NVMFS5832NLT1G ON Semiconductor, NVMFS5832NLT1G Datasheet

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NVMFS5832NLT1G

Manufacturer Part Number
NVMFS5832NLT1G
Description
MOSFET NFET SO8FL 40V 120A 4.2MO
Manufacturer
ON Semiconductor
Datasheet

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Company
Part Number
Manufacturer
Quantity
Price
Part Number:
NVMFS5832NLT1G
Manufacturer:
ON/安森美
Quantity:
20 000
NVMFS5832NL
Power MOSFET
40 V, 4.2 mW, 120 A, Single N−Channel
Features
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. The entire application environment impacts the thermal resistance values shown,
2. Psi (Y) is used as required per JESD51−12 for packages in which
3. Surface−mounted on FR4 board using a 650 mm
4. Maximum current for pulses as long as 1 second is higher but is dependent
MAXIMUM RATINGS
© Semiconductor Components Industries, LLC, 2013
March, 2013 − Rev. 2
THERMAL RESISTANCE MAXIMUM RATINGS
Drain−to−Source Voltage
Gate−to−Source Voltage
Continuous Drain Cur-
rent R
2, 3, 4)
Power Dissipation
R
Continuous Drain Cur-
rent R
4)
Power Dissipation
R
Pulsed Drain Current
Operating Junction and Storage Temperature
Source Current (Body Diode)
Single Pulse Drain−to−Source Avalanche
Energy (T
L = 0.1 mH, R
Lead Temperature for Soldering Purposes
(1/8″ from case for 10 s)
Junction−to−Mounting Board (top) − Steady
Junction−to−Ambient − Steady State (Note 3)
Small Footprint (5x6 mm) for Compact Design
Low R
Low Q
AEC−Q101 Qualified and PPAP Capable
These are Pb−Free Devices
YJ−mb
qJA
they are not constants and are only valid for the particular conditions noted.
substantially less than 100% of the heat flows to single case surface.
on pulse duration and duty cycle.
State (Notes 2, 3)
(Notes 1 & 3)
YJ−mb
qJA
(Notes 1, 2, 3)
DS(on)
G
(Notes 1, 3,
J
= 25°C, V
and Capacitance to Minimize Driver Losses
(Notes 1,
G
= 25 W)
to Minimize Conduction Losses
Parameter
Parameter
GS
(T
= 10 V, I
Steady
Steady
T
J
State
State
A
= 25°C unless otherwise noted)
= 25°C, t
L(pk)
T
T
T
T
T
T
mb
mb
T
T
mb
mb
A
A
A
A
= 52 A,
p
= 100°C
= 100°C
= 25°C
= 25°C
= 100°C
= 100°C
= 10 ms
= 25°C
= 25°C
Symbol
R
Symbol
T
2
R
V
YJ−mb
, 2 oz. Cu pad.
J
V
E
I
P
P
, T
DSS
DM
T
qJA
I
I
I
GS
AS
D
D
S
D
D
L
stg
Value
−55 to
Value
+ 175
± 20
1.2
120
127
557
120
134
260
40
3.7
1.9
40
84
64
21
15
1
°C/W
Unit
Unit
mJ
°C
°C
W
W
V
V
A
A
A
A
†For information on tape and reel specifications,
NVMFS5832NLT1G
NVMFS5832NLT3G
SO−8 FLAT LEAD
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
V
CASE 488AA
(BR)DSS
40 V
STYLE 1
Device
G (4)
ORDERING INFORMATION
A
Y
W
ZZ
1
N−CHANNEL MOSFET
http://onsemi.com
6.5 mW @ 4.5 V
4.2 mW @ 10 V
D (5,6)
R
= Assembly Location
= Year
= Work Week
= Lot Traceability
DS(ON)
(Pb−Free)
(Pb−Free)
Package
SO−8FL
SO−8FL
Publication Order Number:
MAX
S (1,2,3)
G
S
S
S
MARKING
DIAGRAM
NVMFS5832NL/D
V5832L
AYWZZ
D
D
Tape & Reel
Tape & Reel
Shipping
1500 /
5000 /
I
D
120 A
MAX
D
D

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NVMFS5832NLT1G Summary of contents

Page 1

... CASE 488AA AS STYLE 1 T 260 °C L Device Symbol Value Unit NVMFS5832NLT1G 1.2 °C/W R YJ−mb NVMFS5832NLT3G R 40 qJA †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications oz. Cu pad. ...

Page 2

ELECTRICAL CHARACTERISTICS Parameter OFF CHARACTERISTICS Drain−to−Source Breakdown Voltage Drain−to−Source Breakdown Voltage Temperature Coefficient Zero Gate Voltage Drain Current Gate−to−Source Leakage Current ON CHARACTERISTICS (Note 5) Gate Threshold Voltage Negative Threshold Temperature Coefficient Drain−to−Source On Resistance Forward Transconductance CHARGES, CAPACITANCES & ...

Page 3

V 5.0 V 200 150 100 DRAIN−TO−SOURCE VOLTAGE (V) DS Figure 1. On−Region Characteristics 0.020 0.015 0.010 0.005 0.000 GATE−TO−SOURCE VOLTAGE (V) ...

Page 4

C iss 3000 2500 2000 1500 1000 C oss 500 C rss DRAIN−TO−SOURCE VOLTAGE (V) DS Figure 7. Capacitance Variation 1000 ...

Page 5

Duty Cycle = 0.5 10 0.2 0.1 0.05 1 0.02 0.01 0.1 Single Pulse 0.01 0.000001 0.00001 0.0001 TYPICAL CHARACTERISTICS 0.001 0.01 0.1 PULSE TIME (sec) Figure 12. Thermal Response http://onsemi.com 100 1000 ...

Page 6

... Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. N. American Technical Support: 800−282−9855 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 421 33 790 2910 Japan Customer Focus Center Phone: 81− ...

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