IS42S16160D-7TL ISSI, Integrated Silicon Solution Inc, IS42S16160D-7TL Datasheet

IC SDRAM 256MBIT 143MHZ 54TSOP

IS42S16160D-7TL

Manufacturer Part Number
IS42S16160D-7TL
Description
IC SDRAM 256MBIT 143MHZ 54TSOP
Manufacturer
ISSI, Integrated Silicon Solution Inc
Type
SDRAMr
Datasheets

Specifications of IS42S16160D-7TL

Package / Case
54-TSOP II
Memory Size
256M (16Mx16)
Format - Memory
RAM
Memory Type
SDRAM
Speed
143MHz
Interface
Parallel
Voltage - Supply
3 V ~ 3.6 V
Operating Temperature
0°C ~ 70°C
Data Bus Width
16 bit
Maximum Clock Frequency
143 MHz
Access Time
6.5 ns, 5.4 ns
Supply Voltage (max)
3.6 V
Supply Voltage (min)
3 V
Maximum Operating Current
130 mA
Maximum Operating Temperature
+ 70 C
Minimum Operating Temperature
0 C
Mounting Style
SMD/SMT
Organization
16Mx16
Density
256Mb
Address Bus
15b
Access Time (max)
6.5/5.4ns
Maximum Clock Rate
143MHz
Operating Supply Voltage (typ)
3.3V
Package Type
TSOP-II
Operating Temp Range
0C to 70C
Operating Supply Voltage (max)
3.6V
Operating Supply Voltage (min)
3V
Supply Current
130mA
Pin Count
54
Mounting
Surface Mount
Operating Temperature Classification
Commercial
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
Other names
706-1074
IS42S16160D-7TL

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IS42S83200D
IS42S16160D
32Meg x 8, 16Meg x16
256-MBIT SYNCHRONOUS DRAM
FEATURES
• Clock frequency: 166, 143 MHz
• Fully synchronous; all signals referenced to a
• Internal bank for hiding row access/precharge
• Power supply
• LVTTL interface
• Programmable burst length
• Programmable burst sequence:
• Auto Refresh (CBR)
• Self Refresh
• 8K refresh cycles every 64 ms
• Random column address every clock cycle
• Programmable CAS latency (2, 3 clocks)
• Burst read/write and burst read/single write
• Burst termination by burst stop and precharge
• Available in Industrial Temperature
• Available in 54-pin TSOP-II and 54-ball BGA
• Available in Lead-free
• Power Down and Deep Power Down Mode
• Partial Array Self Refresh
• Temperature Compensated Selection
• Output Driver Strength Selection
Integrated Silicon Solution, Inc. — www.issi.com
Rev. 00D
12/12/07
Copyright © 2006 Integrated Silicon Solution, Inc. All rights reserved. ISSI reserves the right to make changes to this specification and its products at any time with-
out notice. ISSI assumes no liability arising out of the application or use of any information, products or services described herein. Customers are advised to obtain
the latest version of this device specification before relying on any published information and before placing orders for products.
positive clock edge
IS42S83200D
IS42S16160D
– (1, 2, 4, 8, full page)
Sequential/Interleave
operations capability
command
(x16 only)
Please contact Product Manager for mobile
function detail.
V
3.3V 3.3V
3.3V 3.3V
dd
V
ddq
KEY TIMING PARAMETERS
OVERVIEW
ISSI
data transfer using pipeline architecture. All inputs and
outputs signals refer to the rising edge of the clock input.
The 256Mb SDRAM is organized as follows.
IS42S83200D
8M x 8 x 4 Banks 4M x16x4 Banks
54-pin TSOPII
Parameter
Clk Cycle Time
Clk Frequency
Access Time from Clock
CAS Latency = 3
CAS Latency = 2
CAS Latency = 3
CAS Latency = 2
CAS Latency = 3
CAS Latency = 2
's 256Mb Synchronous DRAM achieves high-speed
PRELIMINARY INFORMATION
IS42S16160D
54-pin TSOPII
54-ball BGA
DECEMBER 2007
166
125
5.4
6.5
-6
6
8
143
100
5.4
6.5
-7
10
7
-75E Unit
133
7.5
6.5
Mhz
Mhz
ns
ns
ns
ns
1

Related parts for IS42S16160D-7TL

IS42S16160D-7TL Summary of contents

Page 1

... Synchronous DRAM achieves high-speed data transfer using pipeline architecture. All inputs and outputs signals refer to the rising edge of the clock input. The 256Mb SDRAM is organized as follows. IS42S83200D IS42S16160D Banks 4M x16x4 Banks 54-pin TSOPII 54-pin TSOPII 54-ball BGA KEY TIMING PARAMETERS ...

