TWR-12311-KIT-NA Freescale Semiconductor, TWR-12311-KIT-NA Datasheet - Page 35

• Manufacturer Part Number: TWR-12311-KIT-NA
• Description: Development Boards & Kits - Other Processors Tower Kit for NA
• Manufacturer: Freescale Semiconductor

Specifications of TWR-12311-KIT-NA

• Rohs: yes
• Product: Development Systems
• Tool Is For Evaluation Of: MC12311
• Core: HCS08
• Interface Type: SPI, USB
• Operating Supply Voltage: 3.5 V to 10 V
• Data Bus Width: 8 bit
• For Use With: MC12311

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The solder mask must meet the following requirements:
4.5
The silk screen must meet the following requirements:
4.6
4.7
Packaging for the PCBs must be the following requirements:
4.8
See the
Freescale Semiconductor
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Copper Foil -
— Top and Bottom copper layers must be 1 oz. copper
— Interior layers must be 1/2 oz. copper
Plating - All pad plating must be Hot Air Levelling (HAL)
Solder mask type: Liquid Film Electra EMP110 or equivalent
Solder mask thickness: 10 – 30 µm
Silkscreen color: White
Silkscreen must be applied after application of solder mask if solder mask is required
The silkscreen ink must not extend into any plated-thru-holes
The silk screen must be clipped back to the line of resistance
All PCBs must be 100 percent tested for opens and shorts
Impedance Measurement - An impedance measurement report is not mandatory
Finished PCBs must remain in panel
Finished PCBs must be packed in plastic bags that do not contain silicones or sulphur materials.
These materials can degrade solderability.
ncdrill-1-4.tap
Solder Mask
Silk Screen
Electrical PCB Testing
Packaging
Hole Specification/Tool Table
file included with the Gerber files and the
12311 Development Hardware Reference Manual, Rev. 0.0
FAB-23451.pdf
PCB Manufacturing Specifications
file.
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