AD6643-250EBZ Analog Devices, AD6643-250EBZ Datasheet - Page 36

• Manufacturer Part Number: AD6643-250EBZ
• Description: Data Conversion IC Development Tools 11 Bit Dual IF Diversity 3G Receiver
• Manufacturer: Analog Devices
• Type: ADCr
• Series: AD6643r

Specifications of AD6643-250EBZ

• Rohs: yes
• Product: Evaluation Boards
• Tool Is For Evaluation Of: AD6643-250
• Interface Type: SPI, USB
• Operating Supply Voltage: 6 V
• Description/function: 250 MSPs per channel dual IF receiver
• Maximum Operating Temperature: + 85 C
• Minimum Operating Temperature: - 40 C
• Operating Supply Current: 2 A
• Factory Pack Quantity: 1
• For Use With: HSC-ADC-EVALCZ

AD6643
APPLICATIONS INFORMATION
DESIGN GUIDELINES
Before starting system level design and layout of the AD6643,
it is recommended that the designer become familiar with these
guidelines, which discuss the special circuit connections and
layout requirements needed for certain pins.
Power and Ground Recommendations
When connecting power to the AD6643, it is recommended
that two separate 1.8 V supplies be used: one supply for analog
(AVDD) and a separate supply for the digital outputs (DRVDD).
The designer can employ several different decoupling capacitors
to cover both high and low frequencies. Locate these capacitors
close to the point of entry at the PCB level and close to the pins
of the device using minimal trace length.
A single PCB ground plane should be sufficient when using the
AD6643. With proper decoupling and smart partitioning of the
PCB analog, digital, and clock sections, optimum performance
is easily achieved.
Exposed Paddle Thermal Heat Slug Recommendations
It is mandatory that the exposed paddle on the underside of the
ADC be connected to analog ground (AGND) to achieve the
best electrical and thermal performance. A continuous, exposed
(no solder mask) copper plane on the PCB should mate to the
AD6643 exposed paddle, Pin 0.
The copper plane should have several vias to achieve the lowest
possible resistive thermal path for heat dissipation to flow through
the bottom of the PCB. Fill or plug these vias with nonconduc-
tive epoxy.
Rev. C | Page 36 of 40
To maximize the coverage and adhesion between the ADC
and the PCB, overlay a silkscreen to partition the continuous
plane on the PCB into several uniform sections. This provides
several tie points between the ADC and the PCB during the
reflow process. Using one continuous plane with no partitions
guarantees only one tie point between the ADC and the PCB.
See the evaluation board for a PCB layout example. For detailed
information about packaging and PCB layout of chip scale
packages, refer to the
Manufacturing Guide for the Lead Frame Chip Scale Package
(LFCSP).
VCM
Decouple the VCM pin to ground with a 0.1 μF capacitor, as
shown in Figure 43. For optimal channel-to-channel isolation, a
33 Ω resistor should be included between the AD6643 VCM pin
and the Channel A analog input network connection and between
the AD6643 VCM pin and the Channel B analog input network
connection.
SPI Port
The SPI port should not be active during periods when the full
dynamic performance of the converter is required. Because the
SCLK, CSB, and SDIO signals are typically asynchronous to the
ADC clock, noise from these signals can degrade converter per-
formance. If the on-board SPI bus is used for other devices, it
may be necessary to provide buffers between this bus and the
AD6643 to keep these signals from transitioning at the converter
inputs during critical sampling periods.
AN-772
Application Note, A Design and
Data Sheet