Page 2

... IS42S83200D, IS42S16160D DEVICE OVERVIEW The 256Mb SDRAM is a high speed CMOS, dynamic random-access memory designed to operate in 3.3V V and 3.3V V memory systems containing 268,435,456 ddq bits. Internally configured as a quad-bank DRAM with a synchronous interface. Each 67,108,864-bit bank is orga- nized as 8,192 rows by 512 columns by 16 bits or 8,192 rows by 1,024 columns by 8 bits ...

Page 3

... IS42S83200D, IS42S16160D PIN CONFIGURATIONS 54 pin TSOP - Type II for x8 PIN DESCRIPTIONS A0-A12 Row Address Input A0-A9 Column Address Input BA0, BA1 Bank Select Address DQ0 to DQ7 Data I/O CLK System Clock Input CKE Clock Enable Chip Select CS RAS Row Address Strobe Command ...

Page 4

... IS42S83200D, IS42S16160D PIN CONFIGURATIONS 54 pin TSOP - Type II for x16 PIN DESCRIPTIONS A0-A12 Row Address Input A0-A8 Column Address Input BA0, BA1 Bank Select Address DQ0 to DQ15 Data I/O CLK System Clock Input CKE Clock Enable CS Chip Select RAS Row Address Strobe Command ...

Page 5

... IS42S83200D, IS42S16160D PIN CONFIGURATION 54-ball fBGA for x16 (Top View) (8. 13.00 mm Body, 0.8 mm Ball Pitch) package code DQMH PIN DESCRIPTIONS A0-A12 Row Address Input A0-A8 Column Address Input BA0, BA1 Bank Select Address DQ0 to DQ15 Data I/O CLK System Clock Input ...

Page 6

... When DQML or DQMH is LOW, the corresponding buffer byte is enabled, and data can be written to the device. WhenDQML or DQMH is HIGH, input data is masked and cannot be written to the device. For IS42S16160D only. For IS42S83200D only. Data on the Data Bus is latched on DQ pins during Write commands, and buffered for output after Read commands. RAS, in conjunction with CAS and WE, forms the device command. See the " ...

Page 7

... IS42S83200D, IS42S16160D GENERAL DESCRIPTION READ The READ command selects the bank from BA0, BA1 inputs and starts a burst read access to an active row. Inputs A0- A9 (x8); A0-A8 (x16) provides the starting column location. When A10 is HIGH, this command functions as an AUTO PRECHARGE command. When the auto precharge is selected, the row being accessed will be precharged at the end of the READ burst ...

Page 8

... IS42S83200D, IS42S16160D COMMAND TRUTH TABLE CKE Function n – 1 Device deselect (DESL operation (NOP) Burst stop (BST) H Read H Read with auto precharge H Write H Write with auto precharge H Bank activate (ACT) H Precharge select bank (PRE) H Precharge all banks (PALL) H CBR Auto-Refresh (REF) H Self-Refresh (SELF) ...

Page 9

... IS42S83200D, IS42S16160D CKE TRUTH TABLE Current State /Function Activating Clock suspend mode entry Any Clock suspend mode Clock suspend mode exit Auto refresh command Idle (REF) Self refresh entry Idle (SELF) Power down entry Idle Self refresh exit Power down exit ...

Page 10

... IS42S83200D, IS42S16160D FUNCTIONAL TRUTH TABLE Current State CS RAS CAS Idle Row Active Read Write Note: H Valid Data, BA= Bank Address, CA+Column Address, RA=Row Address, OC= Op-Code Address Command DESL H X NOP L X BST H BA, CA, A10 READ/READA L A, CA, A10 WRIT/ WRITA H BA, RA ACT ...

Page 11

... IS42S83200D, IS42S16160D FUNCTIONAL TRUTH TABLE Continued: Current State CS RAS CAS Read with auto H × × Precharging Write with Auto H × × Precharge Precharging H × × Row Activating H × × Note: H Valid Data, BA= Bank Address, CA+Column Address, RA=Row Address, OC= Op-Code ih il ...

