CAT24C04 Ordering Information Specific Device Marking Device Order Number CAT24C04WI−G 24C04K CAT24C04WI−GT3 24C04K CAT24C04WE−GT3 24C04K CAT24C04YI−G C04K CAT24C04YI−GT3 C04K CAT24C04YE−GT3 C04 CAT24C04VP2I−GT3* C2T CAT24C04LI−G 24C04K CAT24C04LE−G 24C04K CAT24C04ZI−GT3 C2 CAT24C04ZE−GT3 C2 CAT24C04C4ATR ...
Page 21
... For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. 16. For detailed information and a breakdown of device nomenclature and numbering systems, please see the ON Semiconductor Device Nomenclature document, TND310/D, available at www.onsemi.com * The TDFN (VP2) package is not recommended for new designs ...