TWR-12311-KIT-NA Freescale Semiconductor, TWR-12311-KIT-NA Datasheet - Page 33

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TWR-12311-KIT-NA

Manufacturer Part Number
TWR-12311-KIT-NA
Description
Development Boards & Kits - Other Processors Tower Kit for NA
Manufacturer
Freescale Semiconductor
Datasheet

Specifications of TWR-12311-KIT-NA

Rohs
yes
Product
Development Systems
Tool Is For Evaluation Of
MC12311
Core
HCS08
Interface Type
SPI, USB
Operating Supply Voltage
3.5 V to 10 V
Data Bus Width
8 bit
For Use With
MC12311
Chapter 4
PCB Manufacturing Specifications
This chapter provides the specifications used to manufacture the MC12311 Development hardware printed
circuit board (PCB) described in this manual.
The MC12311 Development hardware PCBs must comply with the following:
4.1
This section describes individual PCB construction details.
The following table defines some of the layers of the completed PCB. The artwork identification refers to
the name of the layer in commonly used terms.
Freescale Semiconductor
The PCB must comply with Perfag10/3C (http://www.perfag.dk/Uk/ukindex.htm)
The PCB manufacturer’s logo is required
The PCB production week and year code is required
— The manufacturer’s logo and week/year code must be stamped on the back of the PCB solder
— The PCB manufacturer can not insert text on the PCB either in copper or in silkscreen without
The required Underwriter’s Laboratory (UL) Flammability Rating
— The level is 94V-0 (http://www.ul.com/plastics/flame.html)
— The UL information must be stamped on the back of the PCB solder mask
The MC12311 PCB is a four-layer, multi layer designs
The PCBs contains no blind, buried, or micro vias
PCB data:
— MC12311 Size: Approximately 51 x 51mm (2.01 x 2.01 inches)
— MC12311 Final thickness (Cu/Cu): 0.34 mm (0.8 inches) +/- 10% (excluding solder mask)
Single PCB Construction
mask
written permission from Freescale Semiconductor, Inc.
A complete set of design files is available for the 12311 Development
hardware at the Freescale web site (http:www.freescale.com/802154)
under reference designs. It is recommended that this design or one of a
number of other reference designs be used as a starting point for a
custom application.
The Freescale IEEE 802.15.4 / ZigBee Package and Hardware Layout
Considerations Reference Manual, (ZHDCRM) is also available at the
same web site to provide additional design guidance.
12311 Development Hardware Reference Manual, Rev. 0.0
NOTE
4-1

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