Page 12

... IS42S83200D, IS42S16160D FUNCTIONAL TRUTH TABLE Continued: Current State CS RAS CAS Write Recovering H × × Write Recovering H × × with Auto Precharge Refresh H × × Mode Register H × × Accessing × Note: H Valid Data, BA= Bank Address, CA+Column Address, RA=Row Address, OC= Op-Code ...

Page 13

... IS42S83200D, IS42S16160D CKE RELATED COMMAND TRUTH TABLE Current State Operation Self-Refresh (S.R.) INVALID, CLK ( would exit S.R. Self-Refresh Recovery Self-Refresh Recovery Illegal Illegal Maintain S.R. Self-Refresh Recovery Idle After t rc Idle After t rc Illegal Illegal Begin clock suspend next cycle Begin clock suspend next cycle ...

Page 14

... IS42S83200D, IS42S16160D STATE DIAGRAM Mode Register Set Write CKE WRITE WRITE SUSPEND CKE CKE WRITEA WRITEA SUSPEND CKE Precharge POWER ON 14 SELF SELF exit MRS IDLE CKE CKE ACT CKE Row Active CKE BST BST Read Write Read Write Precharge Integrated Silicon Solution, Inc. — www.issi.com ...

Page 15

... IS42S83200D, IS42S16160D ABSOLUTE MAXIMUM RATINGS Symbol Parameters V Maximum Supply Voltage dd max V Maximum Supply Voltage for Output Buffer ddq max V Input Voltage in V Output Voltage out P Allowable Power Dissipation d max I output Shorted Current cs T operating Temperature opr T Storage Temperature stg Notes: 1. Stress greater than those listed under ABSOLUTE MAXIMUM RATINGS may cause permanent damage to the device ...

Page 16

... IS42S83200D, IS42S16160D DC ELECTRICAL CHARACTERISTICS 1 Symbol Parameter i Operating Current (1) dd1 i Precharge Standby Current dd2p (In Power-Down Mode) i Precharge Standby Current dd2ps (In Power-Down Mode) i Precharge Standby Current (2) dd2n (In Non Power-Down Mode) I Precharge Standby Current dd2ns (In Non Power-Down Mode) i Active Standby Current (2) dd3n (In Non Power-Down Mode) ...

Page 17

... IS42S83200D, IS42S16160D AC ELECTRICAL CHARACTERISTICS Symbol Parameter t Clock Cycle Time ck3 t ck2 t Access Time From CLK ac3 t ac2 t CLK HIGH Level Width chi t CLK LOW Level Width cl t Output Data Hold Time oh3 t oh2 t Output LOW Impedance Time lz t Output HIGH Impedance Time ...

Page 18

... IS42S83200D, IS42S16160D OPERATING FREQUENCY / LATENCY RELATIONSHIPS SYMBOL PARAMETER — Clock Cycle Time — Operating Frequency (CAS Latency = 3) t CAS Latency cac t Active Command To Read/Write Command Delay Time rcd t RAS Latency ( rac rcd cac t Command Period (REF to REF / ACT to ACT Command Period (ACT to PRE) ...

Page 19

... IS42S83200D, IS42S16160D AC TEST CONDITIONS Input Load t CHI 3.0V 1.4V CLK 3.0V INPUT 1. OUTPUT 1.4V AC TEST CONDITIONS Parameter AC Input Levels Input Rise and Fall Times Input Timing Reference Level Output Timing Measurement Reference Level Integrated Silicon Solution, Inc. — www.issi.com Rev. 00D ...

Page 20

... IS42S83200D, IS42S16160D FUNCTIONAL DESCRIPTION The 256Mb SDRAMs are quad-bank DRAMs which operate at 3.3V and include a synchronous interface (all signals are registered on the positive edge of the clock signal, CLK). Each of the 67,108,864-bit banks is organized as 8,192 rows by 512 columns by 16 bits or 8,192 rows by 1,024 columns by 8 bits. Read and write accesses to the SDRAM are burst oriented ...

Page 21

... IS42S83200D, IS42S16160D INITIALIzE AND LOAD MODE REGISTER CLK CKS CKH CKE CMH CMS CMH CMS COMMAND NOP PRECHARGE DQM/ DQML, DQMH A0-A9, A11, A12 ALL BANKS A10 SINGLE BANK BA0, BA1 ALL BANKS Power-up: V Precharge CC and CLK stable all banks T = 200µs Min. ...

