PBSS305ND T/R NXP Semiconductors, PBSS305ND T/R Datasheet
PBSS305ND T/R
Specifications of PBSS305ND T/R
Related parts for PBSS305ND T/R
PBSS305ND T/R Summary of contents
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... Low collector-emitter saturation voltage V I High collector current capability I I High collector current gain (h I High efficiency due to less heat generation I Smaller required Printed-Circuit Board (PCB) area than for conventional transistors 1.3 Applications I High-voltage DC-to-DC conversion I High-voltage MOSFET gate driving I High-voltage motor control I High-voltage power switches (e ...
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... NXP Semiconductors 2. Pinning information Table 2. Pin Ordering information Table 3. Type number PBSS305ND 4. Marking Table 4. Type number PBSS305ND PBSS305ND_2 Product data sheet Pinning Description collector collector base emitter collector collector Ordering information Package Name Description SC-74 plastic surface-mounted package (TSOP6); 6 leads Marking codes Rev. 02 — ...
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... NXP Semiconductors 5. Limiting values Table 5. In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol V CBO V CEO V EBO tot amb T stg [1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint. [2] Device mounted on a ceramic PCB, Al ...
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... NXP Semiconductors (1) Ceramic PCB, Al (2) FR4 PCB, mounting pad for collector 6 cm (3) FR4 PCB, mounting pad for collector 1 cm (4) FR4 PCB, standard footprint Fig 1. Power derating curves 6. Thermal characteristics Table 6. Symbol R th(j-a) R th(j-sp) [1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint. ...
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... NXP Semiconductors 3 10 duty cycle = Z th(j-a) 1 (K/W) 0.75 0.5 2 0.33 10 0.2 0.1 0.05 10 0.02 0. FR4 PCB, standard footprint Fig 2. Transient thermal impedance from junction to ambient as a function of pulse duration; typical values th(j-a) duty cycle = (K/ 0.5 0.33 0.2 0.1 10 0.05 0.02 0. FR4 PCB, mounting pad for collector 1 cm Fig 3. Transient thermal impedance from junction to ambient as a function of pulse duration ...
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... NXP Semiconductors th(j-a) (K/W) duty cycle = 0.75 0.5 0.33 0.2 0.1 10 0.05 0.02 0. FR4 PCB, mounting pad for collector 6 cm Fig 4. Transient thermal impedance from junction to ambient as a function of pulse duration; typical values th(j-a) (K/W) duty cycle = 0.75 0.5 0.33 0.2 0.1 10 0.05 0.02 0. Ceramic PCB, Al ...
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... NXP Semiconductors 7. Characteristics Table unless otherwise specified. amb Symbol Parameter I CBO I CES I EBO CEsat R CEsat V BEsat V BEon off [1] Pulse test: t PBSS305ND_2 Product data sheet Characteristics Conditions collector-base cut-off V = 100 ...
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... NXP Semiconductors 600 h FE (1) 400 (2) 200 ( ( 100 C amb ( amb ( amb Fig 6. DC current gain as a function of collector current; typical values 1 (V) 0.8 (1) (2) ( amb ...
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... NXP Semiconductors 1 V CEsat ( ( 100 C amb ( amb ( amb Fig 10. Collector-emitter saturation voltage as a function of collector current; typical values CEsat ( ) (1) T ...
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... NXP Semiconductors 8. Test information Fig 14. BISS transistor switching time definition Fig 15. Test circuit for switching times PBSS305ND_2 Product data sheet (probe) oscilloscope 450 9 0 Bon Boff Rev. 02 — 7 December 2007 ...
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... NXP Semiconductors 9. Package outline Fig 16. Package outline SOT457 (SC-74) 10. Packing information Table 8. The indicated -xxx are the last three digits of the 12NC ordering code. Type number PBSS305ND [1] For further information and the availability of packing methods, see [2] T1: normal taping [3] T2: reverse taping ...
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... NXP Semiconductors 11. Soldering Fig 17. Reflow soldering footprint SOT457 (SC-74) 5.05 Fig 18. Wave soldering footprint SOT457 (SC-74) PBSS305ND_2 Product data sheet 3.45 1.95 0.95 3.30 2.825 1.60 1.70 3.10 3.20 Dimensions in mm 5.30 1.40 4.30 Dimensions in mm Rev. 02 — 7 December 2007 PBSS305ND 100 NPN low V (BISS) transistor CEsat solder lands solder resist 0.45 0.55 occupied area ...
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... Document ID Release date PBSS305ND_2 20071207 • Modifications: The format of this data sheet has been redesigned to comply with the new identity guidelines of NXP Semiconductors. • Legal texts have been adapted to the new company name where appropriate. • Table • Section 13 “Legal ...
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... Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice ...
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... NXP Semiconductors 15. Contents 1 Product profi 1.1 General description 1.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.4 Quick reference data Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 3 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 4 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 5 Limiting values Thermal characteristics Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 7 8 Test information . . . . . . . . . . . . . . . . . . . . . . . . 10 9 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 11 10 Packing information Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 12 Revision history ...