BD30IC0WEFJ-E2 ROHM Semiconductor, BD30IC0WEFJ-E2 Datasheet

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BD30IC0WEFJ-E2

Manufacturer Part Number
BD30IC0WEFJ-E2
Description
Low Dropout Controllers - LDO LDO Reg Pos 3.0V 1A
Manufacturer
ROHM Semiconductor
Datasheet
1.BD30IC0WEFJ-E2.pdf (26 pages)

Specifications of BD30IC0WEFJ-E2

Rohs
yes
Input Voltage Max
5.5 V
Output Voltage
3 V
Output Current
1 A
Load Regulation
75 mV
Output Type
Fixed
Number Of Outputs
1
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
Package / Case
HTSOP-8
Input Voltage Min
2.4 V
Maximum Power Dissipation
2110 mW
Minimum Operating Temperature
- 25 C
1A Variable / Fixed Output
LDO Regulator
●General Description
●Features
●Key Specifications
●Typical Application Circuit
○Product structure：Silicon monolithic integrated circuit ○This product is not designed protection against radioactive rays.
TSZ22111･14･001
www.rohm.com
© 2012 ROHM Co., Ltd. All rights reserved.
BDxxIC0WEFJ / BDxxIC0WHFV
■ Input Power Supply Voltage range:
■ Output Voltage range(Variable type):
■ Output Voltage(Fixed type):
■ Output Current:
■ Shutdown Current:
■ Operating Temperature Range:
BDxxIC0W series are a LDO regulator with output current 1.0A. The output accuracy is ±1% of output voltage. With
external resistance, it is available to set the output voltage at random (from 0.8V to 4.5V) and also provides output voltage
fixed type without external resistance. It is used for the wide applications of digital appliances. It has package type:
HTSOP-J8 and HVSOF6. Over current protection (for protecting the IC destruction by output short circuit), circuit current
ON/OFF switch (for setting the circuit 0µA at shutdown mode), and thermal shutdown circuit (for protecting IC from heat
destruction by over load condition) are all built in. It is usable for ceramic capacitor and enables to improve smaller set and
long-life.
C
High accuracy reference voltage circuit
Built-in Over Current Protection circuit (OCP)
Built-in Thermal Shut Down circuit (TSD)
With shut down switch
IN
Output voltage variable type
V
EN
CC
GND
(1.25V/2.6V:HVSOF6 only)
FIN
1.8V/2.5V/2.6V/3.0V/3.3V
1.0V/1.2V/1.25V/1.5V
V
FB
C
O
IN
,C
OUT
R
R
: Ceramic Capacitor
2.4V to 5.5V
-25 to +85℃
1
2
0.8V to 4.5V
1.0A (Max.)
0 µA (Typ.)
C
OUT
1/23
●Package
C
IN
HTSOP-J8
HVSOF6
V
EN
Output voltage fixed type
CC
GND
TSZ02201-0R6R0A600160-1-2
HTSOP-J8
HVSOF6
BD30IC0WEFJ
FIN
4.90mm x 6.00mm x 1.00mm
1.60mm x 3.00mm x 0.75mm
(Typ.)
V
V
O_S
O
C
Datasheet
6.July.2012 Rev.001
IN
,C
OUT
(Typ.)
: Ceramic Capacitor
C
(Max.)
OUT

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BD30IC0WEFJ-E2 Summary of contents

Page 1

... HVSOF6 2.4V to 5.5V 0.8V to 4.5V 1.0V/1.2V/1.25V/1.5V 1.0A (Max.) 0 µA (Typ.) -25 to +85℃ OUT Ceramic Capacitor IN OUT 1/23 BD30IC0WEFJ Datasheet (Typ.) (Typ.) (Max.) 4.90mm x 6.00mm x 1.00mm 1.60mm x 3.00mm x 0.75mm HTSOP-J8 HVSOF6 O_S EN GND FIN Ceramic Capacitor IN OUT ...

Page 2

BDxxIC0WEFJ / BDxxIC0WHFV ●Ordering Information Part Output Voltage Output Number voltage resistance current 00:Variable I:7V C0:1.0A 10:1.0V 12:1.2V 1C:1.25V 15:1.5V 18:1.8V 25:2.5V 26:2.6V 30:3.0V 33:3.3V www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. ...

Page 3

BDxxIC0WEFJ / BDxxIC0WHFV ●Block Diagram BD00IC0WEFJ / BD00IC0WHFV (Output voltage variable type) EN ●Pin Configuration and Pin Description (HTSOP-J8) Pin No. Pin name 1 V Output pin Feedback pin 3 GND GND pin 4 N.C Non Connection ...

Page 4

BDxxIC0WEFJ / BDxxIC0WHFV ●Block Diagram BDxxIC0WEFJ / BDxxIC0WHFV (Output voltage Fixed type) EN ●Pin Configuration and Pin Description (HTSOP-J8) Pin No. Pin name 1 V Output pin Output voltage monitor pin O_S 3 GND GND pin 4 ...

Page 5

BDxxIC0WEFJ / BDxxIC0WHFV ●Absolute Maximum Ratings (Ta=25℃) Parameter Power supply voltage EN voltage Power dissipation HTSOP-J8 Operating Temperature Range Storage Temperature Range Junction Temperature *1 Not to exceed Pd *2 Reduced by 16.9mW/℃ for each increase 1℃ ...

Page 6

BDxxIC0WEFJ / BDxxIC0WHFV ●Typical Performance Curves (Unless otherwise noted, Ta=25℃, EN=3V Fig.3 Transient Response(0→1.0A) Co=1.0µ Fig.5 Input sequence1 Co=1.0µF www.rohm.com © ...