Page 22

... IS42S83200D, IS42S16160D AUTO-REFRESH CYCLE T0 CLK t t CKS CKH CKE t t CMS CMH COMMAND PRECHARGE DQM/ DQML, DQMH A0-A9, A11, A12 ALL BANKS A10 SINGLE BANK BA0, BA1 BANK ( High-Z Notes: 1. CAS latency = Auto NOP NOP Refresh Integrated Silicon Solution, Inc. — www.issi.com ...

Page 23

... IS42S83200D, IS42S16160D SELF-REFRESH CYCLE T0 t CLK CKS CKH CKE t t CMS CMH COMMAND PRECHARGE DQM/ DQML, DQMH A0-A9, A11, A12 ALL BANKS A10 SINGLE BANK BA0, BA1 BANK High-Z DQ Precharge all active banks Integrated Silicon Solution, Inc. — www.issi.com Rev. 00D ...

Page 24

... IS42S83200D, IS42S16160D REGISTER DEFINITION Mode Register The mode register is used to define the specific mode of operation of the SDRAM. This definition includes the selection of a burst length, a burst type, a CAS latency, an operating mode and a write burst mode, as shown in MODE REGISTER DEFINITION. The mode register is programmed via the LOAD MODE REGISTER command and will retain the stored information until it is programmed again or the device loses power ...

Page 25

... IS42S83200D, IS42S16160D BURST LENGTH Read and write accesses to the SDRAM are burst oriented, with the burst length being programmable, as shown in MODE REGISTER DEFINITION. The burst length deter- mines the maximum number of column locations that can be accessed for a given READ or WRITE command. Burst ...

Page 26

... IS42S83200D, IS42S16160D CAS Latency The CAS latency is the delay, in clock cycles, between the registration of a READ command and the availability of the first piece of output data. The latency can be set to two or three clocks READ command is registered at clock edge n, and the latency is m clocks, the data will be available by clock edge ...

Page 27

... IS42S83200D, IS42S16160D CHIP OPERATION BANK/ROW ACTIVATION Before any READ or WRITE commands can be issued to a bank within the SDRAM, a row in that bank must be “opened.” This is accomplished via the ACTIVE command, which selects both the bank and the row to be activated (see Activating Specific Row Within Specific Bank). ...

Page 28

... IS42S83200D, IS42S16160D READS READ bursts are initiated with a READ command, as shown in the READ COMMAND diagram. The starting column and bank addresses are provided with the READ command, and auto precharge is either enabled or disabled for that burst access. If auto precharge is enabled, the row being accessed is precharged at the completion of the burst ...

Page 29

... IS42S83200D, IS42S16160D diagram for each possible CAS latency; data element either the last of a burst of four or the last desired of a longer burst. Following the PRECHARGE command, a subsequent command to the same bank cannot be issued until t is met. Note that part of the row precharge time is rp hidden during the access of the last data element(s) ...

Page 30

... IS42S83200D, IS42S16160D RW1 - READ to WRITE T0 CLK DQM COMMAND READ BANK, ADDRESS COL n DQ CAS Latency - 2 RW2 - READ to WRITE T0 CLK DQM COMMAND READ BANK, ADDRESS COL NOP NOP NOP NOP n+1 D n+2 OUT OUT OUT NOP NOP NOP OUT CAS Latency - 3 Integrated Silicon Solution, Inc. — www.issi.com ...

Page 31

... IS42S83200D, IS42S16160D CONSECUTIVE READ BURSTS T0 CLK COMMAND READ BANK, ADDRESS COL n DQ CAS Latency - CLK COMMAND READ NOP BANK, ADDRESS COL n DQ CAS Latency - 3 Integrated Silicon Solution, Inc. — www.issi.com Rev. 00D 12/12/ NOP NOP NOP READ BANK, COL n+1 D OUT ...

Page 32

... IS42S83200D, IS42S16160D RANDOM READ ACCESSES T0 CLK COMMAND READ BANK, ADDRESS COL CLK COMMAND READ BANK, ADDRESS COL n DQ CAS Latency - READ READ READ BANK, BANK, BANK, COL b COL m COL OUT OUT CAS Latency - READ READ READ NOP BANK, BANK, BANK, COL b ...

