IPP110N20NAXK Infineon Technologies, IPP110N20NAXK Datasheet

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IPP110N20NAXK

Manufacturer Part Number
IPP110N20NAXK
Description
MOSFET OptiMOS 3 Power Transistor
Manufacturer
Infineon Technologies
Datasheet

Specifications of IPP110N20NAXK

Rohs
yes
Transistor Polarity
N-Channel
Drain-source Breakdown Voltage
200 V
Gate-source Breakdown Voltage
+/- 20 V
Continuous Drain Current
88 A
Resistance Drain-source Rds (on)
10.7 mOhms at 10 V
Configuration
Single
Maximum Operating Temperature
+ 175 C
Mounting Style
Through Hole
Package / Case
PG-TO220-3
Fall Time
11 ns
Gate Charge Qg
65 nC
Minimum Operating Temperature
- 55 C
Power Dissipation
300 W
Rise Time
26 ns
Typical Turn-off Delay Time
41 ns
Part # Aliases
IPP110N20NA IPP110N20NAAKSA1
Rev. 2.1
1)
Features
• N-channel, normal level
• Excellent gate charge x R
• Very low on-resistance R
• 175 °C operating temperature
• Pb-free lead plating; RoHS compliant
• Qualified according to AEC Q101
• Halogen-free according to IEC61249-2-21
• Ideal for high-frequency switching and synchronous rectification
Maximum ratings, at T
Parameter
Continuous drain current
Pulsed drain current
Avalanche energy, single pulse
Reverse diode dv /dt
Gate source voltage
Power dissipation
Operating and storage temperature
IEC climatic category; DIN IEC 68-1
OptiMOS
Type
Package
Marking
See figure 3
TM
3 Power-Transistor
1)
IPB107N20NA
PG-TO263-3
107N20NA
j
=25 °C, unless otherwise specified
DS(on)
DS(on)
product (FOM)
Symbol Conditions
I
I
E
dv /dt
V
P
T
D
D,pulse
j
AS
GS
tot
, T
IPP110N20NA
PG-TO220-3
110N20NA
stg
T
T
T
I
T
D
C
C
C
C
=80 A, R
page 1
=25 °C
=100 °C
=25 °C
=25 °C
GS
=25 W
Product Summary
V
R
I
D
DS
DS(on),max (TO263)
IPB107N20NA
-55 ... 175
55/175/56
Value
352
560
±20
300
88
63
10
IPP110N20NA
10.7
200
88
2011-05-11
Unit
A
mJ
kV/µs
V
W
°C
V
mW
A

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IPP110N20NAXK Summary of contents

Page 1

OptiMOS TM 3 Power-Transistor Features • N-channel, normal level • Excellent gate charge x R DS(on) • Very low on-resistance R DS(on) • 175 °C operating temperature • Pb-free lead plating; RoHS compliant • Qualified according to AEC Q101 • ...

Page 2

Parameter Thermal characteristics Thermal resistance, junction - case Thermal resistance, junction - ambient Electrical characteristics Static characteristics Drain-source breakdown voltage Gate threshold voltage Zero gate voltage drain current Gate-source leakage current Drain-source on-state resistance 2) Device on 40 ...

Page 3

Parameter 4) Dynamic characteristic Input capacitance Output capacitance Reverse transfer capacitance Turn-on delay time Rise time Turn-off delay time Fall time 3) Gate Charge Characteristics Gate to source charge Gate to drain charge Switching charge Gate charge total Gate plateau ...

Page 4

Power dissipation P =f(T ) tot C 320 280 240 200 160 120 100 T [° Safe operating area I =f =25 ° parameter: t ...

Page 5

Typ. output characteristics I =f =25 ° parameter 200 10 V 175 7 V 150 125 100 [ Typ. transfer characteristics I ...

Page 6

Drain-source on-state resistance =10 V DS(on typ -60 - [° Typ. capacitances C =f ...

Page 7

Avalanche characteristics = =f parameter: T j(start) 100 125 ° [µ Drain-source breakdown voltage V =f BR(DSS 230 220 ...

Page 8

PG-TO220-3: Outline Rev. 2.1 IPB107N20NA page 8 IPP110N20NA 2011-05-11 ...

Page 9

PG-TO263-3: Outline Rev. 2.1 IPB107N20NA page 9 IPP110N20NA 2011-05-11 ...

Page 10

... Infineon Technologies Office. Infineon Technologies components may be used in life-support devices or systems only with the express written approval of Infineon Technologies failure of such components can reasonably be expected to cause the failure of that life-support device or system or to affect the safety or effectiveness of that device or system ...

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