BC847BPDXV6T5 ON Semiconductor, BC847BPDXV6T5 Datasheet
BC847BPDXV6T5
Specifications of BC847BPDXV6T5
Related parts for BC847BPDXV6T5
BC847BPDXV6T5 Summary of contents
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... Reel BC847BPDXV6T5 SOT−563 4 mm pitch 8000/Tape & Reel BC847BPDXV6T5G SOT−563 2 mm pitch (Pb−Free) 8000/Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification Brochure, BRD8011/D ...
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... BC847BPDXV6T1, BC847BPDXV6T5 ELECTRICAL CHARACTERISTICS (NPN) Characteristic OFF CHARACTERISTICS Collector −Emitter Breakdown Voltage ( mA) C Collector −Emitter Breakdown Voltage = 10 μ Collector −Base Breakdown Voltage = 10 mA Emitter −Base Breakdown Voltage = 1.0 mA Collector Cutoff Current ( 150°C) ...
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... BC847BPDXV6T1, BC847BPDXV6T5 ELECTRICAL CHARACTERISTICS (PNP) Characteristic OFF CHARACTERISTICS Collector −Emitter Breakdown Voltage (I = −10 mA) C Collector −Emitter Breakdown Voltage = −10 μ Collector −Base Breakdown Voltage = −10 mA Emitter −Base Breakdown Voltage = −1.0 mA Collector Cutoff Current (V = − Collector Cutoff Current (V = − ...
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... BC847BPDXV6T1, BC847BPDXV6T5 2.0 1.5 1.0 0.8 0.6 0.4 0.3 0.2 0.2 0.5 1.0 2.0 5 COLLECTOR CURRENT (mAdc) C Figure 1. Normalized DC Current Gain 2 1.6 1 0.8 0.4 0 0.02 0.1 1 BASE CURRENT (mA) B Figure 3. Collector Saturation Region 10 7 2.0 1.0 0.4 0.6 0.8 1.0 2.0 4.0 6.0 8 REVERSE VOLTAGE (VOLTS) R Figure 5. Capacitances TYPICAL NPN CHARACTERISTICS 1 25°C 0 25° ...
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... BC847BPDXV6T1, BC847BPDXV6T5 TYPICAL PNP CHARACTERISTICS 2 − 25°C A 1.0 0.7 0.5 0.3 0.2 −0.2 −0.5 −1.0 −2.0 −5.0 −10 − COLLECTOR CURRENT (mAdc) C Figure 7. Normalized DC Current Gain −2.0 T −1.6 −1 − −0.8 − − −0.4 0 −0.02 −0.1 −1 BASE CURRENT (mA) B Figure 9 ...
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... BC847BPDXV6T1, BC847BPDXV6T5 INFORMATION FOR USING THE SOT−563 SURFACE MOUNT PACKAGE MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS Surface mount board layout is a critical portion of the total design. The footprint for the semiconductor packages must be the correct size to insure proper solder connection The power dissipation of the SOT− ...
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... BC847BPDXV6T1, BC847BPDXV6T5 PACKAGE DIMENSIONS D A −X− −Y− 0.08 (0.003 SOLDERING FOOTPRINT* 1.35 0.0531 *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. SOT−563, 6 LEAD CASE 463A− ...
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... BC847BPDXV6T1, BC847BPDXV6T5 ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “ ...