AD6657AEBZ Analog Devices, AD6657AEBZ Datasheet - Page 2

• Manufacturer Part Number: AD6657AEBZ
• Description: Data Conversion IC Development Tools 11 Bit 200 Msps Quad IF Receiver
• Manufacturer: Analog Devices
• Type: ADCr
• Series: AD6657Ar

Specifications of AD6657AEBZ

• Rohs: yes
• Product: Evaluation Boards
• Tool Is For Evaluation Of: AD6657A
• Interface Type: SPI, USB
• Operating Supply Voltage: 6 V
• Description/function: Quad IF receiver with noise shaping requantizer
• Maximum Operating Temperature: + 85 C
• Minimum Operating Temperature: - 40 C
• Operating Supply Current: 2 A
• Factory Pack Quantity: 1
• For Use With: HSC-ADC-EVALCZ

TABLE OF CONTENTS
Features .............................................................................................. 1
Applications ....................................................................................... 1
Functional Block Diagram .............................................................. 1
General Description ......................................................................... 1
Revision History ............................................................................... 2
Product Highlights ........................................................................... 3
Specifications ..................................................................................... 4
Pin Configuration and Function Descriptions ........................... 12
Typical Performance Characteristics ........................................... 14
Equivalent Circuits ......................................................................... 18
Theory of Operation ...................................................................... 19
REVISION HISTORY
10/11—Revision 0: Initial Version
AD6657A
DC Specifications ......................................................................... 4
AC Specifications .......................................................................... 5
Digital Specifications ................................................................... 7
Switching Specifications .............................................................. 9
Timing Specifications ................................................................ 10
Absolute Maximum Ratings ..................................................... 11
Thermal Characteristics ............................................................ 11
ESD Caution ................................................................................ 11
ADC Architecture ...................................................................... 19
Analog Input Considerations .................................................... 19
Clock Input Considerations ...................................................... 21
Power Dissipation and Standby Mode ..................................... 23
Rev. 0 | Page 2 of 36
Noise Shaping Requantizer ........................................................... 25
Built-In Self Test (BIST) and Output Test ................................... 28
Serial Port Interface (SPI) .............................................................. 29
Memory Map .................................................................................. 30
Applications Information .............................................................. 35
Packaging and Ordering Information ......................................... 36
Channel/Chip Synchronization ................................................ 23
Digital Outputs ........................................................................... 24
Timing ......................................................................................... 24
22% BW Mode (>40 MHz at 184.32 MSPS) ........................... 25
33% BW Mode (>60 MHz at 184.32 MSPS) ........................... 26
36% BW Mode (>65 MHz at 184.32 MSPS) ........................... 27
MODE Pin ................................................................................... 27
BIST .............................................................................................. 28
Output Test Modes ..................................................................... 28
Configuration Using the SPI ..................................................... 29
Hardware Interface ..................................................................... 29
Reading the Memory Map Register Table ............................... 30
Memory Map Register Table ..................................................... 31
Memory Map Register Descriptions ........................................ 33
Design Guidelines ...................................................................... 35
Outline Dimensions ................................................................... 36
Ordering Guide .......................................................................... 36
Data Sheet