TWR-12311-KIT-NA Freescale Semiconductor, TWR-12311-KIT-NA Datasheet

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TWR-12311-KIT-NA

Manufacturer Part Number
TWR-12311-KIT-NA
Description
Development Boards & Kits - Other Processors Tower Kit for NA
Manufacturer
Freescale Semiconductor
Datasheet

Specifications of TWR-12311-KIT-NA

Rohs
yes
Product
Development Systems
Tool Is For Evaluation Of
MC12311
Core
HCS08
Interface Type
SPI, USB
Operating Supply Voltage
3.5 V to 10 V
Data Bus Width
8 bit
For Use With
MC12311
12311 Development Hardware
Reference Manual
Document Number: 12311DHRM
Rev. 0.0
10/2011

Related parts for TWR-12311-KIT-NA

TWR-12311-KIT-NA Summary of contents

Page 1

Development Hardware Reference Manual Document Number: 12311DHRM Rev. 0.0 10/2011 ...

Page 2

... Freescale Semiconductor products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the Freescale Semiconductor product could create a situation where personal injury or death may occur. Should Buyer purchase ...

Page 3

... MC12311 Development Platform Overview and Description 2.1 Introduction 2-1 2.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-2 2.2.1 TWR-RF Module . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-3 2.3 Driver Considerations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-4 Chapter 3 12311-MRB 3.1 12311-MRB Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-1 3 ...

Page 4

... Chapter 4 PCB Manufacturing Specifications 4.1 Single PCB Construction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-1 4.2 Panelization 4-2 4.3 Materials . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-2 4.4 Solder Mask . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-3 4.5 Silk Screen . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-3 4.6 Electrical PCB Testing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-3 4.7 Packaging . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-3 4.8 Hole Specification/Tool Table . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-3 4.9 File Description 4-4 12311 Development Hardware Reference Manual, Rev. 0.0 iv Freescale Semiconductor ...

Page 5

... PCB Manufacturing Specifications — This chapter provides the specifications used to manufacture the various 12311-MRB printed circuit boards (PCBs). Revision History The following table summarizes revisions to this document since the previous release (Rev 0.0). Location Entire document First public release 12311 Development Hardware Reference Manual, Rev. 0.0 Freescale Semiconductor Revision History Revision v ...

Page 6

... SPI Serial Peripheral Interface SSI Synchronous Serial Interface TACT Switch A switch that provides a slight “snap” or “click” to the user to indicate function. TELCO Telephone Company USB Universal Serial Bus VCP Virtual Com Port 12311 Development Hardware Reference Manual, Rev. 0.0 vi Freescale Semiconductor ...

Page 7

... This requirement does not apply to carrier current devices or to devices operated under the provisions of Sections 15.211, 15.213, 15.217, 15.219, or 15.221. Further, this requirement does not apply to intentional 12311 Development Hardware Reference Manual, Rev. 0.0 Freescale Semiconductor 1-1 ...

Page 8

... Static control workstations, static control monitors and table or floor static control systems • Static control packaging and transportation materials and environmental systems 1.4 Disposal Instructions This product may be subject to special disposal requirements. For product disposal instructions, refer to www.freescale.com/productdisposal. 12311 Development Hardware Reference Manual, Rev. 0.0 1-2 Freescale Semiconductor ...

Page 9

... TWR-RF Board . The TWR-RF board is a motherboard for the MC12311 and 12311-MRB daughter boards, to enable its use within the Tower system. The TWR-RF board is a Tower Controller Module compatible with the Freescale Tower System. The 12311-MRB + TWR-RF can 12311 Development Hardware Reference Manual, Rev. 0.0 ...

Page 10

... Standard sockets 100 mils J5 and J4 (2X9 and 2x10) to connect MC12311 and 12311-MRB daughter boards — Standard header 100 mils J1 (2x20) to enable signalling path to TWR primary and secondary connectors. — Standard header 100 mils J6 (3x12) to enable signalling to on board HW and USB interface or to TWR system Hardware — ...

Page 11

... Standard sockets 100 mils J5 and and 2 x 10) to connect either a 1323x Modular Reference Board (1323x-MRB 12311 Modular Reference Board (12311-MRB) • Standard header 100 mils 20) to enable signalling path to TWR primary and secondary connectors. • Standard header 100 mils 12) to enable signalling to on board HW and USB interface or to TWR system Hardware • ...

Page 12

... MC12311 Development Platform Overview and Description Figure 2-2. Simplified TWR-RF Block Diagram See the TWR-RF Reference Manual for more information about the RF-Tower module. 2.3 Driver Considerations When users first connect a 12311-MRB to a PC, they may be prompted to install drivers. If BeeKit is installed and this occurs, do not allow Windows to automatically search for and install the drivers. Instead, ...

Page 13

... This basic board is intended as the core module for MC12311 evaluation and application development and can be used in the following modes: • Simple standalone evaluation platform • Daughtercard to other Development Platform boards (TWR-RF, 1323x-RCM or 1323x-REM) • Daughtercard to an application specific motherboard. 3.1.1 Features The 12311-MRB provides the following features: • ...