Page 33

... IS42S83200D, IS42S16160D READ BURST TERMINATION T0 CLK COMMAND READ BANK a, ADDRESS COL n DQ CAS Latency - CLK COMMAND READ NOP BANK, ADDRESS COL n DQ CAS Latency - 3 Integrated Silicon Solution, Inc. — www.issi.com Rev. 00D 12/12/ BURST NOP NOP NOP TERMINATE n+1 D OUT OUT ...

Page 34

... IS42S83200D, IS42S16160D ALTERNATING BANK READ ACCESSES CLK CKS CKH CKE t t CMS CMH COMMAND ACTIVE NOP DQM/ DQML, DQMH A0-A9, A11, A12 ROW ENABLE AUTO PRECHARGE A10 ROW BA0, BA1 BANK BANK 0 RCD t RRD t - BANK 0 RAS t - BANK 0 RC Notes: 1) CAS latency = 2, Burst Length = 4 2) x16: A9, A11, and A12 = " ...

Page 35

... IS42S83200D, IS42S16160D READ - FULL-PAGE BURST CLK CKS CKH CKE t t CMS CMH COMMAND ACTIVE NOP t CMS DQM/ DQML, DQMH A0-A9, A11, A12 ROW COLUMN A10 ROW BA0, BA1 BANK DQ t RCD Notes: 1) CAS latency = 2, Burst Length = Full Page 2) x16: A9, A11, and A12 = "Don't Care" ...

Page 36

... IS42S83200D, IS42S16160D READ - DQM OPERATION CLK CKS CKH CKE t t CMS CMH COMMAND ACTIVE NOP DQM/ DQML, DQMH A0-A9, A11, A12 ROW ENABLE AUTO PRECHARGE A10 ROW DISABLE AUTO PRECHARGE BA0, BA1 BANK DQ t RCD Notes: 1) CAS latency = 2, Burst Length = 4 2) x16: A9, A11, and A12 = "Don't Care" ...

Page 37

... IS42S83200D, IS42S16160D READ to PRECHARGE T0 T1 CLK COMMAND READ NOP BANK a, ADDRESS COL n DQ CAS Latency - CLK COMMAND READ NOP BANK, ADDRESS COL n DQ CAS Latency - 3 Integrated Silicon Solution, Inc. — www.issi.com Rev. 00D 12/12/ NOP NOP NOP PRECHARGE BANK (a or all) ...

Page 38

... IS42S83200D, IS42S16160D WRITES WRITE bursts are initiated with a WRITE command, as shown in WRITE Command diagram. WRITE COMMAND CLK HIGH CKE CS RAS CAS WE A0-A9 COLUMN ADDRESS A11, A12 AUTO PRECHARGE A10 NO PRECHARGE BA0, BA1 BANK ADDRESS Note "Don't Care" for x16. The starting column and bank addresses are provided with the WRITE command, and auto precharge is either enabled or disabled for that access ...

Page 39

... IS42S83200D, IS42S16160D WRITE BURST COMMAND ADDRESS WRITE TO WRITE RANDOM WRITE CYCLES COMMAND ADDRESS Integrated Silicon Solution, Inc. — www.issi.com Rev. 00D 12/12/ CLK WRITE NOP NOP BANK, COL n CLK COMMAND WRITE NOP BANK, ADDRESS COL n DON'T CARE CLK WRITE WRITE WRITE ...

Page 40

... IS42S83200D, IS42S16160D WRITE to READ T0 CLK COMMAND WRITE BANK, ADDRESS COL WP1 - WRITE to PRECHARGE T0 CLK DQM COMMAND WRITE BANK a, ADDRESS COL NOP READ NOP BANK, COL b D n+1 IN CAS Latency - NOP NOP PRECHARGE BANK (a or all) t DPL D n Integrated Silicon Solution, Inc. — www.issi.com ...

Page 41

... IS42S83200D, IS42S16160D WP2 - WRITE to PRECHARGE T0 CLK DQM COMMAND WRITE BANK a, ADDRESS COL WRITE Burst Termination COMMAND ADDRESS Integrated Silicon Solution, Inc. — www.issi.com Rev. 00D 12/12/ NOP NOP PRECHARGE BANK (a or all) t DPL D n CLK BURST WRITE TERMINATE COMMAND BANK, (ADDRESS) ...

