74HC14BQ-G NXP Semiconductors, 74HC14BQ-G Datasheet
74HC14BQ-G
Specifications of 74HC14BQ-G
Related parts for 74HC14BQ-G
74HC14BQ-G Summary of contents
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Hex inverting Schmitt trigger Rev. 6 — 19 September 2012 1. General description The 74HC14; 74HCT14 is a high-speed Si-gate CMOS device and is pin compatible with Low-power Schottky TTL (LSTTL specified in compliance with JEDEC ...
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... Package Temperature range 40 C to +125 C 74HC14N 74HCT14N 40 C to +125 C 74HC14D 74HCT14D 40 C to +125 C 74HC14DB 74HCT14DB 40 C to +125 C 74HC14PW 74HCT14PW 40 C to +125 C 74HC14BQ 74HCT14BQ 5. Functional diagram ...
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... NXP Semiconductors 6. Pinning information 6.1 Pinning GND 7 Fig 4. Pin configuration DIP14, SO14 and (T)SSOP14 6.2 Pin description Table 2. Pin description Symbol Pin 11 10, 12 GND Functional description [1] Table 3. ...
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... NXP Semiconductors 8. Limiting values Table 4. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V). Symbol Parameter V supply voltage CC I input clamping current IK I output clamping current OK I output current O I supply current CC I ground current ...
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... NXP Semiconductors 10. Static characteristics Table 6. Static characteristics At recommended operating conditions; voltages are referenced to GND (ground = 0 V). Symbol Parameter Conditions 74HC14 V HIGH-level output voltage = 20 20 20 4.0 mA 5.2 mA LOW-level ...
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... NXP Semiconductors 11. Dynamic characteristics Table 7. Dynamic characteristics GND = pF; for test circuit see L Symbol Parameter Conditions 74HC14 t propagation delay nA to nY; see transition time see power dissipation per package capacitance 74HCT14 t propagation delay nA to nY; see ...
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... NXP Semiconductors 12. Waveforms Measurement points are given in V and V are typical voltage output levels that occur with the output load Fig 6. Input to output propagation delays Table 8. Measurement points Type Input V M 74HC14 0.5V CC 74HCT14 1.3 V Test data is given in Table Definitions test circuit: ...
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... NXP Semiconductors Table 9. Test data Type Input V I 74HC14 V CC 74HCT14 3.0 V 13. Transfer characteristics Table 10. Transfer characteristics At recommended operating conditions; voltages are referenced to GND (ground = 0 V); see Symbol Parameter Conditions 74HC14 V positive-going threshold voltage negative-going V = 2.0 V T ...
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... NXP Semiconductors (μ 0 Fig 10. Typical 74HC transfer characteristics 74HC_HCT14 Product data sheet mna846 1.2 1.6 2.0 V ( (mA) 0.8 0.6 0.4 0 1.2 2.4 3.6 All information provided in this document is subject to legal disclaimers. Rev. 6 — 19 September 2012 74HC14; 74HCT14 Hex inverting Schmitt trigger 1 ...
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... NXP Semiconductors 1 (mA) 1.2 0.9 0 Fig 11. Typical 74HCT transfer characteristics 15. Application information The slow input rise and fall times cause additional power dissipation, this can be calculated using the following formula add P = additional power dissipation (W); add f = input frequency (MHz); ...
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... NXP Semiconductors (1) Positive-going edge. (2) Negative-going edge. Fig 12. Average additional supply current as a function (1) Positive-going edge. (2) Negative-going edge. Fig 13. Average additional supply current as a function 0. 74HC_HCT14 Product data sheet 400 I CC(AV) (μA) 300 200 positive - going edge 100 ...
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... NXP Semiconductors For 74HC14 and 74HCT14: For K-factor see Figure 15 Fig 14. Relaxation oscillator . K-factor for 74HC14 Fig 15. Typical K-factor for relaxation oscillator 74HC_HCT14 Product data sheet R C mna035 1 1 ----------------- - f = DDD . 9 9 && All information provided in this document is subject to legal disclaimers. ...
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... NXP Semiconductors 16. Package outline DIP14: plastic dual in-line package; 14 leads (300 mil pin 1 index 1 DIMENSIONS (inch dimensions are derived from the original mm dimensions UNIT max. min. max. mm 4.2 0.51 3.2 inches 0.17 0.02 0.13 Note 1. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included. ...
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... NXP Semiconductors SO14: plastic small outline package; 14 leads; body width 3 pin 1 index 1 e DIMENSIONS (inch dimensions are derived from the original mm dimensions) A UNIT max. 0.25 1.45 mm 1.75 0.25 0.10 1.25 0.010 0.057 inches 0.069 0.01 0.004 0.049 Note 1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included. ...
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... NXP Semiconductors SSOP14: plastic shrink small outline package; 14 leads; body width 5 pin 1 index 1 e DIMENSIONS (mm are the original dimensions) A UNIT max. 0.21 1. 0.25 0.05 1.65 Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION IEC SOT337-1 Fig 18 ...
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... NXP Semiconductors TSSOP14: plastic thin shrink small outline package; 14 leads; body width 4 pin 1 index 1 e DIMENSIONS (mm are the original dimensions) A UNIT max. 0.15 0.95 mm 1.1 0.25 0.05 0.80 Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic interlead protrusions of 0.25 mm maximum per side are not included. ...
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... NXP Semiconductors DHVQFN14: plastic dual in-line compatible thermal enhanced very thin quad flat package; no leads; 14 terminals; body 2 0.85 mm terminal 1 index area terminal 1 index area DIMENSIONS (mm are the original dimensions) (1) A UNIT max. 0.05 0. 0.2 0.00 0.18 Note 1. Plastic or metal protrusions of 0.075 mm maximum per side are not included. ...
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... NXP Semiconductors 17. Abbreviations Table 11. Abbreviations Acronym Description CMOS Complementary Metal-Oxide Semiconductor DUT Device Under Test ESD ElectroStatic Discharge HBM Human Body Model LSTTL Low-power Schottky Transistor-Transistor Logic MM Machine Model 18. Revision history Table 12. Revision history Document ID Release date 74HC_HCT14 v.6 20120919 • Modifications: Figure 15 74HC_HCT14 v ...
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... Terms and conditions of commercial sale of NXP Semiconductors. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice ...
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... Product data sheet NXP Semiconductors’ specifications such use shall be solely at customer’s own risk, and (c) customer fully indemnifies NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors’ ...
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... NXP Semiconductors 21. Contents 1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 4 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 5 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2 6 Pinning information . . . . . . . . . . . . . . . . . . . . . . 3 6.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 6.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3 7 Functional description . . . . . . . . . . . . . . . . . . . 3 8 Limiting values Recommended operating conditions Static characteristics Dynamic characteristics . . . . . . . . . . . . . . . . . . 6 12 Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 13 Transfer characteristics ...