Page 14

... J2 and J3 are used for that connection. • Both headers have standard 0.10in / 2.54 mm pin spacing • 20-pin and J3 is 18-pin 12311 Development Hardware Reference Manual, Rev. 0.0 3-2 PA Boost SMA (J1 Primary 20-pin IO Connector (J15) Figure 3-1. 12311-MRB RFIO ScMA (J2 J13 Secondary 18-pin IO Connector (J14) Freescale Semiconductor ...

Page 15

... Figure 3-2. 12311-MRB Top Side (Component Side) Footprint 3.1.3 Board Level Specifications Parameter General Size (PCB Layer build (PCB) Dielectric material (PCB) Power Voltage supply (DC) With 3.3 V regulator in use 12311 Development Hardware Reference Manual, Rev. 0.0 Freescale Semiconductor Table 3-1. 12311-MRB Specifications Units MIN TYP MAX 2.01 x 2.01 inches 0.8 mm ...

Page 16

... Product is approved accordingly to the EN 301 489-1 V1.6.1 (2005-09) and EN 301 489-17 V1.2.1 (2002-08) standards Product is approved accordingly to the IEC 60950-1 and EN 60950-1, First Edition standards Product complies with the EU Directive 2002/95/ January 2003 Product complies with the EU Directive 2002/95/ January 2003 Freescale Semiconductor ...

Page 17

... MHz and 868MHz European and the 902-928 MHz North American ISM bands. • Maximum RF In/Out power is +13 dBm • Maximum Power Amplifier Output is +17dBm 12311 Development Hardware Reference Manual, Rev. 0.0 Freescale Semiconductor Figure 3-3. 12311-MRB Block Diagram 12311-MRB Figure 3-2 shows a simple 3-5 ...

Page 18

... Optional 32.768 kHz Crystal Oscillator - Provision is also made for a secondary 32.768 kHz crystal Y2 (see Figure 3-6). This oscillator can be used for a low power accurate time base. 12311 Development Hardware Reference Manual, Rev. 0.0 3-6 NOTE Figure 3-4. 12311-MRB RF Circuitry Figure 3-5 shows the external 32 MHz external crystal Y1. This Freescale Semiconductor ...

Page 19

... R11 enable use of IO signals PTB7 and PTB6 via the IO connector — Use J8 to enable crystal signaling to MCU die from the DIO5 or from the 32kHz crystal. Figure 3-5. 12311-MRB 32 MHz Reference Oscillator Circuit Figure 3-6. 12311-MRB 32.768 kHz Optional Oscillator Circuit 12311 Development Hardware Reference Manual, Rev. 0.0 Freescale Semiconductor 12311-MRB 3-7 ...

Page 20

... The 6-pin BDM 2x3 header J5 is provided to connect the MC1213x serial debug port to a standard HC9S08 debug module. Figure 3-7. 12311-MRB Reset Switch and BDM Port 12311 Development Hardware Reference Manual, Rev. 0.0 3-8 Figure 3-7. See Figure 3-1 for switch and header Freescale Semiconductor ...

Page 21

... The Freescale TWR-RF development boards generate the system power supply on the motherboard and supply the voltage to the 12311-MRB through the V_BRD pin of Headers J2 and J3. In this mode, the current flows to the 12311-MRB through the pins. • ...

Page 22

... J14 and J15 Headers supply voltage to V_BRD pins when J13, Pins 3-4 are shorted External voltage w/o regulation - • Input range is set by the onboard circuitry • 2 supplied to 12311-MRB • J14 and J15 Headers supply voltage to V_BRD pins Freescale Semiconductor ...

Page 23

... PTA3/SCL 14 PTD3/KBI2P 15 GND 16 DIO5/CLKOUT 12311 Development Hardware Reference Manual, Rev. 0.0 Freescale Semiconductor 3-2). When the TWR-RF, 1323x-RCM or 1323x-REM or custom NOTE for any conflict. Table 3-4. 20 Pin Connector VDD supply to module Module ground UART TXD input to MCU UART RXD Output from MCU GPIO / Timer IO ...

Page 24

... Port B Bit 6 - signal shared with 32.768 kHz oscillator Module Ground Port B Bit 5 Port B Bit 4 Port C Bit 3 Port C Bit 2 Port C Bit 1 Port D Bit 2 Port A Bit 6 Port C Bit 7 Port C Bit 6 Port C Bit 5 Port C Bit 4 Transceiver GPIO Bit 2 Transceiver GPIO Bit 3 Module ground Description Description Freescale Semiconductor ...

Page 25

Schematic, Board Layout, and Bill of Material 5 TP18 TP18 TP19 TP19 D V_IC J10 J10 J11 J11 V_IC R12 R12 HDR 1X2 HDR 1X2 HDR 1X2 HDR 1X2 RESET SW1 SW1 VREF_H 15K 15K VREF_L J12 J12 1 ...

