OM7802/BGU7003/CMMB,598 NXP Semiconductors, OM7802/BGU7003/CMMB,598 Datasheet
OM7802/BGU7003/CMMB,598
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OM7802/BGU7003/CMMB,598 Summary of contents
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BGU7003 Wideband silicon germanium low-noise amplifier MMIC Rev. 02 — 22 June 2010 1. Product profile 1.1 General description The BGU7003 MMIC is a wideband amplifier in SiGe:C technology for high speed, low-noise applications in a plastic, leadless 6 pin, ...
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... NXP Semiconductors 1.4 Quick reference data Table 1. Quick reference data ° 2 5.0 mA; V amb CC CC(tot) Ω unless otherwise specified. Symbol Parameter V supply voltage CC I total supply current CC(tot) T ambient temperature amb P total power dissipation tot | Insertion power gain 21 NF ...
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... NXP Semiconductors 5. Limiting values Table 5. In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter V supply voltage CC I total supply current CC(tot) P total power dissipation tot T storage temperature stg T junction temperature j [ the temperature at the solder point of the ground lead. ...
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... NXP Semiconductors Table 8. − ° ≤ amb V (V) ENABLE ≤ 0.4 ≥ 0.7 T amb ( ( ( Fig 1. Total supply current as a function of bias resistor; typical values BGU7003 Product data sheet Wideband silicon germanium low-noise amplifier MMIC ENABLE (pin 5) ≤ ° ...
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... NXP Semiconductors T amb Fig 2. Input reflection coefficient (S T amb Fig 3. Output reflection coefficient (S BGU7003 Product data sheet Wideband silicon germanium low-noise amplifier MMIC 90° +1 135° +0.5 +0.2 0 0.2 0.5 1 180° 6 GHz −0.2 −0.5 −135° −1 −90° ° 5 CC(tot) ...
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... NXP Semiconductors (dB 2000 4000 = 25 ° 5.0 mA; V amb CC(tot) = −30 dBm Ω. P drive 0 Fig 4. Insertion power gain (|s 21 frequency; typical values 1 K − 2000 4000 = 25 ° 5.0 mA; V amb CC(tot) = −30 dBm Ω. P drive 0 Fig 6 ...
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... NXP Semiconductors T amb Fig 8. Optimum source reflection coefficient for minimum noise figure; typical values T amb Normalized to 50 Ω. Fig 9. Equivalent noise resistance as a function of frequency; typical values BGU7003 Product data sheet Wideband silicon germanium low-noise amplifier MMIC 90° +1 135° +0.5 6 GHz +0 ...
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... NXP Semiconductors 8. Application information GPS LNA Other applications available. Please contact your local sales representative for more information. Application note(s) available on the NXP website. 8.1 Application circuit In Figure 10 Fig 10. Circuit diagram of the evaluation board Table 9. For circuit, see Component Description C1 ...
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... NXP Semiconductors 8.2 Application board layout Figure 11 shows the board layout with component identifications. Fig 11. Printed-Circuit Board (PCB) of the BGU7003 evaluation board 8.3 Printed-Circuit Board The material that has been used for the evaluation board is FR4 using the stack shown in Figure 12. Material supplier is ISOLA DURAVER; ε ...
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... NXP Semiconductors 8.4 GPS evaluation board Table 10. GPS application characteristics ° 2 5.0 mA 1.575 GHz; V amb CC CC(tot) Ω unless otherwise specified. Symbol Parameter | Insertion power gain input return loss output return loss isolation 12 NF noise figure ...
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... NXP Semiconductors T amb matched to 50 Ω). Fig 14. Output reflection coefficient ( (dB) −2 −4 −6 −8 −10 0 500 1000 1500 2000 = 25 ° 2 amb CC CC(tot) ≥ 0 Ω (input and output ENABLE S L matched to 50 Ω). | 2 Fig 15. Input return loss (|s ...
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... NXP Semiconductors (dB 500 1000 1500 2000 = 25 ° 2 amb CC CC(tot) ≥ 0 Ω (input and output ENABLE S L matched to 50 Ω). Fig 17. Insertion power gain (|s 21 frequency; typical values 40 = −0.2 dBm IP3 I P (dB −40 IMD3 − ...
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... NXP Semiconductors (dB −35 −31 −27 − ° 2 amb CC CC(tot) ≥ 0 1.575 GHz; V ENABLE and output matched to 50 Ω). Fig 21. Power gain as a function of drive power; typical values BGU7003 Product data sheet Wideband silicon germanium low-noise amplifier MMIC ...
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... NXP Semiconductors 9. Package outline XSON6: plastic extremely thin small outline package; no leads; 6 terminals; body 0 6× (1) terminal 1 index area 0 DIMENSIONS (mm are the original dimensions UNIT max max 0.20 1.05 1.05 mm 0.5 0.04 0.12 0.95 0.95 Note 1. Can be visible in some manufacturing processes. OUTLINE VERSION IEC SOT891 Fig 23 ...
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... NXP Semiconductors 10. Soldering Reflow soldering is the only recommended soldering method. Fig 24. Reflow soldering footprint 11. Abbreviations Table 11. Acronym AC CDMA DC FR4 GPS LNA MMIC RF SiGe:C SMA WLAN 12. Revision history Table 12. Revision history Document ID Release date BGU7003 v.2 20100622 • Modifications: Legal information updated. BGU7003 v.1 ...
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... In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or ...
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... NXP Semiconductors’ specifications such use shall be solely at customer’s own risk, and (c) customer fully indemnifies NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors’ ...
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... NXP Semiconductors 15. Contents 1 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.1 General description . . . . . . . . . . . . . . . . . . . . . 1 1.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.4 Quick reference data . . . . . . . . . . . . . . . . . . . . 2 2 Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 3 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 4 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 5 Limiting values Thermal characteristics . . . . . . . . . . . . . . . . . . 3 7 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 3 8 Application information GPS LNA . . . . . . . . . . 8 8.1 Application circuit . . . . . . . . . . . . . . . . . . . . . . . 8 8.2 Application board layout . . . . . . . . . . . . . . . . . . 9 8.3 Printed-Circuit Board . . . . . . . . . . . . . . . . . . . . 9 8.4 GPS evaluation board . . . . . . . . . . . . . . . . . . 10 9 Package outline ...