74ABT574APW-T NXP Semiconductors, 74ABT574APW-T Datasheet
74ABT574APW-T
Specifications of 74ABT574APW-T
Related parts for 74ABT574APW-T
74ABT574APW-T Summary of contents
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Octal D-type flip-flop; 3-state Rev. 2 — 23 November 2012 1. General description The 74ABT574A high-performance BiCMOS device combines low static and dynamic power dissipation with high speed and high output drive. The 74ABT574A is an 8-bit, edge triggered ...
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... NXP Semiconductors 3. Ordering information Table 1. Ordering information Type number Package Temperature range Name 40 C to +85 C 74ABT574AN 40 C to +85 C 74ABT574AD 40 C to +85 C 74ABT574ADB 74ABT574APW 40 C to +85 C 4. Functional diagram ...
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... NXP Semiconductors 5. Pinning information 5.1 Pinning $%7$ *1' DDD Fig 4. Pin configuration DIP20 and SO20 5.2 Pin description Table 2. Pin description Symbol OE D0, D1, D2, D3, D4, D5, D6, D7 GND CP Q0, Q1, Q2, Q3, Q4, Q5, Q6 74ABT574A Product data sheet 9 && &3 Fig 5. ...
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... NXP Semiconductors 6. Functional description [1] Table 3. Function table Operating mode Load and read register Load register and disable output [ HIGH voltage level HIGH voltage level one setup time before the HIGH-to-LOW CP transition LOW voltage level LOW voltage level one setup time before the HIGH-to-LOW CP transition; ...
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... NXP Semiconductors Table 5. Operating conditions Voltages are referenced to GND (ground = 0 V). Symbol Parameter I LOW-level output current OL t/V input transition rise and fall rate T ambient temperature amb 9. Static characteristics Table 6. Static characteristics Symbol Parameter V input clamping voltage HIGH-level output OH voltage ...
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... NXP Semiconductors Table 6. Static characteristics Symbol Parameter C input capacitance I C output capacitance O [1] For valid test results, do not load data into the flip-flops (or latches) after applying the power. [2] This parameter is valid for any V permitted between V = 2.1 V and V CC [3] Do not test more than one output at a time, and the duration of the test must not exceed one second. ...
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... NXP Semiconductors 11. Waveforms CP input Qn output and V are typical voltage output levels that occur with the output load Fig 6. Propagation delay clock input (CP) to output (Qn), clock pulse (CP) width and maximum clock (CP) frequency Dn input CP input The shaded areas indicate when the input is permitted to change for predictable output performance. ...
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... NXP Semiconductors OE input Qn output Qn output and V are typical voltage output levels that occur with the output load OL OH Fig 8. 3-state output (Qn) enable and disable times negative V M pulse positive V M pulse Input pulse definition ...
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... NXP Semiconductors 12. Package outline DIP20: plastic dual in-line package; 20 leads (300 mil pin 1 index 1 DIMENSIONS (inch dimensions are derived from the original mm dimensions UNIT max. min. max. mm 4.2 0.51 3.2 inches 0.17 0.02 0.13 Note 1. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included. ...
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... NXP Semiconductors SO20: plastic small outline package; 20 leads; body width 7 pin 1 index 1 e DIMENSIONS (inch dimensions are derived from the original mm dimensions) A UNIT max. 0.3 2.45 mm 2.65 0.25 0.1 2.25 0.012 0.096 inches 0.1 0.01 0.004 0.089 Note 1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included. ...
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... NXP Semiconductors SSOP20: plastic shrink small outline package; 20 leads; body width 5 pin 1 index 1 e DIMENSIONS (mm are the original dimensions) A UNIT max. 0.21 1. 0.25 0.05 1.65 Note 1. Plastic or metal protrusions of 0.2 mm maximum per side are not included. OUTLINE VERSION IEC SOT339-1 Fig 12 ...
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... NXP Semiconductors TSSOP20: plastic thin shrink small outline package; 20 leads; body width 4 pin 1 index 1 DIMENSIONS (mm are the original dimensions) A UNIT max. 0.15 0.95 mm 1.1 0.25 0.05 0.80 Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic interlead protrusions of 0.25 mm maximum per side are not included. ...
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... Document ID Release date 74ABT574A v.2 20121123 • Modifications: The format of this data sheet has been redesigned to comply with the new identity guidelines of NXP Semiconductors. • Legal texts have been adapted to the new company name where appropriate. 74ABT574A v.1 19950522 74ABT574A Product data sheet ...
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... Terms and conditions of commercial sale of NXP Semiconductors. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice ...
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... Product data sheet NXP Semiconductors’ specifications such use shall be solely at customer’s own risk, and (c) customer fully indemnifies NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors’ ...
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... NXP Semiconductors 17. Contents 1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 3 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 4 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2 5 Pinning information . . . . . . . . . . . . . . . . . . . . . . 3 5.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 5.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3 6 Functional description . . . . . . . . . . . . . . . . . . . 4 7 Limiting values Recommended operating conditions Static characteristics Dynamic characteristics . . . . . . . . . . . . . . . . . . 6 11 Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 12 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 9 13 Abbreviations ...