Page 26

... Figure 3-10. Modular Reference Board PCB Component Location (Top View) Figure 3-11. Modular Reference Board PCB Test Points 12311 Development Hardware Reference Manual, Rev. 0.0 3-14 Freescale Semiconductor ...

Page 27

... Figure 3-12. Modular Reference Board PCB Layout (Top View) Figure 3-13. Modular Reference Board PCB Layout (Bottom View) 12311 Development Hardware Reference Manual, Rev. 0.0 Freescale Semiconductor 12311-MRB 3-15 ...

Page 28

... CON 1 COAX SMA SKT TH -- Samtec 376H AU HDR 1X2 TH 100MIL SP 330H SN Samtec 115L Table 3-8 details the parts Mfg. Name Mfg. Part Number 04025A100JAT2A 04025A100JAT2A C0402C104K4RAC C0402C221J5GAC GCM155R71H103KA5 5D GRM1555C1H110JZ0 1D GRM1555C1H120JZ0 1D GRM21BR61A106KE 19_ GRM188R71A225KE1 5D GRM188R71A105KA6 1D GRM1555C1H102JA0 1D LTST-C171KGKT MBR0520LT1G LTST-C171KRKT SMA-J-P-H-ST-TH1 TSW-102-07-T-S Freescale Semiconductor ...

Page 29

... P3,TP4,TP 5,TP6,TP7, TP8,TP9,T P10,TP11, TP12,TP13 ,TP14,TP1 5,TP16,TP 17,TP18,T P19,TP20, TP21,TP22 12311 Development Hardware Reference Manual, Rev. 0.0 Freescale Semiconductor Description HDR 2X3 TH 100MIL CTR 335H Samtec AU 95L HDR 1X3 TH 100MIL SP 339H AU Samtec 100L HDR 2X2 TH 100MIL CTR 323H 3m AU 130L HDR 2X4 TH 100MIL CTR 330H ...

Page 30

... TOKO INC. 5% 0402 RES MF ZERO OHM 1/10W -- Panasonic 0402 Mfg. Name Mfg. Part Number MC12311 LP2985AIM5-3.3/NOP B EXS00A-CS02368 FC-135 32.7680KA-A3 Mfg. Name Mfg. Part Number 04023J3R3BBSTR GJM1555C1H5R6CB0 1D GRM1555C1H6R8DZ 01J GMC04CG470J50NT- LF 04025A8R2CAT2A GRM1555C1H4R7CA 01D 04025A100JAT2A 04025A100JAT2A LQG15HN5N6S02D LQG15HS6N8J02D LQG15HN3N9S02D LL1005-FHL33NJ ERJ-2GE0R00X Freescale Semiconductor ...

Page 31

... (R1 in 1.5NH 915 BOM) 12311 Development Hardware Reference Manual, Rev. 0.0 Freescale Semiconductor Description CAP CER 8.2PF 50V 0.5PF C0G MURATA 0402 CAP CER 15PF 50V 5% C0G 0402 MURATA CAP TF 2.7PF 50V 0.25PF -- 0402 MURATA CAP CER 33PF 50V 5% C0G 0402 MURATA ...

Page 32

... Development Hardware Reference Manual, Rev. 0.0 3-20 Freescale Semiconductor ...

Page 33

... The manufacturer’s logo and week/year code must be stamped on the back of the PCB solder mask — The PCB manufacturer can not insert text on the PCB either in copper or in silkscreen without written permission from Freescale Semiconductor, Inc. • The required Underwriter’s Laboratory (UL) Flammability Rating — ...

Page 34

... Laminate - The base laminate material (laminate) must be FR4. If the laminate material were changed the RF electrical characteristics may change and degrade RF performance. 12311 Development Hardware Reference Manual, Rev. 0.0 4-2 Artwork Identification NOTE Figure 4-1) information is provided with Dielectric Dielectric Dielectric File Name SILK_TOP.art TOP.art GND.art PWR.art BOTTOM.art SILK_BOTTOM.art Metal 1 Metal 2 Metal 3 Metal 4 Freescale Semiconductor ...

Page 35

... Finished PCBs must be packed in plastic bags that do not contain silicones or sulphur materials. These materials can degrade solderability. 4.8 Hole Specification/Tool Table See the file included with the Gerber files and the ncdrill-1-4.tap 12311 Development Hardware Reference Manual, Rev. 0.0 Freescale Semiconductor PCB Manufacturing Specifications file. FAB-23451.pdf 4-3 ...

Page 36

... PDF files included are: • FAB-27108.pdf — Board fabrication drawing • GRB-27108.zip — Metal layers, solder mask, solder paste and silk screen • SPF-27108.pdf — Schematic Design files are in Allegro format with OrCAD schematic capture. 12311 Development Hardware Reference Manual, Rev. 0.0 4-4 Freescale Semiconductor ...

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