2PB709BSL,215 NXP Semiconductors, 2PB709BSL,215 Datasheet
2PB709BSL,215
Specifications of 2PB709BSL,215
Related parts for 2PB709BSL,215
2PB709BSL,215 Summary of contents
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... V, 200 mA PNP general-purpose transistors Rev. 1 — 28 June 2010 1. Product profile 1.1 General description PNP general-purpose transistors in a small SOT23 (TO-236AB) Surface-Mounted Device (SMD) plastic package. Table 1. Type number 2PB709BRL 2PB709BSL 1.2 Features and benefits Collector current I Two current gain selections ...
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... NXP Semiconductors 2. Pinning information Table 3. Pin Ordering information Table 4. Type number 2PB709BRL 2PB709BSL 4. Marking Table 5. Type number 2PB709BRL 2PB709BSL [ made in Hong Kong * = p: made in Hong Kong * = t: made in Malaysia * = W: made in China 5. Limiting values Table 6. In accordance with the Absolute Maximum Rating System (IEC 60134). ...
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... NXP Semiconductors Table 6. In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol P tot amb T stg [1] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard footprint. Fig 1. 6. Thermal characteristics Table 7. Symbol R th(j-a) R th(j-sp) [1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint. ...
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... NXP Semiconductors 3 10 δ th(j-a) 0.75 (K/W) 0.50 0. 0.20 0.10 0.05 0. −5 − FR4 PCB, standard footprint Fig 2. Transient thermal impedance from junction to ambient as a function of pulse duration; typical values 7. Characteristics Table amb Symbol I CBO I EBO CEsat [1] Pulse test: t 2PB709BRL_2PB709BSL Product data sheet 2PB709BRL ...
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... NXP Semiconductors 500 h FE (1) 400 300 (2) 200 (3) 100 0 −1 −10 −1 −10 = − 150 °C (1) T amb = 25 °C (2) T amb = −55 °C (3) T amb Fig 3. 2PB709BRL: DC current gain as a function of collector current; typical values 150 °C (1) T amb = 25 ° ...
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... NXP Semiconductors 600 ( 400 (2) 200 (3) 0 −1 −10 −1 −10 = − 150 °C (1) T amb = 25 °C (2) T amb = −55 °C (3) T amb Fig 6. 2PB709BSL: DC current gain as a function of collector current; typical values 150 °C (1) T amb = 25 °C ...
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... NXP Semiconductors 8. Test information 8.1 Quality information This product has been qualified in accordance with the Automotive Electronics Council (AEC) standard Q101 - Stress test qualification for discrete semiconductors, and is suitable for use in automotive applications. 9. Package outline Fig 9. 2PB709BRL_2PB709BSL Product data sheet 2PB709BRL; 2PB709BSL 3 ...
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... NXP Semiconductors 10. Packing information Table 9. The indicated -xxx are the last three digits of the 12NC ordering code. Type number 2PB709BRL 2PB709BSL [1] For further information and the availability of packing methods, see 11. Soldering 3 1.7 Fig 10. Reflow soldering footprint SOT23 (TO-236AB) 2PB709BRL_2PB709BSL Product data sheet 2PB709BRL ...
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... NXP Semiconductors 4.6 2.6 Fig 11. Wave soldering footprint SOT23 (TO-236AB) 2PB709BRL_2PB709BSL Product data sheet 2PB709BRL; 2PB709BSL 2.2 1.2 (2×) 1.4 (2×) 1.4 2.8 4.5 All information provided in this document is subject to legal disclaimers. Rev. 1 — 28 June 2010 50 V, 200 mA PNP general-purpose transistors preferred transport direction during soldering solder lands solder resist ...
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... NXP Semiconductors 12. Revision history Table 10. Revision history Document ID Release date 2PB709BRL_2PB709BSL v.1 20100628 2PB709BRL_2PB709BSL Product data sheet 2PB709BRL; 2PB709BSL 50 V, 200 mA PNP general-purpose transistors Data sheet status Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 — 28 June 2010 ...
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... In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or ...
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... NXP Semiconductors Quick reference data — The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding. 14. Contact information For more information, please visit: For sales office addresses, please send an email to: ...
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... NXP Semiconductors 15. Contents 1 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.1 General description . . . . . . . . . . . . . . . . . . . . . 1 1.2 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.4 Quick reference data . . . . . . . . . . . . . . . . . . . . 1 2 Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 3 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 4 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 5 Limiting values Thermal characteristics . . . . . . . . . . . . . . . . . . 3 7 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 4 8 Test information . . . . . . . . . . . . . . . . . . . . . . . . . 7 8.1 Quality information . . . . . . . . . . . . . . . . . . . . . . 7 9 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 7 10 Packing information . . . . . . . . . . . . . . . . . . . . . 8 11 Soldering ...