BC847BW /T3 NXP Semiconductors, BC847BW /T3 Datasheet
BC847BW /T3
Specifications of BC847BW /T3
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BC847BW /T3 Summary of contents
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... BC847 series 45 V, 100 mA NPN general-purpose transistors Rev. 8 — 20 August 2012 1. Product profile 1.1 General description NPN general-purpose transistors in Surface-Mounted Device (SMD) plastic packages. Table 1. Type number BC847 BC847A BC847B BC847C BC847W BC847AW BC847BW BC847CW BC847T BC847AT BC847BT BC847CT BC847AM BC847BM BC847CM [1] Valid for all available selection groups ...
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... NXP Semiconductors 1.4 Quick reference data Table 2. Symbol V CEO Pinning information Table 3. Pin SOT23, SOT323, SOT416 SOT883 BC847_SER Product data sheet 45 V, 100 mA NPN general-purpose transistors Quick reference data Parameter Conditions collector-emitter voltage open base collector current DC current gain ...
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... NXP Semiconductors 3. Ordering information Table 4. Type number BC847 BC847A BC847B BC847C BC847W BC847AW BC847BW BC847CW BC847T BC847AT BC847BT BC847CT BC847AM BC847BM BC847CM [1] Valid for all available selection groups. 4. Marking Table 5. Type number BC847 BC847A BC847B BC847C BC847W BC847AW BC847BW BC847CW [ placeholder for manufacturing site code ...
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... NXP Semiconductors 5. Limiting values Table 6. In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol V CBO V CEO V EBO tot amb T stg [1] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard footprint. Device mounted on an FR4 PCB with 60 m copper strip line, standard footprint. ...
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... NXP Semiconductors 7. Characteristics Table amb Symbol I CBO I EBO CEsat V BEsat [1] Pulse test BC847_SER Product data sheet Characteristics C unless otherwise specified. Parameter Conditions collector-base cut-off current 150 C ...
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... NXP Semiconductors 400 h FE (1) 300 (2) 200 (3) 100 0 − 150 C (1) T amb = 25 C (2) T amb = 55 C (3) T amb Fig 1. Group A: DC current gain as a function of collector current; typical values CEsat (mV (1) (2) (3) 10 − ...
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... NXP Semiconductors 600 h FE (1) 500 400 (2) 300 200 (3) 100 0 − 150 C (1) T amb = 25 C (2) T amb = 55 C (3) T amb Fig 5. Group B: DC current gain as a function of collector current; typical values CEsat (mV (1) (3) (2) 10 − ...
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... NXP Semiconductors 1200 h FE 1000 (1) 800 (2) 600 400 (3) 200 0 − 150 C (1) T amb = 25 C (2) T amb = 55 C (3) T amb Fig 9. Group C: DC current gain as a function of collector current; typical values CEsat (mV (1) (3) (2) 10 − ...
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... NXP Semiconductors 8. Package outline Fig 13. Package outline SOT23 (TO-236AB) Fig 14. Package outline SOT323 (SC-70) BC847_SER Product data sheet 45 V, 100 mA NPN general-purpose transistors 3.0 2.8 3 2.5 1.4 2.1 1.2 1 1.9 Dimensions in mm 2.2 1.8 3 2.2 1.35 2.0 1.15 1 1.3 Dimensions in mm All information provided in this document is subject to legal disclaimers. Rev. 8 — 20 August 2012 BC847 series 1 ...
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... NXP Semiconductors Fig 15. Package outline SOT416 (SC-75) Fig 16. Package outline SOT883 (SC-101) BC847_SER Product data sheet 45 V, 100 mA NPN general-purpose transistors 1.8 1.4 3 1.75 0.9 1.45 0 Dimensions in mm 0.62 0.55 0.55 0.47 3 0.30 0.22 0.65 0.30 0. 0.20 0.12 0.35 Dimensions in mm All information provided in this document is subject to legal disclaimers. Rev. 8 — 20 August 2012 BC847 series 0.95 0.60 0.45 0.15 2 0.30 0.25 0.15 0.10 04-11-04 0.50 0.46 1.02 0.95 03-04-03 © NXP B.V. 2012. All rights reserved. ...
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... NXP Semiconductors 9. Packing information Table 9. The indicated -xxx are the last three digits of the 12NC ordering code. Type number BC847 BC847A BC847B BC847C BC847W BC847AW BC847BW BC847CW BC847T BC847AT BC847BT BC847CT BC847AM BC847BM BC847CM [1] For further information and the availability of packing methods, see [2] Valid for all available selection groups ...
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... NXP Semiconductors 10. Soldering 3 1.7 Fig 17. Reflow soldering footprint SOT23 (TO-236AB) 4.6 2.6 Fig 18. Wave soldering footprint SOT23 (TO-236AB) BC847_SER Product data sheet 3.3 2.9 1.9 0.7 (3×) 0.5 (3×) 0.6 (3×) 1 2.2 1.2 (2×) 1.4 (2×) 1.4 2.8 4.5 All information provided in this document is subject to legal disclaimers. Rev. 8 — 20 August 2012 BC847 series 45 V, 100 mA NPN general-purpose transistors 2 0 ...
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... NXP Semiconductors Fig 19. Reflow soldering footprint SOT323 (SC-70) 3.65 2.1 Fig 20. Wave soldering footprint SOT323 (SC-70) BC847_SER Product data sheet 2.65 1.85 1.325 2 0.6 3 2.35 (3×) 1 0.55 (3×) 4.6 2.575 1.425 (3×) All information provided in this document is subject to legal disclaimers. Rev. 8 — 20 August 2012 BC847 series 45 V, 100 mA NPN general-purpose transistors 1 ...
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... NXP Semiconductors Fig 21. Reflow soldering footprint SOT416 (SC-75) 0.9 Fig 22. Reflow soldering footprint SOT883 (SC-101) BC847_SER Product data sheet 2.2 1.7 0.85 0.6 (3×) 1.3 1.3 0.7 0.25 (2×) 0.3 0.3 (2×) 0.4 0.4 (2×) All information provided in this document is subject to legal disclaimers. Rev. 8 — 20 August 2012 BC847 series 45 V, 100 mA NPN general-purpose transistors solder lands ...
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... NXP Semiconductors 11. Revision history Table 10. Revision history Document ID Release date BC847_SER v.8 20120820 Modifications: BC847_BC547_SER v.7 20081210 BC847_BC547_SER v.6 20050519 BC847_SER Product data sheet Data sheet status Product data sheet • Type numbers removed: BC847B/DG, BC847BW/DG, BC847AT/DG, BC857, BC857B and BC857C • Section 12 “Legal information” ...
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... Terms and conditions of commercial sale of NXP Semiconductors. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice ...
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... NXP Semiconductors’ specifications such use shall be solely at customer’s own risk, and (c) customer fully indemnifies NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors’ ...
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... NXP Semiconductors 14. Contents 1 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.1 General description . . . . . . . . . . . . . . . . . . . . . 1 1.2 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.4 Quick reference data . . . . . . . . . . . . . . . . . . . . 2 2 Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 3 Ordering information . . . . . . . . . . . . . . . . . . . . . 3 4 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 5 Limiting values Thermal characteristics . . . . . . . . . . . . . . . . . . 4 7 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 5 8 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 9 9 Packing information . . . . . . . . . . . . . . . . . . . . 11 10 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 11 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 15 12 Legal information ...