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M24256-BWMN6TP
M24256-BWMN6TP | |
|---|---|
| Manufacturer Part Number | M24256-BWMN6TP |
| Description | IC EEPROM 256KBIT 400KHZ 8SOIC |
| Manufacturer | STMicroelectronics |
| M24256-BWMN6TP datasheets |
|
Availability: In stock
International delivery:
Warranty: 60 days
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- We provide standard 60-days warranty for all parts. If warranty differs we always mention it beforehand. In case of return we cover shipping costs.
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Specifications of M24256-BWMN6TP | |||
|---|---|---|---|
| Format - Memory | EEPROMs - Serial | Memory Type | EEPROM |
| Memory Size | 256K (32K x 8) | Speed | 400kHz |
| Interface | I²C, 2-Wire Serial | Voltage - Supply | 2.5 V ~ 5.5 V |
| Operating Temperature | -40°C ~ 85°C | Package / Case | 8-SOIC (3.9mm Width) |
| Density | 256Kb | Interface Type | Serial (I2C) |
| Organization | 32Kx8 | Access Time (max) | 900ns |
| Frequency (max) | 400KHz | Write Protection | Yes |
| Data Retention | 40Year | Operating Supply Voltage (typ) | 3.3/5V |
| Package Type | SOIC | Operating Temp Range | -40C to 85C |
| Supply Current | 5mA | Operating Supply Voltage (min) | 2.5V |
| Operating Supply Voltage (max) | 5.5V | Operating Temperature Classification | Industrial |
| Mounting | Surface Mount | Pin Count | 8 |
| Maximum Clock Frequency | 0.4 MHz | Access Time | 900 ns |
| Supply Voltage (max) | 5.5 V | Supply Voltage (min) | 2.5 V |
| Maximum Operating Current | 5 mA | Maximum Operating Temperature | + 85 C |
| Mounting Style | SMD/SMT | Minimum Operating Temperature | - 40 C |
| Operating Supply Voltage | 2.5 V, 5.5 V | Lead Free Status / RoHS Status | Lead free / RoHS Compliant |
| Other names | 497-8623-2 M24256-BWMN6TP | ||
PrevNext
M24256-BF, M24256-BR, M24256-BW, M24256-DR
9
Revision history
Table 24.
Document revision history
Date
Revision
29-Jan-2001
10-Apr-2001
16-Jul-2001
02-Oct-2001
13-Dec-2001
12-Jun-2001
22-Oct-2003
02-Sep-2004
22-Feb-2005
Lead Soldering Temperature in the Absolute Maximum Ratings table
amended
Write Cycle Polling Flow Chart using ACK illustration updated
1.1
LGA8 and SO8(wide) packages added
References to PSDIP8 changed to PDIP8, and Package Mechanical data
updated
LGA8 Package Mechanical data and illustration updated
1.2
SO16 package removed
1.3
LGA8 Package given the designator “LA”
1.4
LGA8 Package mechanical data updated
Document becomes Preliminary Data
1.5
Test conditions for ILI, ILO, ZL and ZH made more precise
VIL and VIH values unified. tNS value changed
1.6
Document promoted to Full Datasheet
Table of contents, and Pb-free options added. Minor wording changes in
2.0
Summary Description, Power-On Reset, Memory Addressing, Write
Operations, Read Operations. V
LGA8 package is Not for New Design. 5V and -S supply ranges, and
Device Grade 5 removed. Absolute Maximum Ratings for V
3.0
V
(min) changed. Soldering temperature information clarified for RoHS
CC
compliant devices. Device grade information clarified. AEC-Q100-002
compliance. V
specification unified for SDA, SCL and WC
IL
Initial delivery state
is FFh (not necessarily the same as Erased).
LGA package removed, TSSOP8 and SO8N packages added (see
Package mechanical data
scheme).
Voltage range R (1.8V to 5.5V) also offered. Minor wording changes.
Z
Test Conditions modified in
L
added.
4.0
I
and I
values for V
CC
CC1
(voltage range
W).
Note added to
Table 13: DC characteristics (voltage range
Power On Reset
paragraph specified.
t
max value modified in
W
added. Plating technology changed in
scheme.
Resistance and capacitance renamed in
Doc ID 6757 Rev 23
Revision history
Changes
(min) improved to –0.45V.
IL
section and
Table 23: Ordering information
Table 11: Input parameters
= 5.5V added to
Table 13: DC characteristics
CC
Table 16: 400 kHz AC characteristics
Table 23: Ordering information
Figure
6.
(min) and
IO
and Note
2
W).
and note 4
37/42
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