Page 42

... IS42S83200D, IS42S16160D WRITE - FULL PAGE BURST CLK CKS CKH CKE t t CMS CMH COMMAND ACTIVE NOP DQM/DQML DQMH A0-A9, A11, A12 ROW A10 ROW BA0, BA1 BANK DQ t RCD Notes: 1) Burst Length = Full Page 2) x16: A9, A11, and A12 = "Don't Care" x8: A11 and A12 = "Don't Care" ...

Page 43

... IS42S83200D, IS42S16160D WRITE - DQM OPERATION T0 t CLK CKS CKH CKE t t CMS CMH COMMAND ACTIVE DQM/DQML DQMH A0-A9, A11, A12 ROW A10 ROW BA0, BA1 BANK DQ Notes: 1) Burst Length = 4 2) x16: A9, A11, and A12 = "Don't Care" x8: A11 and A12 = "Don't Care" ...

Page 44

... IS42S83200D, IS42S16160D ALTERNATING BANK WRITE ACCESSES CLK CKS CKH CKE t t CMS CMH COMMAND ACTIVE NOP t CMS DQM/DQML DQMH A0-A9, A11, A12 ROW ENABLE AUTO PRECHARGE A10 ROW BA0, BA1 BANK BANK 0 RCD t RRD t - BANK 0 RAS t - BANK 0 RC Notes: 1) Burst Length = 4 2) x16: A9, A11, and A12 = " ...

Page 45

... IS42S83200D, IS42S16160D CLOCK SUSPEND Clock suspend mode occurs when a column access/burst is in progress and CKE is registered LOW. In the clock suspend mode, the internal clock is deactivated, “freezing” the synchronous logic. For each positive clock edge on which CKE is sampled LOW, the next internal positive clock edge is suspended. ...

Page 46

... IS42S83200D, IS42S16160D CLOCK SUSPEND MODE CLK CKS CKH CKE t t CMS CMH COMMAND READ NOP t t CMS CMH DQM/DQML DQMH A0-A9, A11, A12 COLUMN m ( A10 BA0, BA1 BANK DQ Notes: 1) CAS latency = 3, Burst Length = 2, Auto Precharge is disabled. 2) X16: A9, A11, and A12 = "Don't Care" ...

Page 47

... IS42S83200D, IS42S16160D PRECHARGE The PRECHARGE command (see figure) is used to deac- tivate the open row in a particular bank or the open row in all banks.The bank(s) will be available for a subsequent row access some specified time (t ) after the PRECHARGE rp command is issued. Input A10 determines whether one or ...

Page 48

... IS42S83200D, IS42S16160D POWER-DOWN MODE CYCLE T0 CLK t t CKS CKH CKE t t CMS CMH COMMAND PRECHARGE DQM/DQML DQMH A0-A9, A11, A12 ALL BANKS A10 SINGLE BANK BA0, BA1 BANK High-Z DQ Two clock cycles All banks idle, enter Precharge all active banks power-down mode ...

Page 49

... IS42S83200D, IS42S16160D BURST READ/SINGLE WRITE The burst read/single write mode is entered by programming the write burst mode bit (M9) in the mode register to a logic 1. In this mode, all WRITE commands result in the access of a single column location (burst of one), regardless of the programmed burst length. READ commands access ...

Page 50

... IS42S83200D, IS42S16160D WRITE with Auto Precharge 3. Interrupted by a READ (with or without auto precharge): A READ to bank m will interrupt a WRITE on bank n when registered, with the data-out appearing (CAS latency) later. The PRECHARGE to bank n will begin after t is met, where t begins when the READ to bank m is dpl registered ...

Page 51

... IS42S83200D, IS42S16160D SINGLE READ WITH AUTO PRECHARGE CLK CKS CKH CKE t t CMS CMH COMMAND ACTIVE NOP DQM/DQML DQMH A0-A9, A11, A12 ROW A10 ROW BA0, BA1 BANK DQ t RCD t RAS t RC Notes: 1) CAS latency = 2, Burst Length = 1 2) x16: A9, A11, and A12 = "Don't Care" ...

Page 52

... IS42S83200D, IS42S16160D SINGLE READ WITHOUT AUTO PRECHARGE CLK CKS CKH CKE t t CMS CMH COMMAND ACTIVE NOP DQM/DQML DQMH A0-A9, A11, A12 ROW A10 ROW t t DISABLE AUTO PRECHARGE AS AH BA0, BA1 BANK DQ t RCD t RAS t RC Notes: 1) CAS latency = 2, Burst Length = 1 2) x16: A9, A11, and A12 = " ...