Page 7

BDxxIC0WEFJ / BDxxIC0WHFV Fig.7 Input sequence2 Co=1.0µF Ta[℃] Fig.9 Ta-V FB www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 Fig.8 OFF sequence 2 Co=1.0µF Ta[℃] Fig.10 ...

Page 8

BDxxIC0WEFJ / BDxxIC0WHFV Ta[℃] Fig.11 Ta [V] CC Fig. STB EN www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 =0V) 8/23 Datasheet Ta[℃] Fig.12 Ta-I (V =0V) STB EN Ta[℃] Fig.14 Ta-I ...

Page 9

BDxxIC0WEFJ / BDxxIC0WHFV I [A] O Fig. =1.2V [A] O Fig. =1.8V www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 I [A] O Fig.16 I ...

Page 10

BDxxIC0WEFJ / BDxxIC0WHFV I [A] O Fig. =3.3V Ta[℃] Fig.21 TSD (I =0A) O www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 V CC Fig. [A] O ...

Page 11

BDxxIC0WEFJ / BDxxIC0WHFV I [A] O Fig.23 OCP (V =5V, V =2.5V [A] O Fig.25 OCP (V =5V www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 I [A] O Fig.24 ...

Page 12

BDxxIC0WEFJ / BDxxIC0WHFV I [A] O Fig.27 OCP (V =3.3V, V =2.5V [A] O Fig.29 OCP (V =3.3V www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 I [A] O Fig.28 ...

Page 13

BDxxIC0WEFJ / BDxxIC0WHFV I [A] O Fig.31 ESR-IO characteristics (Co=2.2µF) Fig.33 PSRR(I =0A) O www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 I [A] O Fig. Ta[℃] Fig.34 Minimum dropout Voltage 1 (V =3.3V, I ...

Page 14

BDxxIC0WEFJ / BDxxIC0WHFV I [A] O Fig.35 Minimum dropout Voltage2 (V =2.4V [A] O Fig.37 Minimum dropout Voltage4 (V =5.0V) CC www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 I [A] O Fig.36 Minimum dropout Voltage3 ...

Page 15

BDxxIC0WEFJ / BDxxIC0WHFV ●Power Dissipation ◎HTSOP-J8 4.0 ⑤3.76W 3.0 ④2.11W 2.0 ③1.10W 1.0 ②0.82W ①0.50W ①0.50W Ambient Temperature :Ta [℃] 周囲温度:Ta [℃] ◎HVSOF6 4.0 3.0 2.0 ③1.7W ②1.4W 1.0 ①0.85W 0 Ambient Tempera ...

Page 16

BDxxIC0WEFJ / BDxxIC0WHFV Thermal design should allow operation within the following conditions. Note that the temperatures listed are the allowed temperature limits, and thermal design should allow sufficient margin from the limits. 1. Ambient temperature Ta can be no higher ...

Page 17

BDxxIC0WEFJ / BDxxIC0WHFV ●Input-to-Output Capacitor It is recommended that a capacitor (over 1uF) is placed nearby pin between Input pin and GND, output pin and GND. A capacitor, between input pin and GND, is valid when the power supply impedance ...

Page 18

BDxxIC0WEFJ / BDxxIC0WHFV ●Evaluation Board Circuit ●Evaluation Board Parts List Designation Value Part No. R1 16kΩ MCR01PZPZF1602 R2 7.5kΩ MCR01PZPZF7501 ‐ ‐ R3 ‐ ‐ R4 ‐ ‐ R5 ‐ ‐ 1µF CM105B105K16A ...

Page 19

BDxxIC0WEFJ / BDxxIC0WHFV ●I/O Equivalent Circuits (Variable type：BD00IC0WEFJ) 8pin 1pin 8pin(V CC 1pn ●I/O Equivalent Circuits (Fixed type：BDxxIC0WEFJ) 8pin 1pin 8pin(V 1pin(V ●I/O Equivalent Circuits (Variable type：BD00IC0WHFV) 6pin(V ...

Page 20

BDxxIC0WEFJ / BDxxIC0WHFV ●Operational Notes (1) Absolute maximum ratings An excess in the absolute maximum ratings, such as supply voltage, temperature range of operating conditions, etc., can break down the devices, thus making impossible to identify breaking mode, such as ...

Page 21

BDxxIC0WEFJ / BDxxIC0WHFV (11)Testing on application boards When testing the application board, connecting a capacitor to a pin with low impedance subjects the IC to stress. Always discharge capacitors after each process or step. Always turn the ...

Page 22

... Order quantity needs to be multiple of the minimum quantity. 1pin Direction of feed ∗ Order quantity needs to be multiple of the minimum quantity. Product Name BD00IC0WEFJ BD10IC0WEFJ BD12IC0WEFJ BD15IC0WEFJ BD18IC0WEFJ BD25IC0WEFJ BD30IC0WEFJ BD33IC0WEFJ Product Name BD00IC0WHFV BD10IC0WHFV BD12IC0WHFV BD1CIC0WHFV BD15IC0WHFV BD18IC0WHFV BD25IC0WHFV BD26IC0WHFV BD30IC0WHFV ...

Page 23

BDxxIC0WEFJ / BDxxIC0WHFV ●Revision History Date Revision 6.July.2012 001 New Release www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 Changes TSZ02201-0R6R0A600160-1-2 23/23 Datasheet 6.July.2012 Rev.001 ...

Page 24

Precaution 1) Before you use our Products, you are requested to carefully read this document and fully understand its contents. ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use ...

Page 25

Mounting / Circuit board design 1) When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability principle, the reflow soldering method must be used; ...

Page 26

Precaution 1) The information contained in this document is provided on an “as is” basis and ROHM does not warrant that all information contained in this document is accurate and/or error-free. ROHM shall not be in any way responsible ...

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