TWR-12311-KIT-NA Freescale Semiconductor, TWR-12311-KIT-NA Datasheet - Page 15

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TWR-12311-KIT-NA

Manufacturer Part Number
TWR-12311-KIT-NA
Description
Development Boards & Kits - Other Processors Tower Kit for NA
Manufacturer
Freescale Semiconductor
Datasheet

Specifications of TWR-12311-KIT-NA

Rohs
yes
Product
Development Systems
Tool Is For Evaluation Of
MC12311
Core
HCS08
Interface Type
SPI, USB
Operating Supply Voltage
3.5 V to 10 V
Data Bus Width
8 bit
For Use With
MC12311
3.1.3
Freescale Semiconductor
General
Size (PCB: X, Y)
Layer build (PCB)
Dielectric material (PCB)
Power
Voltage supply (DC)
Both are pin headers mounted on the bottom side of the 12311-MRB and are intended to plug into
matching receptacles on the motherboard.
With 3.3 V regulator in use
Board Level Specifications
Parameter
Figure 3-2. 12311-MRB Top Side (Component Side) Footprint
12311 Development Hardware Reference Manual, Rev. 0.0
Table 3-1. 12311-MRB Specifications
3.50
MIN
0.034
TYP
0.8
2.01 x 2.01
51 x 51
MAX
10
inches
inches
Units
mm
mm
V
FR4
4-Layer
Full module use
Notes/Conditions
12311-MRB
3-3

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