Page 53

... IS42S83200D, IS42S16160D READ WITH AUTO PRECHARGE CLK CKS CKH CKE t t CMS CMH COMMAND ACTIVE NOP DQM/DQML DQMH A0-A9, A11, A12 ROW ENABLE AUTO PRECHARGE A10 ROW BA0, BA1 BANK DQ t RCD t RAS t RC Notes: 1) CAS latency = 2, Burst Length = 4 2) x16: A9, A11, and A12 = "Don't Care" ...

Page 54

... IS42S83200D, IS42S16160D READ WITHOUT AUTO PRECHARGE CLK CKS CKH CKE t t CMS CMH COMMAND ACTIVE NOP DQM/DQML DQMH A0-A9, A11, A12 ROW A10 ROW t t DISABLE AUTO PRECHARGE AS AH BA0, BA1 BANK DQ t RCD t RAS t RC Notes: 1) CAS latency = 2, Burst Length = 4 2) x16: A9, A11, A12 = " ...

Page 55

... IS42S83200D, IS42S16160D SINGLE WRITE WITH AUTO PRECHARGE CLK t t CKS CKH CKE t t CMS CMH ACTIVE NOP COMMAND DQM/DQML, DQMH A0-A9, A11, A12 ROW A10 ROW BA0, BA1 BANK DQ t RCD t RAS t RC Notes: 1) Burst Length = 1 2) x16: A9, A11, and A12 = "Don't Care" ...

Page 56

... IS42S83200D, IS42S16160D SINGLE WRITE - WITHOUT AUTO PRECHARGE CLK CKS CKH CKE t t CMS CMH COMMAND ACTIVE NOP DQM/DQML DQMH A0-A9, A11, A12 ROW DISABLE AUTO PRECHARGE A10 ROW BA0, BA1 BANK DQ t RCD t RAS t RC Notes: 1) Burst Length = 1 2) x16: A9, A11, and A12 = "Don't Care" ...

Page 57

... IS42S83200D, IS42S16160D WRITE - WITH AUTO PRECHARGE CLK CKS CKH CKE t t CMS CMH COMMAND ACTIVE NOP t CMS DQM/DQML DQMH A0-A9, A11, A12 ROW ENABLE AUTO PRECHARGE A10 ROW BA0, BA1 BANK RCD t RAS t RC Notes: 1) Burst Length = 4 2) x16: A9, A11, and A12 = "Don't Care" ...

Page 58

... IS42S83200D, IS42S16160D WRITE - WITHOUT AUTO PRECHARGE CLK CKS CKH CKE t t CMS CMH COMMAND ACTIVE NOP DQM/DQML DQMH A0-A9, A11, A12 ROW A10 ROW t t DISABLE AUTO PRECHARGE AS AH BA0, BA1 BANK DQ t RCD t RAS t RC Notes: 1) Burst Length = 4 2) x16: A9, A11, and A12 = "Don't Care" ...

Page 59

... IS42S16160D-7BL IS42S16160D-7B 133 MHz 7.5 IS42S16160D-75EBL Industrial Range: 40°C to +85°C Frequency Speed (ns) Order Part No. 166 MHz 6 IS42S16160D-6TLI IS42S16160D-6TI 143 MHz 7 IS42S16160D-7TLI IS42S16160D-7TI 133MHz 7.5 IS42S16160D-75ETLI 166 MHz 6 IS42S16160D-6BLI IS42S16160D-6BI 143 MHz 7 IS42S16160D-7BLI IS42S16160D-7BI 133 MHz 7.5 IS42S16160D-75EBLI Please contact Product Manager for Leaded parts support. ...

Page 60

PACKAGING INFORMATION Mini Ball Grid Array Package Code: B (54-Ball SEATING PLANE mBGA - 8mm x 13mm MILLIMETERS Sym. Min. Typ. ...

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PACKAGING INFORMATION Plastic TSOP 54–Pin, 86-Pin Package Code: T (Type II Plastic TSOP (T - Type II) Millimeters Symbol Min Max Ref. Std. No. Leads ( — 1.20 — A1 0.05 0.15 A2 ...

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